Ball grid array systems for surface mounting an integrated circuit using a Z-directed printed circuit board component
First Claim
Patent Images
1. A printed circuit board, comprising:
- a Z-directed component mounted in a mounting hole in the printed circuit board, the Z-directed component including;
a body having a top surface, a bottom surface and a side surface, a portion of the body being composed of an insulator; and
four conductive channels extending through a portion of the body along the length of the body, the four conductive channels being spaced substantially equally around a perimeter of the body, a first and a second of the four conductive channels being positioned opposite each other and a third and a fourth of the four conductive channels being positioned opposite each other;
an integrated circuit chip mounted on a surface of the printed circuit board, the integrated circuit chip having a ball grid array that includes four conductive balls electrically connected to a corresponding one of the four conductive channels of the Z-directed component; and
four wire bonds electrically connecting the four conductive balls of the ball grid array to four corresponding contacts on a substrate of the integrated circuit chip,wherein the first and second conductive channels of the Z-directed component are electrically connected to a common ground path of the printed circuit board, the third conductive channel of the Z-directed component is electrically connected to a first voltage supply path of the printed circuit board and the fourth conductive channel of the Z-directed component is electrically connected to a second voltage supply path of the printed circuit board,wherein a first of the four contacts on the substrate of the integrated circuit chip electrically connected to the first conductive channel is positioned next to a third of the four contacts electrically connected to the third conductive channel and a second of the four contacts electrically connected to the second conductive channel is positioned next to a fourth of the four contacts electrically connected to the fourth conductive channel,wherein the four contacts on the substrate of the integrated circuit chip are aligned in a row according to one of;
(1) the third and fourth contacts being positioned next to each other between the first and second contacts and (2) the first and second contacts being positioned next to each other between the third and fourth contacts.
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Accused Products
Abstract
A printed circuit board according to one example embodiment includes a Z-directed component mounted in a mounting hole in the printed circuit board. The Z-directed component includes a body having a top surface, a bottom surface and a side surface. Four conductive channels extend through a portion of the body along the length of the body. The four conductive channels are spaced substantially equally around a perimeter of the body. An integrated circuit is mounted on a surface of the printed circuit board. The integrated circuit has a ball grid array that includes four conductive balls electrically connected to a corresponding one of the four conductive channels of the Z-directed component.
143 Citations
13 Claims
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1. A printed circuit board, comprising:
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a Z-directed component mounted in a mounting hole in the printed circuit board, the Z-directed component including; a body having a top surface, a bottom surface and a side surface, a portion of the body being composed of an insulator; and four conductive channels extending through a portion of the body along the length of the body, the four conductive channels being spaced substantially equally around a perimeter of the body, a first and a second of the four conductive channels being positioned opposite each other and a third and a fourth of the four conductive channels being positioned opposite each other; an integrated circuit chip mounted on a surface of the printed circuit board, the integrated circuit chip having a ball grid array that includes four conductive balls electrically connected to a corresponding one of the four conductive channels of the Z-directed component; and four wire bonds electrically connecting the four conductive balls of the ball grid array to four corresponding contacts on a substrate of the integrated circuit chip, wherein the first and second conductive channels of the Z-directed component are electrically connected to a common ground path of the printed circuit board, the third conductive channel of the Z-directed component is electrically connected to a first voltage supply path of the printed circuit board and the fourth conductive channel of the Z-directed component is electrically connected to a second voltage supply path of the printed circuit board, wherein a first of the four contacts on the substrate of the integrated circuit chip electrically connected to the first conductive channel is positioned next to a third of the four contacts electrically connected to the third conductive channel and a second of the four contacts electrically connected to the second conductive channel is positioned next to a fourth of the four contacts electrically connected to the fourth conductive channel, wherein the four contacts on the substrate of the integrated circuit chip are aligned in a row according to one of;
(1) the third and fourth contacts being positioned next to each other between the first and second contacts and (2) the first and second contacts being positioned next to each other between the third and fourth contacts. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A printed circuit board, comprising:
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a Z-directed capacitor mounted in a mounting hole in the printed circuit board, the Z-directed capacitor including; a body having a top surface, a bottom surface and a side surface, the body including a plurality of stacked layers composed of a dielectric material and having a conductive material plated on a surface thereof; four conductive channels extending through a portion of the body along the length of the body, the four conductive channels being selectively connected to the conductive material plated on the surface of the stacked layers; and an integrated circuit mounted on a surface of the printed circuit board, the integrated circuit having a ball grid array that includes four conductive balls each being electrically connected to a corresponding one of the four conductive channels of the Z-directed component, the integrated circuit having a core region having a first voltage supply path and a ground path and an input/output region having a second voltage supply path and the ground path, the second voltage supply path being configured to transmit a voltage different from a voltage transmitted by the first voltage supply path, wherein a first and a second of the four conductive channels of the Z-directed component are electrically connected to the ground path, a third of the four conductive channels of the Z-directed component is electrically connected to the first voltage supply path and a fourth of the four conductive channels of the Z-directed component is electrically connected to the second voltage supply path. - View Dependent Claims (10, 11, 12, 13)
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Specification