Light emitting diode and flip-chip light emitting diode package
First Claim
1. A light emitting diode, comprising:
- a substrate;
a first doped layer, disposed on the substrate;
a light emitting layer, disposed on the first doped layer;
a second doped layer, disposed on the light emitting layer;
a plurality of first grooves, penetrating through the second doped layer and the light emitting layer, and thus a partial surface of the first doped layer is exposed;
an insulating layer, disposed over a part of the second doped layer and extending to the sidewalls of the plurality of first grooves;
a first contact, set in the plurality of first grooves and electrically connected to the first doped layer; and
a second contact, set on the second doped layer and electrically connected to the second doped layer;
wherein from a top view of the light emitting diode, one end of at least one of the plurality of first grooves extends to the edge of the first doped layer.
2 Assignments
1 Petition
Accused Products
Abstract
A light emitting diode including a first doped layer, a light emitting layer, a second doped layer and a substrate is provided. A plurality of first grooves penetrate through the second doped layer and the light emitting layer. Thus, a partial surface of the first doped layer is exposed. At least one of the plurality of first grooves extends to edges of the second dope layer and the light emitting layer. An insulating layer is disposed over a part of second doped layer and extends to sidewalls of the first grooves. A first contact is set in the first grooves and electrically connected to the first doped layer. A second contact is set on the second doped layer and electrically connected to the second doped layer. By the first grooves, the first contact can be electrically connected to the first doped layer for improving current spreading.
10 Citations
20 Claims
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1. A light emitting diode, comprising:
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a substrate; a first doped layer, disposed on the substrate; a light emitting layer, disposed on the first doped layer; a second doped layer, disposed on the light emitting layer; a plurality of first grooves, penetrating through the second doped layer and the light emitting layer, and thus a partial surface of the first doped layer is exposed; an insulating layer, disposed over a part of the second doped layer and extending to the sidewalls of the plurality of first grooves; a first contact, set in the plurality of first grooves and electrically connected to the first doped layer; and a second contact, set on the second doped layer and electrically connected to the second doped layer; wherein from a top view of the light emitting diode, one end of at least one of the plurality of first grooves extends to the edge of the first doped layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A flip-chip light emitting diode package, comprising:
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a package substrate; a light emitting diode, flipped on and electrically connected to the package substrate;
the light emitting diode comprising;a substrate; a first doped layer, disposed on the substrate; a light emitting layer, disposed on the first doped layer; a second doped layer, disposed on the light emitting layer; a plurality of first grooves, penetrating through the second doped layer and the light emitting layer, and thus a partial surface of the first doped layer is exposed; an insulating layer, disposed over a part of the second doped layer and extending to the sidewalls of the plurality of first grooves; a first contact, set in the plurality of first grooves and electrically connected to the first doped layer; a second contact, set on the second doped layer and electrically connected to the second doped layer; wherein from a top view of the light emitting diode, one end of at least one of the plurality of first grooves extends to the edge of the first doped layer. - View Dependent Claims (19, 20)
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Specification