Vertical mount package and wafer level packaging therefor

• US 8,836,132 B2
• Filed: 04/03/2012
• Issued: 09/16/2014
• Est. Priority Date: 04/03/2012
• Status: Active Grant

• Current Assignee: Analog Devices, Inc.
• Original Assignee: Analog Devices, Inc.
• Inventors: Xue, Xiaojie
• Primary Examiner(s): MENZ, DOUGLAS M
• Application Number:
  US13/438,370
• Publication Number:
  US 20130256896A1
• Time in Patent Office: 896 Days
• Field of Search: 257/773, 438/618
• US Class Current: 257/773
• CPC Class Codes: B81B 2201/0242 Gyroscopes
• CPC Class Codes: B81B 2201/025 Inertial sensors not provided for in B81B2201/0235 - B81B2201/0242
• CPC Class Codes: B81B 2207/095 through the lid
• CPC Class Codes: B81B 2207/096 through the substrate
• CPC Class Codes: B81B 7/0077 Other packages not provided for in groups B81B7/0035 - B81B7/0074
• CPC Class Codes: B81C 1/00325 for reducing stress inside of the package structure
• CPC Class Codes: B81C 1/00333 Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325
• CPC Class Codes: B81C 1/00873 characterised by special arrangements of the devices, allowing an easier separation
• CPC Class Codes: B81C 2203/0118 Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
• CPC Class Codes: H01L 21/50 Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/81 using a bump connector
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/041 the container being a hollow construction having no base used as a mounting for the semiconductor body
• CPC Class Codes: H01L 23/49805 the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 : Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1461 : MEMS

Abstract

Vertical mount packages and methods for making the same are disclosed. A method for manufacturing a vertical mount package includes providing a device substrate with a plurality of device regions on a front surface, and a plurality of through-wafer vias. MEMS devices or integrated circuits are formed or mounted onto the device regions. A capping substrate having recesses is mounted over the device substrate, enclosing the device regions within cavities defined by the recesses. A plurality of aligned through-wafer contacts extend through the capping substrate and the device substrate. The device substrate and capping substrate can be singulated by cutting through the aligned through-wafer contacts, with the severed through-wafer contacts forming vertical mount leads. A vertical mount package includes a device sealed between a device substrate and a capping substrate. At least of the side edges of the package includes exposed conductive elements for vertical mount leads.

Claims

1. A method of manufacturing a chip-scale vertical mount package, the method comprising:

providing a device substrate comprising a front surface including a plurality of device regions, and a rear surface opposite the front surface;

integrally fabricated devices in the device regions on the device substrate;

sealing the devices in the device regions on the device substrate;

dicing the device substrate to form a plurality of packages, wherein each package comprises a plurality of side edges between the front and rear surfaces, at least one of the side edges including exposed conductive elements for vertical mount leads, and wherein each of the plurality of packages includes at least one device region.

2. The method of claim 1, wherein the device substrate is made of glass.

3. The method of claim 1, wherein the devices comprise a plurality of MEMS structures.

4. The method of claim 3, wherein the plurality of MEMS structures comprises at least one of:

motion sensors and gyroscopes.

5. The method of claim 1, wherein the devices include integrated circuits.

6. The method of claim 1, wherein sealing devices comprises covering the device regions with epoxy.

7. The method of claim 1, wherein sealing devices comprises mounting a capping substrate onto the device substrate before dicing.

8. The method of claim 7, wherein the device substrate and the capping substrate each include through-substrate contacts, and wherein the capping substrate is mounted onto the device substrate such that the through-substrate contacts are aligned.

9. The method of claim 7, wherein the capping substrate comprises a plurality of recesses configured such that each diced package includes one recess.

10. The method of claim 7, wherein the capping substrate comprises a plurality of recesses configured such that each diced package includes two or more recesses.

11. The method of claim 7, wherein the capping substrate is made of glass.

12. The method of claim 1, wherein the device substrate comprises a wafer.

13. The method of claim 1, wherein dicing the device substrate comprises cutting through a through-substrate contact.

14. The method of claim 1, further comprising plating the exposed conductive elements after dicing.

15. A method of manufacturing a chip-scale vertical mount package, the method comprising:

providing a device substrate comprising a plurality of through-substrate contacts extending between front and rear surfaces of the device substrate, the substrate having a plurality of devices integrally fabricated into the front surface of the device substrate and sealed thereon; and

dicing the device substrate through at least some of the plurality of through-substrate contacts, each of the severed through-substrate contacts forming a vertical mount lead.

16. The method of claim 15, wherein the device substrate is made of glass.

17. The method of claim 15, wherein the plurality of devices comprises a plurality of MEMS structures.

18. The method of claim 15, wherein the plurality of devices comprises a plurality of integrated circuits.

19. The method of claim 15, wherein at least one of the plurality of devices is arranged in each of a plurality of device regions that are separated during the dicing.

20. The method of claim 15, wherein dicing the device substrate comprises using a wafer saw to cut through at least some of the plurality of through-substrate contacts.

21. A chip-scale vertical mount package comprising:

a device substrate comprising a front surface having at least one device integrally fabricated therein, and a rear surface opposite the front surface;

a capping substrate comprising a front surface and a rear surface opposite the front surface, the capping substrate disposed over the device substrate such that the rear surface of the capping substrate faces the front surface of the device substrate, wherein the at least one device is sealed within a cavity defined by the device substrate and the capping substrate,

a plurality of side edges extending between the front surface of the capping substrate and the rear surface of the device substrate, at least one of the side edges including exposed conductive elements along the device substrate for vertical mount leads.

22. The chip-scale vertical mount package of claim 21, wherein the exposed conductive elements extend from the front surface of the capping substrate to the rear surface of the device substrate.

23. The chip-scale vertical mount package of claim 21, wherein the at least one device comprises a MEMS device.

24. The chip-scale vertical mount package of claim 23, wherein the MEMS device comprises one of a motion sensor and a gyroscope.

25. The chip-scale vertical mount package of claim 21, wherein a majority of the surface of the exposed conductive elements faces a side edge, and wherein a minority of the surface of the exposed conductive elements faces the front surface of the capping substrate or the rear surface of the device substrate.

26. The chip-scale vertical mount package of claim 21, wherein the exposed conductive elements comprise substantially hemicylindrical structures.

27. The chip-scale vertical mount package of claim 21, wherein the front and rear surfaces of the packaging and capping substrates are configured to be substantially parallel to the vertical upon mounting the package.

28. The chip-scale vertical mount package of claim 21, wherein a major surface of the device is configured to be substantially parallel to the vertical upon mounting the package.

29. The chip-scale vertical mount package of claim 21, wherein the device comprises a MEMS device having a movable beam, and wherein the movable beam is configured to be substantially parallel to the vertical upon mounting the package.

35. The chip-scale vertical mount package of claim 21, wherein the device is fabricated from material of the device substrate.

36. The chip-scale vertical mount package of claim 35, wherein the material of the device substrate comprises glass or silicon.

37. The chip-scale vertical mount package of claim 21, wherein the capping substrate comprises a pre-formed cavity.

30. A chip-scale vertical mount package comprising:

a device substrate comprising a front surface and a rear surface opposite the front surface, wherein the device substrate is made of glass or silicon;

at least one device integrally fabricated in the front surface of the substrate and sealed thereon; and

a plurality of side edges extending between the front and rear surfaces of the device substrate, at least one of the side edges including exposed conductive elements along the device substrate for vertical mount leads.

31. The chip-scale vertical mount package of claim 30, wherein the at least one device comprises a MEMS device.

32. The chip-scale vertical mount package of claim 30, wherein the at least one device comprises an integrated circuit device.

33. The chip-scale vertical mount package of claim 30, wherein the front and rear surfaces of the device substrate are configured to be substantially parallel to the vertical upon mounting the package.

34. The chip-scale vertical mount package of claim 30, wherein a majority of the surface of the exposed conductive elements faces a side edge, and wherein a minority of the surface of the exposed conductive elements faces the front or rear surfaces of the device substrate.