Vertically oriented inductor within interconnect structures and capacitor structure thereof
First Claim
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1. A semiconductor device, comprising:
- a substrate having a surface that is defined by an X axis and a Y axis that is perpendicular to the X axis;
an inductor disposed over the surface of the substrate, the inductor having a coil that is wound at least in part vertically about a Z axis that is perpendicular to the X axis and the Y axis; and
a capacitor disposed over the substrate and adjacent to the inductor.
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Abstract
The present disclosure involves a semiconductor device. The semiconductor device includes a substrate having a horizontal surface. The semiconductor device includes an interconnect structure formed over the horizontal surface of the substrate. The interconnect structure includes an inductor coil that is wound substantially in a vertical plane that is orthogonal to the horizontal surface of the substrate. The interconnect structure includes a capacitor disposed proximate to the inductor coil. The capacitor has an anode component and a cathode component. The inductor coil and the capacitor each include a plurality of horizontally extending elongate members.
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Citations
17 Claims
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1. A semiconductor device, comprising:
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a substrate having a surface that is defined by an X axis and a Y axis that is perpendicular to the X axis; an inductor disposed over the surface of the substrate, the inductor having a coil that is wound at least in part vertically about a Z axis that is perpendicular to the X axis and the Y axis; and a capacitor disposed over the substrate and adjacent to the inductor. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A semiconductor device, comprising:
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a substrate having a horizontal surface; and an interconnect structure formed over the horizontal surface of the substrate, the interconnect structure including; an inductor coil that is wound substantially in a vertical plane that is orthogonal to the horizontal surface of the substrate; and a capacitor disposed proximate to the inductor coil, the capacitor having an anode component and a cathode component; wherein the inductor coil and the capacitor each include a plurality of horizontally extending elongate members. - View Dependent Claims (11, 12, 13, 14, 15)
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16. A semiconductor device, comprising:
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a substrate having a relatively planar surface; an interconnect structure over the relatively planar surface of the substrate, the interconnect structure having a plurality of conductive lines interconnected by a plurality of vias, an inductor formed in the interconnect structure, having a coil winding that at least in part spans a vertical direction that is perpendicular to the relatively planar surface, and a capacitor formed in the interconnect structure, having an anode component that is interdigitated with a cathode component. - View Dependent Claims (17)
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Specification