Method and system for a photonic interposer

• US 8,831,437 B2
• Filed: 03/16/2012
• Issued: 09/09/2014
• Est. Priority Date: 09/04/2009
• Status: Active Grant

• Current Assignee: Cisco Technology, Inc. (Cisco Systems, Inc.)
• Original Assignee: Luxtera Incorporated (Cisco Systems, Inc.)
• Inventors: Dobbelaere, Peter De, Young, Greg, Peterson, Mark
• Primary Examiner(s): SINGH, DALZID E
• Application Number:
  US13/422,776
• Publication Number:
  US 20120177381A1
• Time in Patent Office: 907 Days
• Field of Search: 398/138, 398/139, 398/141, 398/142, 398/164
• US Class Current: 398/164
• CPC Class Codes: G02B 2006/12061 Silicon
• CPC Class Codes: G02B 2006/12142 Modulator
• CPC Class Codes: G02B 6/1225 comprising photonic band-gap structures or photonic lattices
• CPC Class Codes: H01L 21/84 the substrate being other than a semiconductor body, e.g. being an insulating body
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 23/49866 characterised by the materials materials of the substrates H01L23/14, of the lead-frames H01L23/49579
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 27/1203 the substrate comprising an insulating body on a semiconductor body, e.g. SOI three-dimensional layout H01L27/0688
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H04B 10/43 using a single component as both light source and receiver, e.g. using a photoemitter as a photoreceiver
• CPC Class Codes: H04B 10/70 Photonic quantum communication
• CPC Class Codes: H04B 10/801 using optical interconnects, e.g. light coupled isolators, circuit board interconnections

Abstract

Methods and systems for a photonic interposer are disclosed and may include receiving one or more continuous wave (CW) optical signals in a silicon photonic interposer from an external optical source, either from an optical source assembly or from optical fibers coupled to the silicon photonic interposer. The received CW optical signals may be processed based on electrical signals received from the electronics die. The modulated optical signals may be received in the silicon photonic interposer from optical fibers coupled to the silicon photonic interposer. Electrical signals may be generated in the silicon photonic interposer based on the received modulated optical signals, and may then be communicated to the electronics die via copper pillars. Optical signals may be communicated into and/or out of the silicon photonic interposer utilizing grating couplers. The electronics die may comprise one or more of: a processor core, a switch core, or router.

Claims

1. A method for communication, the method comprising:

in an integrated optical communication system comprising one or more complementary metal-oxide semiconductor (CMOS) electronics die coupled to a silicon photonic interposer;

receiving one or more continuous wave (CW) optical signals in said silicon photonic interposer from an optical source external to said silicon photonic interposer;

processing said one or more received CW optical signals based on electrical signals received from said one or more CMOS electronics die;

receiving modulated optical signals in said silicon photonic interposer from one or more optical fibers coupled to said silicon photonic interposer;

generating electrical signals in said silicon photonic interposer based on said received modulated optical signals; and

communicating said generated electrical signals to said one or more CMOS electronics die.

2. The method according to claim 1, comprising communicating said generated electrical signals to said one or more CMOS electronics die via copper pillars.

3. The method according to claim 1, comprising receiving said one or more CW optical signals in said silicon photonic interposer from an optical source assembly coupled to said silicon photonic interposer.

4. The method according to claim 1, comprising receiving said one or more CW optical signals from one or more optical fibers coupled to said silicon photonic interposer.

5. The method according to claim 1, comprising processing said one or more received CW optical signals utilizing one or more optical modulators in said silicon photonic interposer.

6. The method according to claim 5, wherein said one or more optical modulators comprise Mach-Zehnder interferometer modulators.

7. The method according to claim 1, comprising generating said electrical signals in said silicon photonic interposer utilizing one or more photodetectors integrated in said silicon photonic interposer.

8. The method according to claim 1, comprising communicating optical signals into and/or out of said silicon photonic interposer utilizing grating couplers.

9. The method according to claim 1, wherein said one or more electronics die comprise one or more of:

a processor core, a switch core, or router.

10. The method according to claim 1, wherein said integrated optical communication system comprises a plurality of transceivers.

11. A system for communication, the system comprising:

an integrated optical communication system comprising one or more complementary metal-oxide semiconductor (CMOS) electronics die coupled to a silicon photonic interposer, said integrated optical communication system being operable to;

receive one or more continuous wave (CW) optical signals in said silicon photonic interposer from an optical source external to said silicon photonic interposer;

process said one or more received CW optical signals based on electrical signals received from said one or more CMOS electronics die;

receive modulated optical signals in said silicon photonic interposer from one or more optical fibers coupled to said silicon photonic interposer;

generate electrical signals in said silicon photonic interposer based on said received modulated optical signals; and

communicate said generated electrical signals to said one or more CMOS electronics die.

12. The system according to claim 11, wherein said integrated optical communication system is operable to communicate said generated electrical signals to said one or more CMOS electronics die via copper pillars.

13. The system according to claim 11, wherein said hybrid integration optical communication system is operable to receive said one or more CW optical signals in said silicon photonic interposer from an optical source assembly coupled to said silicon photonic interposer.

14. The system according to claim 11, wherein said hybrid integration optical communication system is operable to receive said one or more CW optical signals from one or more optical fibers coupled to said silicon photonic interposer.

15. The system according to claim 11, wherein said hybrid integration optical communication system is operable to process said one or more received CW optical signals utilizing one or more optical modulators in said silicon photonic interposer.

16. The system according to claim 15, wherein said one or more optical modulators comprise Mach-Zehnder interferometer modulators.

17. The system according to claim 11, wherein said hybrid integration optical communication system is operable to generate said electrical signals in said silicon photonic interposer utilizing one or more photodetectors integrated in said silicon photonic interposer.

18. The system according to claim 11, wherein said hybrid integration optical communication system is operable to communicate optical signals into and/or out of said silicon photonic interposer utilizing grating couplers.

19. The system according to claim 11, wherein said one or more electronics die comprise one or more of:

a processor core, a switch core, or router.

20. A system for communication, the system comprising:

an integrated optical communication system comprising one or more complementary metal-oxide semiconductor (CMOS) electronics die coupled to a silicon photonic interposer, said integrated optical communication system being operable to;

receive one or more continuous wave (CW) optical signals in said photonics die from an optical source coupled to said silicon photonic interposer via one or more optical fibers;

process said one or more received CW optical signals based on electrical signals received from said one or more CMOS electronics die;

receive modulated optical signals in said silicon photonic interposer from one or more optical fibers coupled to said silicon photonic interposer;

generate electrical signals in said silicon photonic interposer based on said received modulated optical signals; and

communicate said generated electrical signals to said one or more CMOS electronics die.