Phosphor suspended in silicone, molded/formed and used in a remote phosphor configuration

• US 8,835,199 B2
• Filed: 07/21/2011
• Issued: 09/16/2014
• Est. Priority Date: 07/28/2010
• Status: Active Grant

• Current Assignee: Consumer Lighting, LLC (d/b/a GE Lighting) (Savant Systems, LLC)
• Original Assignee: GE Lighting Solutions LLC (Savant Systems, LLC)
• Inventors: Kolodin, Boris, Deshpande, Anirudha R.
• Primary Examiner(s): FOURSON III, GEORGE R
• Application Number:
  US13/187,592
• Publication Number:
  US 20120025216A1
• Time in Patent Office: 1,153 Days
• Field of Search: 438/27, 438/29, 438/116, 257/98, 257/E33.058
• US Class Current: 438/27
• CPC Class Codes: C09K 11/02 Use of particular materials as binders, particle coatings or suspension media therefor
• CPC Class Codes: C09K 11/08 containing inorganic luminescent materials
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/644 in intimate contact or integrated with parts of the device other than the semiconductor body

Abstract

A light emitting package comprising a support hosting at least one light emitting diode. A light transmissive dome comprised of a silicone including a phosphor material positioned to receive light emitted by the diode. A glass cap overlies said dome.

Claims

1. A method for manufacturing a light emitting package, the method comprising:

securing at least one light emitting chip to a board;

premixing two or more parts of silicone with phosphor material forming a feedstock;

shaping said feedstock within a glass dome remote from the at least one light emitting chip to form a silicone shell;

post-processing said silicone shell with phosphors suspended therein;

disposing said shell and dome over and remote from said light emitting chip;

securing said shell and dome to said board; and

wherein said glass dome is in thermal communication with said silicone shell and said board.

2. The method of claim 1 further comprising filling an interior volume between the silicone shell and the board with an encapsulant.

3. The method of claim 1 wherein said securing steps comprise application of a thermally conductive adhesive.

4. The method of claim 1 wherein said silicone shell includes a diameter of greater than about 20 mm.

5. The method of claim 1 wherein said phosphor material comprises a mixture of different phosphors emitting to create a white light blend.

6. The method of claim 1 wherein said securing step employs an adhesive having a thermal conductivity of at least 1 w/m/°

K for securing said shell and dome to said board.

7. The method of claim 1 wherein said silicone comprises a transparent methyl based silicone having a shore A hardness between about 41 and 46, a refractive index greater than about 1.3 and a tensile strength greater than about 5.5 MPa.

8. The method of claim 1 wherein said silicone and said dome are concentrically shaped.

9. The method of claim 1 wherein said silicone includes a thermally conductive filler.

10. The method of claim 9 wherein said filler is selected from Al₂O₃, ITO, AlN and mixtures thereof.

11. The method of claim 9 wherein said filler has an average particle size of about 10 nm.

12. The method of claim 1 comprising at least two light emitting diodes disposed within said dome.

13. The method of claim 1 wherein said post-processing comprises thermal cross-linking.