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Substrate damage prevention system and method

  • US 8,845,810 B2
  • Filed: 10/18/2007
  • Issued: 09/30/2014
  • Est. Priority Date: 12/11/2006
  • Status: Expired due to Fees
First Claim
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1. A substrate handling device, comprising:

  • an electrode positioned in a chamber and configured to receive a substrate for processing, the electrode comprising;

    a base layer;

    an insulation layer provided on the base layer;

    a cooling layer provided on the insulation layer; and

    a lower electrode portion provided on the cooling layer;

    a gas passage panel positioned on a top surface of the electrode, a top surface of the gas passage panel having a groove pattern formed therein, facing a bottom surface of a substrate received on the electrode;

    a plurality of lift pins that penetrate through the electrode such that upper ends of the plurality of lift pins are configured to contact the bottom surface of the substrate so as to support the substrate thereon, wherein the bottom surface of the substrate contacts only the upper ends of the plurality of lift pins;

    an inert gas supplier to selectively supply an inert gas to a gap formed between the groove pattern formed on the gas passage panel and the bottom surface of the substrate positioned only on the upper ends of the plurality of lift pins, wherein the gap is sealed by a chucking operation; and

    an air supplier to selectively supply air to the sealed gap formed during chucking between the gas passage panel and the bottom surface of the substrate, wherein the air supplied to the gap during a de-chucking operation applies a predetermined air pressure to the substrate to exert a force against the substrate for releasing the seal formed during the chucking operation and separating the substrate from the lower electrode.

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