Electronic component and method of manufacturing electronic component
First Claim
1. A method of manufacturing an electronic component comprising:
- disposing a heat radiation material including a plurality of linear structures of carbon atoms and a filling layer of a thermoplastic resin provided among the plurality of linear structures above a first substrate;
disposing a blotting paper above the heat radiation material;
making a heat treatment at a temperature higher than a melting temperature of the thermoplastic resin and absorbing the thermoplastic resin above the plurality of linear structures with the absorption paper;
removing the blotting paper; and
adhering the heat radiation material to the first substrate by cooling to solidify the thermoplastic resin.
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Accused Products
Abstract
A method of manufacturing an electronic component includes disposing a heat radiation material including a plurality of linear structures of carbon atoms and a filling layer of a thermoplastic resin provided among the plurality of linear structures above a first substrate, disposing a blotting paper above the heat radiation material, making a heat treatment at a temperature higher than a melting temperature of the thermoplastic resin and absorbing the thermoplastic resin above the plurality of linear structures with the absorption paper, removing the blotting paper, and adhering the heat radiation material to the first substrate by cooling to solidify the thermoplastic resin.
21 Citations
12 Claims
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1. A method of manufacturing an electronic component comprising:
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disposing a heat radiation material including a plurality of linear structures of carbon atoms and a filling layer of a thermoplastic resin provided among the plurality of linear structures above a first substrate; disposing a blotting paper above the heat radiation material; making a heat treatment at a temperature higher than a melting temperature of the thermoplastic resin and absorbing the thermoplastic resin above the plurality of linear structures with the absorption paper; removing the blotting paper; and adhering the heat radiation material to the first substrate by cooling to solidify the thermoplastic resin. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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Specification