Integrated die-level cameras and methods of manufacturing the same

• US 8,846,435 B2
• Filed: 04/08/2014
• Issued: 09/30/2014
• Est. Priority Date: 10/26/2011
• Status: Active Grant

• Current Assignee: Omnivision Technologies Incorporated (Will Semiconductor Co., Ltd. Shanghai)
• Original Assignee: Omnivision Technologies Incorporated (Will Semiconductor Co., Ltd. Shanghai)
• Inventors: Gallagher, Dennis, Greengard, Adam Douglas, Silveira, Paulo E. X., Linnen, Chris, Chumanchenko, Vlad V., Aldinger, Jungwon
• Primary Examiner(s): MENZ, DOUGLAS M
• Application Number:
  US14/248,121
• Publication Number:
  US 20140220725A1
• Time in Patent Office: 175 Days
• Field of Search: 438/69, 438/71, 348/302
• US Class Current: 438/71
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14687 Wafer level processing
• CPC Class Codes: H04N 23/55 Optical parts specially adapted for electronic image sensors; Mounting thereof

Abstract

An integrated die-level camera system and method of making the camera system include a first die-level camera formed at least partially in a die. A second die level camera is also formed at least partially in the die. Baffling is formed to block stray light between the first and second die-level cameras.

Claims

1. A method of fabricating a die-level camera system, comprising:

forming a first die-level camera at least partially in a die, the first die-level camera comprising a first plurality of lens elements;

forming a second die-level camera at least partially in the die, the second die-level camera comprising a second plurality of lens elements;

forming a lens element of the first die-level camera and a lens element of the second die-level camera in a wafer; and

,

blocking stray light between the first and second die-level cameras;

wherein a larger lens of one of the first and second die-level cameras is segmented to provide space for a lens of the other of the first and second die-level cameras.

2. The method of claim 1, further comprising:

forming a first sensor of the first die-level camera and a second sensor of the second die-level camera in a wafer.

3. The method of claim 1, wherein blocking stray light comprises forming baffling.

4. The method of claim 1, further comprising forming at least one of a first aperture stop of the first die-level camera and a second aperture stop of the second die-level camera.

5. The method of claim 1, wherein the lens elements of the first and second die-level cameras are formed by a common master at the same time.

6. The method of claim 1, further comprising separating the die from a stack of wafers after forming the first and second die-level cameras.

7. A method of fabricating a mobile imaging device, comprising:

forming a plurality of die-level cameras in a common die, at least a first one of the die-level cameras having a first set of performance characteristics and at least a second one of the die-level cameras having a second set of performance characteristics that is different from the first set of performance characteristics; and

blocking stray light between the die-level cameras;

wherein a larger lens of one of the first and second die-level cameras is segmented to provide space for a lens of the other of the first and second die-level cameras.

8. The method of claim 7, further comprising:

forming a first sensor of the first die-level camera and a second sensor of the second die-level camera in a wafer.

9. The method of claim 7, wherein blocking stray light comprises forming baffling.

10. The method of claim 7, further comprising forming at least one of a first aperture stop of the first die-level camera and a second aperture stop of the second die-level camera.

11. The method of claim 7, wherein lens elements of the first and second die-level cameras are formed by a common master at the same time.