Connection using conductive vias

• US 8,835,226 B2
• Filed: 02/25/2011
• Issued: 09/16/2014
• Est. Priority Date: 02/25/2011
• Status: Active Grant

• Current Assignee: Qorvo US, Inc. (Qorvo, Inc.)
• Original Assignee: RF Micro Devices Incorporated (Qorvo, Inc.)
• Inventors: Morris, Thomas Scott, Madsen, Ulrik Riis, Leahy, Donald Joseph
• Primary Examiner(s): Wilson, Allan R
• Application Number:
  US13/034,787
• Publication Number:
  US 20120217624A1
• Time in Patent Office: 1,299 Days
• Field of Search: 257/659, 257/660, 257/E23.114, 257/E21.502, 438/121, 438/124
• US Class Current: 438/124
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H05K 1/115 Via connections; Lands around holes or via connections H05K1/112 takes precedence
• CPC Class Codes: H05K 2201/0715 provided by an outer layer of PCB
• CPC Class Codes: H05K 3/301 by means of a mounting structure H05K3/325 takes precedence
• CPC Class Codes: H05K 3/4038 Through-connections; Vertical interconnect access [VIA] connections H05K3/403, H05K3/42 take precedence
• CPC Class Codes: H05K 9/0024 Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base

Abstract

In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a conductive vertical interconnect access structure (vias) associated with each component area to be shielded is then exposed through the body by a cutting, drilling, or similar operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed conductive vias.

Claims

1. A method of manufacturing an electronic module, comprising:

providing a substrate comprising a component portion wherein the component portion includes a component area on a surface of the substrate, a first metallic layer that extends continuously along a periphery of the component portion, a first conductive vertical interconnect access structure (via) attached to the first metallic layer at the periphery of the component portion, wherein the via extends through the substrate;

providing an electronic component on the component area;

providing an overmold over the surface to cover the component area;

forming an opening through at least the overmold that exposes at least a section of the first conductive via; and

applying an electromagnetic shield material over the overmold and within the opening to form an electromagnetic shield over the component area such that the electromagnetic shield is directly attached to at least the section of the first conductive via.

2. The method of claim 1, wherein the first conductive via comprises a conductive bar.

3. The method of claim 1 wherein providing the substrate further comprises forming the first conductive via over the first metallic layer.

4. The method of claim 3, wherein providing the substrate further comprises providing the first conductive via over the first metallic layer such that the first conductive via extends above the surface of the substrate.

5. The method of claim 1, wherein providing the substrate further comprises:

providing the first conductive via within the substrate; and

providing the first metallic layer over the first conductive via and within the substrate.

6. The method of claim 1 wherein forming an opening through at least the overmold that exposes at least the section of the first conductive via includes cutting into the first conductive via.

7. The method of claim 1, further comprising coupling the first conductive via to ground.

8. The method of claim 1, wherein providing the substrate further comprises providing a second metallic layer within the substrate that extends along the periphery of the component portion and is attached to the first conductive via, the second metallic layer being positioned below the first metallic layer such that the first conductive via is positioned between the first and second metallic layers.

9. The method of claim 8, wherein providing the substrate further comprises providing the first and second metallic layers so that the first and second metallic layers substantially surround the periphery of the component portion.

10. The method of claim 9, further comprises:

wherein providing the substrate further comprises providing a first plurality of conductive vias so that the first plurality of conductive vias substantially surround the periphery of the component portion and are attached between the first and second metallic layers, the first plurality of conductive vias including the first conductive via;

wherein forming the opening through at least the overmold comprises exposing at least a section of each of the first plurality of conductive vias which includes at least the section of the first conductive via; and

wherein applying the electromagnetic shield material over the overmold and within the opening comprises forming the electromagnetic shield so that the electromagnetic shield is directly attached to at least the section of each of the first plurality of conductive vias.

11. The method of claim 10, wherein providing the substrate further comprises:

providing a third metallic layer within the substrate below the second metallic layer; and

providing a second plurality of conductive vias that are each attached to the second metallic layer and the third metallic layer, the second plurality of conductive vias substantially surrounding the periphery of the component portion.

12. A method of manufacturing an electronic module, comprising:

providing a substrate comprising a component portion wherein the component portion includes a component area on a surface of the substrate, a first metallic layer that extends along a periphery of the component portion, a first conductive vertical interconnect access structure (via) attached to the first metallic layer at the periphery of the component portion, wherein the via extends through the substrate;

providing an electronic component on the component area;

providing an overmold over the surface to cover the component area;

forming an opening through at least the overmold that exposes at least a section of the first conductive via; and

applying an electromagnetic shield material over the overmold and within the opening to form an electromagnetic shield over the component area such that the electromagnetic shield is directly attached to at least the section of the first conductive via, and

wherein the forming an opening through at least the overmold that exposes at least the section of the first conductive via includes cutting into the first conductive via.