Light emitting device and method for manufacturing the same

• US 8,841,838 B2
• Filed: 03/05/2013
• Issued: 09/23/2014
• Est. Priority Date: 03/15/2007
• Status: Active Grant

• Current Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Konishi, Masahiro, Agatani, Makoto, Hata, Toshio
• Primary Examiner(s): Mai, Anh
• Assistant Examiner(s): Lee, Brenitra M
• Application Number:
  US13/786,393
• Publication Number:
  US 20130181250A1
• Time in Patent Office: 567 Days
• Field of Search: 313500-506, 313/512, 257 98-100, 445 23- 25, 362/538
• US Class Current: 313/505
• CPC Class Codes: F21K 9/20 Light sources comprising attachment means
• CPC Class Codes: F21K 9/232 specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• CPC Class Codes: F21V 23/002 Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/45169 Platinum (Pt) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01068 Erbium [Er]
• CPC Class Codes: H01L 2924/01087 : Francium [Fr]
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01L 33/32 : containing nitrogen
• CPC Class Codes: H01L 33/36 : characterised by the electrodes
• CPC Class Codes: H01L 33/38 : with a particular shape
• CPC Class Codes: H01L 33/502 : Wavelength conversion materials
• CPC Class Codes: H01L 33/56 : Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/60 : Reflective elements
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/641 : characterized by the materials

Abstract

By using a light emitting device including an insulating substrate and a light emitting unit formed on the insulating substrate, the light emitting unit including: a plurality of linear wiring patterns disposed on the insulating substrate in parallel with one another, a plurality of light emitting elements that are mounted between the wiring patterns while being electrically connected to the wiring patterns, and a sealing member for sealing the light emitting elements, as well as a method for manufacturing thereof, it becomes possible to provide a light emitting device that achieves sufficient electrical insulation and has simple manufacturing processes so that it can be manufactured at a low cost, and a method for manufacturing the same.

Claims

1. A light emitting device comprising:

a substrate;

a light emitting unit formed on a top surface of the substrate;

a peripheral area of the top surface of substrate surrounding the light emitting unit;

a positive electrode externally connecting land and a negative electrode externally connecting land provided on the top surface of the substrate in the peripheral area so as to be away from an edge of the substrate; and

wiring patterns including a cathode wiring pattern and an anode wiring pattern disposed on the top surface of the substrate,

wherein the light emitting unit includes a plurality of light emitting elements mounted on the substrate, and a sealing member for sealing the light emitting elements,

the positive electrode externally connecting land and the negative electrode externally connecting land are connected to the anode wiring pattern and the cathode wiring pattern, respectively,

the peripheral area is not covered by the sealing member and completely surrounds the light emitting unit in plan view of the substrate, and

the light emitting unit and the positive and negative electrode externally connecting lands are disposed on the top surface of the substrate, and the positive and negative electrode externally connecting lands are confined to the top surface.

2. The light emitting device of claim 1, wherein a through hole penetrating the substrate is formed in the peripheral area.

3. The light emitting device of claim 1, wherein all of the light emitting elements are sealed by a single sealing member, and the positive electrode externally connecting land is opposite to the negative electrode externally connecting land with respect to the light emitting unit disposed therebetween.

8. The light emitting device of claim 1, wherein the substrate includes a polarity indicator disposed on the peripheral area and adjacent to at least one of the positive and negative electrode externally connecting lands.

9. The light emitting device of claim 8, wherein the polarity indicator includes a positive polarity mark.

10. The light emitting device of claim 9, wherein the polarity indicator further includes a negative polarity mark.

11. The light emitting device of claim 8, wherein the polarity indicator includes a negative polarity mark.

12. The light emitting device of claim 1, wherein the substrate has a thickness of about 1 mm.

13. The light emitting device of claim 1, wherein a hole having a cut-out shape and penetrating the substrate is formed in the peripheral area.

4. A light emitting device comprising:

a substrate; and

a light emitting unit comprising a light emitting element mounted on a top surface of the substrate and a resin seal covering the light emitting element;

a peripheral area completely surrounding the light emitting unit on the top surface of the substrate;

a positive electrode externally connecting land and a negative electrode externally connecting land in the peripheral area; and

one of a through hole penetrating the substrate and a hole having a cut-out shape and penetrating the substrate in the peripheral area,

wherein one of the through hole and the hole having a cut-out shape is configured to engage one of a screw and a jig for mechanical fixation, or configured to pass through a wire connected to one of the positive electrode externally connecting land and the negative electrode externally connecting land.

5. The light emitting device of claim 4, wherein the one of the through hole and the hole having the cut-out shape is opposite to another one of a through hole and a hole having a cut-out shape, with the light emitting unit disposed therebetween.

6. The light emitting device of claim 5, wherein the substrate is shaped as one of a hexagon, a rectangle and a square, and there is one of a plurality of through holes and a plurality of holes having a cut-out shape on a diagonal line of the substrate.

7. The light emitting device of claim 5, wherein the substrate is round, and there is one of a plurality of through holes and a plurality of holes having a cut-out shape on a straight line passing through a center of the substrate.