Semiconductor device and method for manufacturing the same
First Claim
1. A semiconductor device comprising:
- a substrate;
a first insulating film over the substrate;
a gate electrode over the first insulating film;
a gate insulating film over the gate electrode;
an oxide semiconductor film over the gate insulating film, the oxide semiconductor film comprising a first oxide semiconductor region and a pair of second oxide semiconductor regions;
a source electrode and a drain electrode over the oxide semiconductor film;
a second insulating film over the oxide semiconductor film and between the source electrode and the drain electrode; and
a third insulating film over the source electrode, the oxide semiconductor film, the second insulating film, and the drain electrode,wherein the oxide semiconductor film comprises indium, gallium, and zinc,wherein the first oxide semiconductor region is between the pair of second oxide semiconductor regions,wherein the first oxide semiconductor region comprises a crystalline region comprising c-axis alignment,wherein the second insulating film overlaps with the first oxide semiconductor region,wherein the third insulating film is in contact with each upper surface of the pair of second oxide semiconductor regions,wherein an edge of the gate electrode and edges of the source electrode and the drain electrode overlap with each other, andwherein the edges of the source electrode and the drain electrode and the first oxide semiconductor region do not overlap with each other.
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Accused Products
Abstract
A miniaturized semiconductor device including a transistor in which a channel formation region is formed using an oxide semiconductor film and variation in electric characteristics due to a short-channel effect is suppressed is provided. In addition, a semiconductor device whose on-state current is improved is provided. A semiconductor device is provided with an oxide semiconductor film including a pair of second oxide semiconductor regions which are amorphous regions and a first oxide semiconductor region located between the pair of second oxide semiconductor regions, a gate insulating film, and a gate electrode provided over the first oxide semiconductor region with the gate insulating film interposed therebetween. Hydrogen or a rare gas is added to the second oxide semiconductor regions.
192 Citations
9 Claims
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1. A semiconductor device comprising:
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a substrate; a first insulating film over the substrate; a gate electrode over the first insulating film; a gate insulating film over the gate electrode; an oxide semiconductor film over the gate insulating film, the oxide semiconductor film comprising a first oxide semiconductor region and a pair of second oxide semiconductor regions; a source electrode and a drain electrode over the oxide semiconductor film; a second insulating film over the oxide semiconductor film and between the source electrode and the drain electrode; and a third insulating film over the source electrode, the oxide semiconductor film, the second insulating film, and the drain electrode, wherein the oxide semiconductor film comprises indium, gallium, and zinc, wherein the first oxide semiconductor region is between the pair of second oxide semiconductor regions, wherein the first oxide semiconductor region comprises a crystalline region comprising c-axis alignment, wherein the second insulating film overlaps with the first oxide semiconductor region, wherein the third insulating film is in contact with each upper surface of the pair of second oxide semiconductor regions, wherein an edge of the gate electrode and edges of the source electrode and the drain electrode overlap with each other, and wherein the edges of the source electrode and the drain electrode and the first oxide semiconductor region do not overlap with each other. - View Dependent Claims (2, 3, 4, 5)
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6. A semiconductor device comprising:
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an oxide semiconductor film on an insulating surface, the oxide semiconductor film comprising a first oxide semiconductor region and a pair of second oxide semiconductor regions; a gate electrode adjacent to the oxide semiconductor film; and a source electrode and a drain electrode over the oxide semiconductor film; wherein the oxide semiconductor film comprises indium, gallium, and zinc, wherein the first oxide semiconductor region is between the pair of second oxide semiconductor regions, wherein the first oxide semiconductor region comprises a crystalline region comprising c-axis alignment, wherein an edge of the gate electrode and edges of the source electrode and the drain electrode overlap with each other, and wherein the edges of the source electrode and the drain electrode and the first oxide semiconductor region do not overlap with each other. - View Dependent Claims (7, 8, 9)
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Specification