Attachment features for housings

• US 8,830,665 B2
• Filed: 10/18/2012
• Issued: 09/09/2014
• Est. Priority Date: 01/24/2008
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Lynch, Stephen B., Zadesky, Stephen P., Weber, Douglas J., Filson, John B.
• Primary Examiner(s): Wilson, Adrian S
• Application Number:
  US13/655,310
• Publication Number:
  US 20130107434A1
• Time in Patent Office: 691 Days
• Field of Search: None
• US Class Current: 361/679.02
• CPC Class Codes: B32B 15/043 of metal B32B15/01 takes precedence
• CPC Class Codes: B32B 15/18 comprising iron or steel B32B15/011, B32B15/012 and B32B15/013 take precedence
• CPC Class Codes: B32B 15/20 comprising aluminium or copper B32B15/016 and B32B15/017 take precedence
• CPC Class Codes: B32B 2307/304 Insulating
• CPC Class Codes: B32B 2307/734 Dimensional stability
• CPC Class Codes: B32B 2457/00 Electrical equipment
• CPC Class Codes: B32B 3/08 characterised by added members at particular parts layer formed of separate pieces of material which are juxtaposed side-by-side B32B3/14, B32B3/18
• CPC Class Codes: B32B 3/30 characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs apertured layer B32B3/266; layer with cavities or internal voids B32B3/26
• CPC Class Codes: B32B 7/10 at least one layer having inter-reactive properties
• CPC Class Codes: H05K 5/0086 portable, e.g. battery operated apparatus casings for switching devices H01H9/02
• CPC Class Codes: H05K 5/02 Details
• CPC Class Codes: H05K 7/1401 comprising clamping or extracting means H05K7/10 takes precedence
• CPC Class Codes: Y10T 156/1028 by bending, drawing or stretch forming sheet to assume shape of configured lamina while in contact therewith
• CPC Class Codes: Y10T 156/1041 Subsequent to lamination
• CPC Class Codes: Y10T 29/5313 Means to assemble electrical device
• CPC Class Codes: Y10T 29/53174 Means to fasten electrical component to wiring board, base, or substrate
• CPC Class Codes: Y10T 428/12201 Width or thickness variation or marginal cuts repeating longitudinally
• CPC Class Codes: Y10T 428/12271 having discrete fastener, marginal fastening, taper, or end structure
• CPC Class Codes: Y10T 428/12347 Plural layers discontinuously bonded [e.g., spot-weld, mechanical fastener, etc.]
• CPC Class Codes: Y10T 428/12493 Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]

Abstract

Methods and apparatus for forming a housing, such as for an electronic device, from multi-layer materials are disclosed. The multi-layer materials include at least two layers. Typically, one or more of the layers are metal. However, different layers of the multi-layer materials can be different metals. In one embodiment, an inner layer of the multi-layer materials can be provided with or form internal features that can be for attaching parts or components to the multi-layer materials. In another embodiment, processing of an inner layer of the multi-layer materials can facilitate part formation with increased curvature and/or internal part clearance. In another embodiment, the multi-layer materials can include an intermediate layer that facilitates creation of internal features that can be for attaching parts or components to the multi-layer materials. In still another embodiment, the multi-layer materials can provide a protective layer that serves to protect an outer surface of the housing during manufacturing and/or assembly.

Claims

1. A portable electronic device, comprising:

a multi-layered housing comprising;

an inner layer having at least one attachment feature used to secure a molded piece such that the molded piece is at least partially molded around the at least one attachment feature,

an outer layer having an outer surface corresponding to an exterior surface of the multi-layered housing, and

at least one intermediate layer disposed between the inner layer and the outer layer, the intermediate layer having at least one void region associated with a corresponding attachment feature and that exposes a portion of the outer layer.

2. The portable electronic device of claim 1, wherein an internal surface of the inner layer corresponds to an internal surface of the multi-layered housing.

3. The portable electronic device of claim 1, wherein the molded piece extends at least partially within the void region.

4. The portable electronic device of claim 2, wherein the at least one attachment feature is a manipulated portion of the inner layer proximate the at least one void region.

5. The portable electronic device of claim 4, wherein the manipulated portion is a bent portion of the inner layer.

6. The portable electronic device of claim 1, wherein the at least one void region is a drilled portion of the intermediate layer.

7. The portable electronic device of claim 1, wherein the inner layer and outer layer are comprised of metal.

8. The portable electronic device of claim 1, wherein the inner layer and outer layer are comprised of different materials.

9. The portable electronic device of claim 1, wherein the intermediate layer is configured to protect the outer layer from damage during processing of the portable electronic device.

10. The portable electronic device of claim 1, wherein the intermediate layer is comprised of a material having a higher thermal conductivity than the outer layer.

11. The portable electronic device of claim 1, wherein the intermediate layer is comprised of a material having a lower thermal conductivity than the outer layer.

12. A method of forming a multi-layered housing for an electronic device, the method comprising:

forming an outer layer having an inner surface and an outer surface, the outer surface corresponding to an exterior surface of the housing;

forming an intermediate layer on the inner surface of the outer layer, the intermediate layer having at least one void region associated with an attachment feature and that exposes a portion of the outer layer;

forming an inner layer on the intermediate layer, the inner layer having the attachment feature; and

molding a molded piece at least partially around the attachment feature attaching the molded piece to the multi-layered housing.

13. The method of claim 12, wherein the intermediate layer protects the outer layer from damage during forming of the inner layer.

14. The method of claim 12, further comprising:

forming the attachment feature by manipulating a portion of the inner layer.

15. The method of claim 14, wherein manipulating a portion of the inner layer comprises bending a portion of the inner layer.

16. The method of claim 12, further comprising:

forming the attachment feature by separating a portion of the inner layer from the intermediate layer at the void region.

17. The method of claim 16, wherein the separating comprises drilling a localized region of the intermediate layer.

18. The method of claim 16, wherein the separating comprises etching away a localized region of the intermediate layer.

19. The method of claim 13, wherein forming the inner layer includes laminating the inner layer on a surface of the intermediate layer.

20. The method of claim 12, wherein forming the inner layer comprises a soldering process.

21. A housing for an electronic device, the housing comprising:

an inner layer having at least one internal feature attached to a molded part such that the molded part is at least partially molded around the at least one internal feature

an outer layer having an outer surface corresponding to an exterior surface of the housing; and

at least one intermediate layer disposed between the at least one internal feature and the outer layer, the intermediate layer having a pattern which includes at least one void region that exposes a portion of the outer layer.

22. The housing of claim 21, wherein a molded piece is molded around two or more internal features such that the two or more internal features cooperatively engage with the molded piece to secure the molded piece to the housing.