Phosphor suspended in silicone, molded/formed and used in a remote phosphor configuration
First Claim
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1. A method for manufacturing a light emitting package, the method comprising:
- securing at least one light emitting chip to a board;
premixing two or more parts of silicone with phosphor material forming a feedstock;
shaping said feedstock within a glass dome remote from the at least one light emitting chip to form a silicone shell;
post-processing said silicone shell with phosphors suspended therein;
disposing said shell and dome over and remote from said light emitting chip;
securing said shell and dome to said board; and
wherein said glass dome is in thermal communication with said silicone shell and said board.
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Abstract
A light emitting package comprising a support hosting at least one light emitting diode. A light transmissive dome comprised of a silicone including a phosphor material positioned to receive light emitted by the diode. A glass cap overlies said dome.
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Citations
13 Claims
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1. A method for manufacturing a light emitting package, the method comprising:
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securing at least one light emitting chip to a board; premixing two or more parts of silicone with phosphor material forming a feedstock; shaping said feedstock within a glass dome remote from the at least one light emitting chip to form a silicone shell; post-processing said silicone shell with phosphors suspended therein; disposing said shell and dome over and remote from said light emitting chip; securing said shell and dome to said board; and wherein said glass dome is in thermal communication with said silicone shell and said board. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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Specification