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Self-aligned double patterning via enclosure design

  • US 8,839,168 B2
  • Filed: 01/22/2013
  • Issued: 09/16/2014
  • Est. Priority Date: 01/22/2013
  • Status: Active Grant
First Claim
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1. A method for computing via enclosure rules, comprising:

  • identifying, by at least one computing device, line termination modes in a self-aligned double patterning line pattern comprising a plurality of lines and vias;

    assigning, by the at least one computing device, a first via enclosure rule in response to identifying a line termination mode of inner vertex block mask, wherein the inner vertex block mask comprises at least one vertex that has an outer angle that is less than 180 degrees; and

    assigning, by the at least one computing device, a second via enclosure rule in response to identifying a line termination mode of outer vertex block mask, wherein the outer vertex block mask consists of vertices that have an outer angle that is greater than 180 degrees.

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