Inverse chip connector
First Claim
1. A method comprising:
- aligning an electrically-conductive post on a first chip with an electrically-conductive well in a second chip, wherein a first electrically-conductive material is disposed over the electrically-conductive post, wherein the first electrically-conductive material is more malleable than the electrically-conductive post, and wherein the first electrically-conductive material has a size that is larger than an opening of the electrically-conductive well; and
inserting the electrically-conductive post into the electrically-conductive well to cause the first electrically-conductive material to deform and create an electrically-conductive path between the first chip and the second chip.
1 Assignment
0 Petitions
Accused Products
Abstract
A system for connecting a first chip to a second chip having a post on the first chip having a first metallic material, a recessed wall within the second chip and defining a well within the second chip, a conductive diffusion layer material on a surface of the recessed wall within the well, and a malleable electrically conductive material on the post, the post being dimensioned for insertion into the well such that the malleable electrically conductive material will deform within the well and, upon heating to at least a tack temperature for the malleable, electrically conductive material, will form an electrically conductive tack connection with the diffusion layer to create an electrically conductive path between the first chip and the second chip.
329 Citations
23 Claims
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1. A method comprising:
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aligning an electrically-conductive post on a first chip with an electrically-conductive well in a second chip, wherein a first electrically-conductive material is disposed over the electrically-conductive post, wherein the first electrically-conductive material is more malleable than the electrically-conductive post, and wherein the first electrically-conductive material has a size that is larger than an opening of the electrically-conductive well; and inserting the electrically-conductive post into the electrically-conductive well to cause the first electrically-conductive material to deform and create an electrically-conductive path between the first chip and the second chip. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method comprising:
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aligning a post on a first chip with a well in a second chip, wherein the well comprises a first electrically-conductive material, and wherein the post comprises a rigid electrically-conductive material and a second electrically-conductive material more malleable than both the first electrically-conductive material and the rigid electrically-conductive material; and inserting the post into the well to cause the second electrically-conductive material to deform and create an electrically-conductive path between the first chip and the second chip, wherein the first electrically-conductive material is disposed over a recessed wall of the well and wherein the well comprises a depth extending into the second chip and a width extending across an outer opening of the well, wherein the width extending across the outer opening of the well corresponds to a width of the post, and wherein the width of the post is larger than the corresponding width extending across the outer opening of the well prior to said inserting the post into the well. - View Dependent Claims (11, 12, 13, 14, 15)
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16. A method comprising:
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aligning an electrically-conductive post on a first chip with an electrically-conductive well in a second chip, wherein a first electrically-conductive material is disposed over the electrically-conductive post, wherein the first electrically-conductive material is more malleable than the electrically-conductive post, and wherein the first electrically-conductive material has a size that is larger than an opening of the electrically-conductive well; and inserting the electrically-conductive post into the electrically-conductive well, thereby causing the first electrically-conductive material to deform without deformation of the electrically-conductive post; and heating the first electrically-conductive material to form an electrically-conductive connection between the first chip and the second chip. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23)
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Specification