Electronic package structure

• US 8,837,168 B2
• Filed: 01/31/2013
• Issued: 09/16/2014
• Est. Priority Date: 02/18/2008
• Status: Active Grant

• Current Assignee: Cyntec Co. Ltd. (Delta Electronics Incorporated)
• Original Assignee: Cyntec Co. Ltd. (Delta Electronics Incorporated)
• Inventors: Chen, Da-Jung, Wen, Chau-Chun, Liu, Chun-Tiao
• Primary Examiner(s): Chen, Xiaoliang
• Application Number:
  US13/754,910
• Publication Number:
  US 20130141886A1
• Time in Patent Office: 593 Days
• Field of Search: 361/813, 361/103, 361/528, 257/673, 257/758, 257/784, 336/200, 296/05
• US Class Current: 361/813
• CPC Class Codes: H01F 27/027 specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
• CPC Class Codes: H01F 27/29 Terminals; Tapping arrangements for signal inductances
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/24 solid or gel at the normal operating temperature of the device H01L23/3135 takes precedence
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/30107 Inductance
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H05K 1/18 Printed circuits structurally associated with non-printed electric components H05K1/0201, H05K1/023, H05K1/0243, and H05K1/16 take precedence
• CPC Class Codes: H05K 1/181 : associated with surface mounted components
• CPC Class Codes: H05K 2201/1003 : Non-printed inductor
• CPC Class Codes: H05K 2201/10515 : Stacked components
• CPC Class Codes: H05K 2201/10537 : Attached components
• CPC Class Codes: H05K 2201/10924 : Leads formed from a punched metal foil
• CPC Class Codes: H05K 3/30 : Assembling printed circuits with electric components, e.g. with resistor
• CPC Class Codes: H05K 3/3421 : Leaded components
• CPC Class Codes: H05K 9/00 : Screening of apparatus or components against electric or magnetic fields devices for absorbing radiation from an antenna H01Q17/00
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/49071 : by winding or coiling
• CPC Class Codes: Y10T 29/49146 : with encapsulating, e.g., potting, etc.

Abstract

An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead frame has a plurality of leads. Each of the leads has a first end and a second end. The first end of at least one of the leads extends to the cavity to electrically connect the first electronic element.

Claims

1. An electronic package, comprising:

a substrate;

a coil having a first end and a second end;

a magnetic body encapsulating the coil and positioned over the substrate, wherein the magnetic body has a top surface and a bottom surface;

a first lead, comprising a first portion disposed higher than the bottom surface of the magnetic body and electrically connected to the first end of the coil and a second portion disposed lower than the bottom surface of the magnetic body without contacting the magnetic body and electrically connected to the substrate, wherein the first portion and the second portion of the first lead are integrally formed;

a second lead, comprising a third portion disposed higher than the bottom surface of the magnetic body and electrically connected to the second end of the coil and a fourth portion disposed lower than the bottom surface of the magnetic body without contacting the magnetic body and electrically connected to the substrate, wherein the third portion and the fourth portion of the second lead are integrally formed; and

at least one electronic component, disposed between the magnetic body and the substrate.

2. The electronic package as claimed in claim 1, wherein the first portion of the first lead and the third portion of the second lead are disposed between the top surface and the bottom surface of the magnetic body.

3. The electronic package as claimed in claim 1, wherein the second portion of the first lead and the fourth portion of the second lead are disposed on the substrate.

4. The electronic package as claimed in claim 2, wherein the first lead further comprises a fifth portion connecting the first portion and the second portion, wherein the first portion extends out of a first sidewall of the magnetic body to connect to the fifth portion of the first lead;

and the second lead further comprises a sixth portion connecting the third portion and the fourth portion, wherein the third portion extends out of a second sidewall of the magnetic body to connect to the sixth portion of the second lead, wherein the fifth portion and the sixth portion are exposed outside the magnetic body without contacting the magnetic body.

5. The electronic package as claimed in claim 3, wherein the second portion of the first lead is disposed on the top surface of the substrate, wherein a conductive via is disposed in the substrate to electrically connect the second portion of the first lead to the bottom surface of the substrate.

6. The electronic package as claimed in claim 3, wherein the at least one electronic component is disposed between the first lead and the second lead outside the magnetic body.

7. The electronic package as claimed in claim 2, further comprising an insulating encapsulant encapsulating the electronic component and disposed under the magnetic body.

8. The electronic package as claimed in claim 4, wherein the first portion and the second portion are disposed in parallel and the fifth portion of the first lead is substantially perpendicular to the first portion and the second portion;

and the third portion and the fourth portion are disposed in parallel and the sixth portion of the second lead is substantially perpendicular to the third portion and the fourth portion.

9. The electronic package as claimed in claim 1, wherein the electronic component comprises at least one of a capacitor, a resistor, an inductor, a metal-oxide-semiconductor field effect transistor (MOSFET), an insulated gate bipolar transistor (IGBT) and a diode.

10. The electronic package as claimed in claim 1, further comprising an electromagnetic-interference (EMI) shielding element disposed between the coil and the electronic component.

11. A method for manufacturing an electronic package, the method comprising the steps of:

a. providing a substrate with at least one electronic component thereon, a coil having a first end and a second end, a first lead and a second lead, wherein the first lead comprises a first portion and a second portion, and the second lead comprises a third portion and a fourth portion, wherein the first portion and the second portion of the first lead are integrally formed; and

the third portion and the fourth portion of the second lead are integrally formed;

b. electrically connecting the first portion to the first end of the coil and electrically connecting the third portion to the second end of the coil;

c. forming a magnetic body to encapsulate the coil, wherein each of the first portion and the third portion is disposed higher than the bottom surface of the magnetic body; and

each of the second portion and the fourth portion is disposed lower than the bottom surface of the magnetic body without contacting the magnetic body; and

d. disposing the magnetic body over the substrate and electrically connecting the second portion of the first lead and the fourth portion of the second lead to the substrate, wherein the at least one electronic component is disposed between the magnetic body and the substrate.

12. The method as claimed in claim 11, wherein the first portion and the third portion are disposed between the top surface and the bottom surface of the magnetic body.

13. The method as claimed in claim 11, wherein the second portion and the fourth portion are disposed on the substrate.

14. The method as claimed in claim 12, wherein the first lead further comprises a fifth portion connecting the first portion and the second portion, wherein the first portion extends out of a first sidewall of the magnetic body to connect to the fifth portion of the first lead;

and the second lead further comprises a sixth portion connecting the third portion and the fourth portion, wherein the third portion extends out of a second sidewall of the magnetic body to connect to the sixth portion of the second lead, wherein the fifth portion and the sixth portion are exposed outside the magnetic body without contacting the magnetic body.

15. The method as claimed in claim 11, further comprising forming an insulating encapsulant under the magnetic body to encapsulate the electronic component.