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Through-hole substrate and method of producing the same

  • US 8,846,526 B2
  • Filed: 04/06/2012
  • Issued: 09/30/2014
  • Est. Priority Date: 04/14/2011
  • Status: Active Grant
First Claim
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1. A method of producing a through-hole substrate, comprising:

  • preparing a substrate having a through-hole filled with a filler containing a material capable of being selectively removed with respect to the substrate;

    forming a structure, at least a part of a surface of which has an insulating property, in a region including at least a part of the through-hole on at least one surface of the substrate;

    forming a plated layer on the substrate having the structure formed thereon; and

    removing the filler and the structure after forming the plated layer.

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