Electronic package structure
First Claim
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1. An electronic package, comprising:
- a substrate;
a coil having a first end and a second end;
a magnetic body encapsulating the coil and positioned over the substrate, wherein the magnetic body has a top surface and a bottom surface;
a first lead, comprising a first portion disposed higher than the bottom surface of the magnetic body and electrically connected to the first end of the coil and a second portion disposed lower than the bottom surface of the magnetic body without contacting the magnetic body and electrically connected to the substrate, wherein the first portion and the second portion of the first lead are integrally formed;
a second lead, comprising a third portion disposed higher than the bottom surface of the magnetic body and electrically connected to the second end of the coil and a fourth portion disposed lower than the bottom surface of the magnetic body without contacting the magnetic body and electrically connected to the substrate, wherein the third portion and the fourth portion of the second lead are integrally formed; and
at least one electronic component, disposed between the magnetic body and the substrate.
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Abstract
An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead frame has a plurality of leads. Each of the leads has a first end and a second end. The first end of at least one of the leads extends to the cavity to electrically connect the first electronic element.
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Citations
15 Claims
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1. An electronic package, comprising:
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a substrate; a coil having a first end and a second end; a magnetic body encapsulating the coil and positioned over the substrate, wherein the magnetic body has a top surface and a bottom surface; a first lead, comprising a first portion disposed higher than the bottom surface of the magnetic body and electrically connected to the first end of the coil and a second portion disposed lower than the bottom surface of the magnetic body without contacting the magnetic body and electrically connected to the substrate, wherein the first portion and the second portion of the first lead are integrally formed; a second lead, comprising a third portion disposed higher than the bottom surface of the magnetic body and electrically connected to the second end of the coil and a fourth portion disposed lower than the bottom surface of the magnetic body without contacting the magnetic body and electrically connected to the substrate, wherein the third portion and the fourth portion of the second lead are integrally formed; and at least one electronic component, disposed between the magnetic body and the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method for manufacturing an electronic package, the method comprising the steps of:
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a. providing a substrate with at least one electronic component thereon, a coil having a first end and a second end, a first lead and a second lead, wherein the first lead comprises a first portion and a second portion, and the second lead comprises a third portion and a fourth portion, wherein the first portion and the second portion of the first lead are integrally formed; and
the third portion and the fourth portion of the second lead are integrally formed;b. electrically connecting the first portion to the first end of the coil and electrically connecting the third portion to the second end of the coil; c. forming a magnetic body to encapsulate the coil, wherein each of the first portion and the third portion is disposed higher than the bottom surface of the magnetic body; and
each of the second portion and the fourth portion is disposed lower than the bottom surface of the magnetic body without contacting the magnetic body; andd. disposing the magnetic body over the substrate and electrically connecting the second portion of the first lead and the fourth portion of the second lead to the substrate, wherein the at least one electronic component is disposed between the magnetic body and the substrate. - View Dependent Claims (12, 13, 14, 15)
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Specification