Liquid crystal display device and semiconductor device
First Claim
Patent Images
1. A semiconductor device comprising:
- a first electrode over a substrate;
a gate wiring over the substrate;
a wiring over the first electrode;
a first insulating film over the first electrode, the gate wiring, and the wiring;
a semiconductor film over the first insulating film;
a second electrode and a third electrode over the semiconductor film;
a second insulating film over the second electrode and the third electrode;
a conductive film over the second insulating film;
a fourth electrode over the second insulating film and comprising a first opening pattern and a second opening pattern;
an alignment film over the fourth electrode and the conductive film; and
a liquid crystal over the alignment film,wherein the gate wiring and the wiring are arranged in parallel,wherein the wiring overlaps with the first electrode,wherein the fourth electrode is in direct contact with the third electrode through a contact hole,wherein the conductive film is electrically connected to the wiring and the first electrode,wherein the conductive film is in direct contact with the wiring,wherein the first opening pattern is different from the second opening pattern in a direction, andwherein the contact hole does not overlap with the wiring.
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Abstract
By increasing an interval between electrodes which drives liquid crystals, a gradient of an electric field applied between the electrodes can be controlled and an optimal electric field can be applied between the electrodes. The invention includes a first electrode formed over a substrate, an insulating film formed over the substrate and the first electrode, a thin film transistor including a semiconductor film in which a source, a channel region, and a drain are formed over the insulating film, a second electrode located over the semiconductor film and the first electrode and including first opening patterns, and liquid crystals provided over the second electrode.
170 Citations
27 Claims
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1. A semiconductor device comprising:
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a first electrode over a substrate; a gate wiring over the substrate; a wiring over the first electrode; a first insulating film over the first electrode, the gate wiring, and the wiring; a semiconductor film over the first insulating film; a second electrode and a third electrode over the semiconductor film; a second insulating film over the second electrode and the third electrode; a conductive film over the second insulating film; a fourth electrode over the second insulating film and comprising a first opening pattern and a second opening pattern; an alignment film over the fourth electrode and the conductive film; and a liquid crystal over the alignment film, wherein the gate wiring and the wiring are arranged in parallel, wherein the wiring overlaps with the first electrode, wherein the fourth electrode is in direct contact with the third electrode through a contact hole, wherein the conductive film is electrically connected to the wiring and the first electrode, wherein the conductive film is in direct contact with the wiring, wherein the first opening pattern is different from the second opening pattern in a direction, and wherein the contact hole does not overlap with the wiring. - View Dependent Claims (2, 3, 4, 5)
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6. A semiconductor device comprising:
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a first electrode over a substrate; a gate wiring over the substrate; a wiring over the first electrode; a first insulating film over the first electrode, the gate wiring, and the wiring; a semiconductor film over the first insulating film; a second electrode and a third electrode over the semiconductor film; a second insulating film over the second electrode and the third electrode; a conductive film over the second insulating film; a fourth electrode over the second insulating film and comprising a first opening pattern and a second opening pattern; an alignment film over the fourth electrode and the conductive film; and a liquid crystal over the alignment film, wherein the gate wiring and the wiring are arranged in parallel, wherein the wiring overlaps with the first electrode, wherein the fourth electrode is in direct contact with the third electrode through a contact hole, wherein the conductive film is electrically connected to the wiring and the first electrode, wherein the conductive film is in direct contact with the wiring, wherein the first opening pattern is different from the second opening pattern in a direction, wherein the contact hole does not overlap with the wiring, and wherein the fourth electrode consists of a plurality of edges that each are independently parallel or perpendicular to the gate wiring. - View Dependent Claims (7, 8, 9, 10)
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11. A semiconductor device comprising:
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a substrate; a common electrode over the substrate; a first insulating film over the common electrode; a second insulating film over the first insulating film; a pixel electrode over the second insulating film, wherein the pixel electrode comprises a first opening pattern and a second opening pattern; a wiring over the common electrode; a conductive film over the second insulating film; an alignment film over the conductive film and the pixel electrode; a liquid crystal over the alignment film; and a transistor comprising a gate wiring over the substrate, wherein the transistor is electrically connected to the pixel electrode through a contact hole, wherein the gate wiring and the wiring are arranged in parallel, wherein the wiring overlaps with the common electrode, wherein the conductive film is electrically connected to the wiring and the common electrode, wherein the conductive film is in direct contact with the wiring, wherein the first opening pattern is different from the second opening pattern in a direction, and wherein the contact hole does not overlap with the wiring. - View Dependent Claims (12, 13, 14, 15, 16, 17)
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18. A semiconductor device comprising:
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a first electrode over a substrate; a gate wiring over the substrate; a wiring over the first electrode; a first insulating film over the first electrode, the gate wiring, and the wiring; a semiconductor film over the first insulating film; a second electrode and a third electrode over the semiconductor film; a second insulating film over the second electrode and the third electrode; a conductive film over the second insulating film; a fourth electrode over the second insulating film and comprising a first opening pattern and a second opening pattern; an alignment film over the fourth electrode and the conductive film; and a liquid crystal over the alignment film, wherein the gate wiring and the wiring are arranged in parallel, wherein the wiring overlaps with the first electrode, wherein the fourth electrode is in direct contact with the third electrode through a first contact hole, wherein the conductive film is electrically connected to the wiring and the first electrode, wherein the conductive film is in direct contact with the wiring through a second contact hole, wherein the first opening pattern is different from the second opening pattern in a direction, wherein the first contact hole does not overlap with the wiring, and wherein the second contact hole overlaps with the first electrode. - View Dependent Claims (19, 20, 21, 22)
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23. A semiconductor device comprising:
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a first electrode over a substrate; a gate wiring over the substrate; a wiring over the first electrode; a first insulating film over the first electrode, the gate wiring, and the wiring; a semiconductor film over the first insulating film; a second electrode and a third electrode over the semiconductor film; a second insulating film over the second electrode and the third electrode; a conductive film over the second insulating film; a fourth electrode over the second insulating film and comprising a first opening pattern and a second opening pattern; an alignment film over the fourth electrode and the conductive film; and a liquid crystal over the alignment film, wherein the gate wiring and the wiring are arranged in parallel, wherein the wiring overlaps with the first electrode, wherein the fourth electrode is in direct contact with the third electrode through a first contact hole, wherein the conductive film is electrically connected to the wiring and the first electrode, wherein the conductive film is in direct contact with the wiring through a second contact hole, wherein the first opening pattern is different from the second opening pattern in a direction, wherein the first contact hole does not overlap with the wiring, wherein the second contact hole overlaps with the first electrode, and wherein the fourth electrode consists of a plurality of edges each are independently parallel or perpendicular to the gate wiring. - View Dependent Claims (24, 25, 26, 27)
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Specification