Segmentation for wafer inspection
First Claim
1. A computer-implemented method for segmenting pixels in an image of a wafer for defect detection, comprising:
- determining a statistic for individual pixels based on a characteristic of the individual pixels in an image acquired for a wafer by an inspection system;
assigning the individual pixels to first segments based on the statistic;
detecting one or more edges between the first segments in an image of the first segments;
generating an edge map by projecting the one or more edges across an area corresponding to the image for the wafer; and
assigning the individual pixels to second segments by applying the first segments and the edge map to the image for the wafer thereby segmenting the image, wherein defect detection is performed based on the second segments to which the individual pixels are assigned, and wherein steps of the method are performed by a computer system.
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Abstract
Methods and systems for segmenting pixels for wafer inspection are provided. One method includes determining a statistic for individual pixels based on a characteristic of the individual pixels in an image acquired for a wafer by an inspection system. The method also includes assigning the individual pixels to first segments based on the statistic. In addition, the method includes detecting one or more edges between the first segments in an image of the first segments and generating an edge map by projecting the one or more edges across an area corresponding to the image for the wafer. The method further includes assigning the individual pixels to second segments by applying the first segments and the edge map to the image for the wafer thereby segmenting the image. Defect detection is performed based on the second segments to which the individual pixels are assigned.
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Citations
20 Claims
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1. A computer-implemented method for segmenting pixels in an image of a wafer for defect detection, comprising:
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determining a statistic for individual pixels based on a characteristic of the individual pixels in an image acquired for a wafer by an inspection system; assigning the individual pixels to first segments based on the statistic; detecting one or more edges between the first segments in an image of the first segments; generating an edge map by projecting the one or more edges across an area corresponding to the image for the wafer; and assigning the individual pixels to second segments by applying the first segments and the edge map to the image for the wafer thereby segmenting the image, wherein defect detection is performed based on the second segments to which the individual pixels are assigned, and wherein steps of the method are performed by a computer system. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A non-transitory computer-readable medium storing program instructions executable on a computer system for performing a method for segmenting pixels in an image of a wafer for defect detection, wherein the method comprises:
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determining a statistic for individual pixels based on a characteristic of the individual pixels in an image acquired for a wafer by an inspection system; assigning the individual pixels to first segments based on the statistic; detecting one or more edges between the first segments in an image of the first segments; generating an edge map by projecting the one or more edges across an area corresponding to the image for the wafer; and assigning the individual pixels to second segments by applying the first segments and the edge map to the image for the wafer thereby segmenting the image, wherein defect detection is performed based on the second segments to which the individual pixels are assigned.
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20. A system configured to segment pixels in an image of a wafer for defect detection, comprising:
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an inspection subsystem configured to generate an image for a wafer; and a computer subsystem configured for; determining a statistic for individual pixels based on a characteristic of the individual pixels in the image for the wafer; assigning the individual pixels to first segments based on the statistic; detecting one or more edges between the first segments in an image of the first segments; generating an edge map by projecting the one or more edges across an area corresponding to the image for the wafer; and assigning the individual pixels to second segments by applying the first segments and the edge map to the image for the wafer thereby segmenting the image, wherein defect detection is performed based on the second segments to which the individual pixels are assigned.
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Specification