Optoelectronic semiconductor chip

• US 8,841,685 B2
• Filed: 06/29/2009
• Issued: 09/23/2014
• Est. Priority Date: 07/28/2008
• Status: Expired due to Fees

• Current Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Original Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Inventors: Hoeppel, Lutz, Sabathil, Matthias
• Primary Examiner(s): Page, Dale E
• Application Number:
  US13/056,589
• Publication Number:
  US 20110284893A1
• Time in Patent Office: 1,912 Days
• Field of Search: 257/98, 257/E33.068
• US Class Current: 257/98
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/387 with a plurality of electrode regions in direct contact with the semiconductor body and being electrically interconnected by another electrode layer
• CPC Class Codes: H01L 33/405 Reflective materials
• CPC Class Codes: H01L 33/42 Transparent materials

Abstract

A description is given of an optoelectronic semiconductor chip (1) comprising a semiconductor layer sequence (2), which has an active zone (4) for generating electromagnetic radiation, and comprising a structured current spreading layer (6), which contains a transparent conductive oxide and is arranged on a main area (12) of the semiconductor layer sequence (2), wherein the current spreading layer (6) covers at least 30% and at most 60% of the main area (12).

Claims

1. An optoelectronic semiconductor chip comprising:

a semiconductor layer sequence, which comprises an active zone for generating electromagnetic radiation;

a structured current spreading layer, which contains a transparent conductive oxide and is arranged on a main area of the semiconductor layer sequence, wherein the current spreading layer covers at least 30% and at most 60% of the main area and comprises interspaces, at which the main area is not covered by the current spreading layer;

a mirror comprising a dielectric layer, the current spreading layer being arranged between the semiconductor layer sequence and the mirror, wherein the interspaces of the current spreading layer are filled by the dielectric layer of the mirror; and

at least one electrical contact web, the current spreading layer being connected to the electrical contact web at one contact location, wherein the electrical contact web extends in an opening of the dielectric layer of the mirror.

2. The optoelectronic semiconductor chip according to claim 1, wherein the current spreading layer covers 40% to 50% of the main area.

3. The optoelectronic semiconductor chip according to claim 1, wherein the generated radiation has an emission wavelength of between 400 nm and 450 nm.

4. The optoelectronic semiconductor chip according to claim 1, wherein the semiconductor layer sequence contains Al_nGa_mIn_1-n-mN, where 0≦

n≦

1, 0≦

m≦

1, and n+m≦

1.

5. The optoelectronic semiconductor chip according to claim 1, wherein the current spreading layer contains indium tin oxide, indium zinc oxide or zinc oxide.

6. The optoelectronic semiconductor chip according to claim 1, wherein the current spreading layer has a thickness of between 10 nm and 60 nm.

7. The optoelectronic semiconductor chip according to claim 1, wherein the current spreading layer has the form of a rectangular grid.

8. The optoelectronic semiconductor chip according to claim 1, wherein the mirror comprises a continuous metal layer which covers the dielectric layer on a side of the dielectric layer remote from the current spreading layer.

9. The optoelectronic semiconductor chip according to claim 1, further comprising a carrier substrate, wherein the current spreading layer is arranged between the semiconductor layer sequence and the carrier substrate.

10. The optoelectronic semiconductor chip according to claim 1 further comprising a carrier substrate, wherein the current spreading layer is arranged between the semiconductor layer sequence and the carrier substrate, wherein the current spreading layer is electrically connected to the carrier substrate by the electrical contact web.

11. The optoelectronic semiconductor chip according to claim 1, wherein the semiconductor layer sequence is p-conducting on the side of the current spreading layer.

12. The optoelectronic semiconductor chip according to claim 1, wherein the current spreading layer is connected to a metal contact web, at at least one contact location.

13. The optoelectronic semiconductor chip according to claim 1, wherein the current spreading layer is connected to an electrical contact web at at least one grid point.

14. The optoelectronic semiconductor chip according to claim 1, wherein at least 2% and not more than 4% of the main area is covered by the at least one electrical contact web.