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Electronic component and method of manufacturing electronic component

  • US 8,837,149 B2
  • Filed: 11/30/2011
  • Issued: 09/16/2014
  • Est. Priority Date: 02/25/2011
  • Status: Active Grant
First Claim
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1. A method of manufacturing an electronic component comprising:

  • disposing a heat radiation material including a plurality of linear structures of carbon atoms and a filling layer of a thermoplastic resin provided among the plurality of linear structures above a first substrate;

    disposing a blotting paper above the heat radiation material;

    making a heat treatment at a temperature higher than a melting temperature of the thermoplastic resin and absorbing the thermoplastic resin above the plurality of linear structures with the absorption paper;

    removing the blotting paper; and

    adhering the heat radiation material to the first substrate by cooling to solidify the thermoplastic resin.

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