Gallium nitride based semiconductor light-emitting element, light source, and method for forming unevenness structure

• US 8,841,220 B2
• Filed: 05/13/2013
• Issued: 09/23/2014
• Est. Priority Date: 06/24/2011
• Status: Expired due to Fees

• Current Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Original Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Inventors: Fujikane, Masaki, Inoue, Akira, Yokogawa, Toshiya
• Primary Examiner(s): Coleman, William D
• Application Number:
  US13/892,637
• Publication Number:
  US 20130248877A1
• Time in Patent Office: 498 Days
• Field of Search: 438/718
• US Class Current: 438/718
• CPC Class Codes: H01L 2224/14 of a plurality of bump connectors
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/16 with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous
• CPC Class Codes: H01L 33/22 Roughened surfaces, e.g. at the interface between epitaxial layers
• CPC Class Codes: H01L 33/32 containing nitrogen
• CPC Class Codes: H01L 33/42 Transparent materials
• CPC Class Codes: H01L 33/58 Optical field-shaping elements

Abstract

The light extraction surface of a nitride semiconductor light-emitting element, including a crystal plane other than a c plane, is subjected to a surface modification process to control its wettability, and then covered with a layer of fine particles. By etching that layer of fine particles after that, an unevenness structure, in which roughness curve elements have an average length (RSm) of 150 nm to 800 nm, is formed on the light extraction surface.

Claims

1. A method for forming an unevenness structure, the method comprising the steps of:

(S0) providing a gallium nitride based semiconductor, of which the surface is a crystal plane other than a c plane;

(S1) covering the surface of the gallium nitride based semiconductor with a colloidal crystal layer composed of colloidal particles which are arranged periodically, after the step (S0) has been performed; and

(S2) etching the surface of the gallium nitride based semiconductor using the colloidal crystal layer as a mask to form the unevenness structure corresponding to an arrangement pattern of the colloidal particles that form the colloidal crystal layer on the surface of the gallium nitride based semiconductor, after the step (S1) has been performed.

2. The method of claim 1, the method further comprising:

a step of exposing the surface of the gallium nitride based semiconductor to an oxygen plasma atmosphere between the step (S0) and the step (S1).

3. The method of claim 1, wherein

the colloidal particles are arranged in a period that is approximately as long as a wavelength of visible radiation.

4. The method of claim 1, wherein

the colloidal particles are arranged by a self-organizing process in the step (S1).

5. The method of claim 1, wherein

roughness curve elements of the unevenness structure have an average length (RSm) of 150 nm to 800 nm.

6. The method of claim 1, wherein the step (S1) includes the steps of:

(S1A) dipping the gallium nitride based semiconductor in a solution including the particles; and

(S1B) pulling up the gallium nitride based semiconductor from the solution after the step (S1A) has been performed.

7. The method of claim 1, wherein

each nanoparticle has a size of 10⁻

9 to 10<sup>−

6</sup> m.

8. The method of claim 1, wherein

the surface of the gallium nitride based semiconductor is an m-plane.

9. The method of claim 1, wherein

the colloidal particles are made of at least one selected from the group consisting of SiO₂, TiO₂, ZnO, Au, Ag, polystyrene, a benzoguanamine-melamine-formaldehyde condensate and cross-linked polymethylmethacrylate.

10. The method of claim 1, wherein

a plurality of projections are formed at random on the surface of the gallium nitride based semiconductor when viewed in a cross-sectional view, after the step (S2) has been performed.

11. The method of claim 6, wherein

the solution in the step (S1A) is hydrophilic.

12. The method of claim 6, wherein a solvent of the solution is at least one selected from the group consisting of water, methanol, ethanol, phenol, ethylene glycol, and acetic acid.