Reusable substrates for electronic device fabrication and methods thereof
First Claim
1. A method for using a reusable substrate made of a first material with a plurality of grooves for electronic device fabrication, said method comprising:
- preparing a reusable substrate including a top planar surface, the top planar surface being divided by a plurality of grooves into a plurality of planar regions, the plurality of planar regions including a plurality of planar bottom surfaces parallel to the top planar surface;
forming a first epitaxial layer made of a second material on the plurality of planar regions, the first epitaxial layer being in direct contact with the top planar surface;
separating the first epitaxial layer from each of the plurality of planar regions, the first epitaxial layer being separated directly from the top planar surface; and
after the first epitaxial layer is separated from each of the plurality of planar regions, forming a second epitaxial layer made of a third material on the plurality of planar regions, the second epitaxial layer being in direct contact with the top planar surface.
1 Assignment
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Accused Products
Abstract
Substrates for electronic device fabrication and methods thereof. A reusable substrate with at least a plurality of grooves for electronic device fabrication includes a substrate body made of one or more substrate materials and including a top planar surface, the top planar surface being divided into a plurality of planer regions by the plurality of grooves, the plurality of grooves including a plurality of bottom planar surfaces. Each of the plurality of grooves includes a bottom planar surface and two side surfaces, the bottom planar surface being selected from the plurality of bottom planar surfaces, the two side surfaces being in contact with the top surface and the bottom surface. The bottom planar surface is associated with a groove width from one of the two side surfaces to the other of the two side surfaces, the groove width ranging from 0.1 μm to 5 mm.
18 Citations
14 Claims
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1. A method for using a reusable substrate made of a first material with a plurality of grooves for electronic device fabrication, said method comprising:
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preparing a reusable substrate including a top planar surface, the top planar surface being divided by a plurality of grooves into a plurality of planar regions, the plurality of planar regions including a plurality of planar bottom surfaces parallel to the top planar surface; forming a first epitaxial layer made of a second material on the plurality of planar regions, the first epitaxial layer being in direct contact with the top planar surface; separating the first epitaxial layer from each of the plurality of planar regions, the first epitaxial layer being separated directly from the top planar surface; and after the first epitaxial layer is separated from each of the plurality of planar regions, forming a second epitaxial layer made of a third material on the plurality of planar regions, the second epitaxial layer being in direct contact with the top planar surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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Specification