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Three dimensional integrated circuits

  • US 8,829,664 B2
  • Filed: 07/12/2010
  • Issued: 09/09/2014
  • Est. Priority Date: 07/08/2002
  • Status: Active Grant
First Claim
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1. An integrated circuit comprising:

  • a substrate;

    a first plurality of layers including a first programmable circuit;

    a second plurality of layers including a plurality of programming circuits; and

    a third plurality of layers including a second programmable circuit;

    wherein the first plurality of layers, the second plurality of layers, and the third plurality of layers are formed in a stacked manner, which utilizes a plurality of integrated circuit fabrication masks, on the substrate;

    wherein at least one of the first programmable circuit, the plurality of programming circuits, or the second programmable circuit is electrically coupled to at least one of the first programmable circuit, the plurality of programming circuits, or the second programmable circuit; and

    wherein the first programmable circuit and the second programmable circuit are configured to be programmable by programming signals from the plurality of programming circuits.

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