MEMS package structure

• US 8,829,628 B2
• Filed: 06/28/2012
• Issued: 09/09/2014
• Est. Priority Date: 08/11/2009
• Status: Active Grant

• Current Assignee: PixArt Imaging Incorporated
• Original Assignee: PixArt Imaging Incorporated
• Inventors: Hsu, Hsin-Hui, Lee, Sheng-Ta, Wang, Chuan-Wei
• Primary Examiner(s): FOURSON III, GEORGE R
• Application Number:
  US13/535,682
• Publication Number:
  US 20120267732A1
• Time in Patent Office: 803 Days
• Field of Search: 438/51, 438/52, 438/53, 438/124, 257/415, 257/704, 257/E21.502, 257/E23.126, 257/E23.128
• US Class Current: 257/415
• CPC Class Codes: B81B 2201/0264 Pressure sensors
• CPC Class Codes: B81B 7/0006 Interconnects
• CPC Class Codes: B81B 7/0058 for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
• CPC Class Codes: B81C 1/00246 Monolithic integration, i.e. micromechanical structure and electronic processing unit are integrated on the same substrate
• CPC Class Codes: B81C 1/00293 maintaining a controlled atmosphere with processes not provided for in B81C1/00285
• CPC Class Codes: B81C 2203/0136 Growing or depositing of a covering layer
• CPC Class Codes: B81C 2203/0145 Hermetically sealing an opening in the lid
• CPC Class Codes: B81C 2203/0714 Forming the micromechanical structure with a CMOS process
• CPC Class Codes: B81C 2203/0735 Post-CMOS, i.e. forming the micromechanical structure after the CMOS circuit

Abstract

A MEMS package structure, including a substrate, an interconnecting structure, an upper metallic layer, a deposition element and a packaging element is provided. The interconnecting structure is disposed on the substrate. The MEMS structure is disposed on the substrate and within a first cavity. The upper metallic layer is disposed above the MEMS structure and the interconnecting structure, so as to form a second cavity located between the upper metallic layer and the interconnecting structure and communicates with the first cavity. The upper metallic layer has at least a first opening located above the interconnecting structure and at least a second opening located above the MEMS structure. Area of the first opening is greater than that of the second opening. The deposition element is disposed above the upper metallic layer to seal the second opening. The packaging element is disposed above the upper metallic layer to seal the first opening.

Claims

1. A MEMS package structure, comprising:

a substrate;

an interconnecting structure disposed on the substrate;

a MEMS structure disposed on the substrate and within a first cavity;

an upper metallic layer disposed above the MEMS structure and the interconnecting structure, so as to form a second cavity between the upper metallic layer and the interconnecting structure, the second cavity communicating with the first cavity, the upper metallic layer having at least a first opening and at least a second opening, the first opening located above the interconnecting structure, the second opening located above the MEMS structure, area of the first opening being greater than that of the second opening;

a deposition element disposed above the upper metallic layer to seal the second opening; and

a packaging element disposed above the upper metallic layer to seal the first opening.

2. The MEMS package structure as claimed in claim 1, wherein the deposition element is a packaging layer located between the upper metallic layer and the packaging element to seal the second opening, and the deposition element is opened above the first opening.

3. The MEMS package structure as claimed in claim 2, further comprising a mask layer disposed between the upper metallic layer and the deposition element, the mask layer having a third opening and a fourth opening, the third opening located above the first opening, the fourth opening located above the MEMS structure.

4. The MEMS package structure as claimed in claim 3, wherein a diameter of the third opening is greater than that of the first opening.

5. The MEMS package structure as claimed in claim 3, wherein the fourth opening and the second opening are staggered with each other.