Submounts for semiconductor light emitting devices and methods of forming packaged light emitting devices including dispensed encapsulants
First Claim
1. A packaged light emitting device comprising:
- a substrate having an upper surface;
a solid state light emitting device on the substrate;
a wire connected to the solid state light emitting device;
a transparent dam on the substrate defining a cavity above the solid state light emitting device, wherein the transparent dam is not directly above the solid state light emitting device and encapsulates a portion of the wire; and
an encapsulant within the cavity.
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Accused Products
Abstract
A submount for mounting an LED chip includes a substrate, a die attach pad configured to receive an LED chip on an upper surface of the substrate, a first meniscus control feature on the substrate surrounding the die attach pad and defining a first encapsulant region of the upper surface of the substrate, and a second meniscus control feature on the substrate surrounding the first encapsulant region and defining a second encapsulant region of the upper surface of the substrate. The first and second meniscus control features may be substantially coplanar with the die attach pad. A packaged LED includes a submount as described above and further includes an LED chip on the die attach pad, a first encapsulant on the substrate within the first encapsulant region, and a second encapsulant on the substrate within the second encapsulant region and covering the first encapsulant. Method embodiments are also disclosed.
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Citations
22 Claims
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1. A packaged light emitting device comprising:
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a substrate having an upper surface; a solid state light emitting device on the substrate; a wire connected to the solid state light emitting device; a transparent dam on the substrate defining a cavity above the solid state light emitting device, wherein the transparent dam is not directly above the solid state light emitting device and encapsulates a portion of the wire; and an encapsulant within the cavity. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A packaged light emitting device comprising:
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a substrate having an upper surface; a die attach pad on the upper surface of the substrate, the die attach pad configured to receive a solid state light emitting device; a first meniscus control feature on the substrate, the first meniscus control feature surrounding the die attach pad and configured to limit the flow of a liquid encapsulant material; a second meniscus control feature on the substrate, the second meniscus control feature surrounding the first meniscus control feature and configured to limit the flow of a liquid encapsulant material, wherein the first meniscus control feature and the second meniscus control feature define an encapsulant region of the upper surface of the substrate surrounding the die attach pad; a solid state light emitting device on the die attach pad; a first encapsulant on the substrate within the encapsulant region defined by the first meniscus control feature and the second meniscus control feature, the first encapsulant having a first index of refraction and comprising a wavelength conversion material and defining a cavity above the solid state light emitting device; and a second encapsulant within the cavity, the second encapsulant having a second index of refraction that is different from the first index of refraction.
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15. A packaged light emitting device comprising;
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a substrate having an upper surface; a solid state light emitting device on the substrate; a wire connected to the solid state light emitting device; an encapsulant dam on the substrate comprising a first encapsulant material and defining a cavity above the solid state light emitting device, wherein the encapsulant dam is not directly above the solid state light emitting device and encapsulates a portion of the wire; and a second encapsulant material within the cavity. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22)
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Specification