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Submounts for semiconductor light emitting devices and methods of forming packaged light emitting devices including dispensed encapsulants

  • US 8,835,952 B2
  • Filed: 05/31/2011
  • Issued: 09/16/2014
  • Est. Priority Date: 08/04/2005
  • Status: Active Grant
First Claim
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1. A packaged light emitting device comprising:

  • a substrate having an upper surface;

    a solid state light emitting device on the substrate;

    a wire connected to the solid state light emitting device;

    a transparent dam on the substrate defining a cavity above the solid state light emitting device, wherein the transparent dam is not directly above the solid state light emitting device and encapsulates a portion of the wire; and

    an encapsulant within the cavity.

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