Printed wiring board and method for manufacturing printed wiring board

• US 8,847,078 B2
• Filed: 09/27/2013
• Issued: 09/30/2014
• Est. Priority Date: 09/27/2012
• Status: Active Grant

• Current Assignee: Ibiden Co., Ltd.
• Original Assignee: Ibiden Co., Ltd.
• Inventors: Kose, Satoru, Matsuno, Ryo, Kondo, Koichi
• Primary Examiner(s): Dinh, Tuan T
• Assistant Examiner(s): Sawyer, Steven T
• Application Number:
  US14/040,085
• Publication Number:
  US 20140083747A1
• Time in Patent Office: 368 Days
• Field of Search: 174/250, 174/251, 174/255, 174/256, 174/260, 361/802, 361777-779, 361807-812
• US Class Current: 174/250
• CPC Class Codes: H01L 2223/5442 comprising non digital, non alphanumeric information, e.g. symbols
• CPC Class Codes: H01L 2223/54426 for alignment
• CPC Class Codes: H01L 2223/54486 Located on package parts, e.g. encapsulation, leads, package substrate
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/81192 wherein the bump connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H05K 1/0269 for visual or optical inspection
• CPC Class Codes: H05K 1/0274 Optical details, e.g. printed circuits comprising integral optical means H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42
• CPC Class Codes: H05K 2201/09781 Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
• CPC Class Codes: H05K 2201/09918 Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
• CPC Class Codes: H05K 2201/2054 Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
• CPC Class Codes: H05K 2203/072 Electroless plating, e.g. finish plating or initial plating
• CPC Class Codes: H05K 3/244 Finish plating of conductors, especially of copper conductors, e.g. for pads or lands selective plating methods H05K3/243; finish plating of conductors made by printing techniques H05K3/246; solder as finish H05K3/3457, e.g. by plating H05K3/3473
• CPC Class Codes: H05K 3/46 Manufacturing multilayer circuits
• CPC Class Codes: H05K 3/4602 characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated

Abstract

A printed wiring board includes an outermost interlayer resin insulation layer, n outermost conductive layer formed on the outermost interlayer resin insulation layer and including multiple alignment marks, a connection wiring structure connecting the alignment marks, and a solder-resist layer formed on the outermost interlayer resin insulation layer and the outermost conductive layer. The solder-resist layer has openings exposing the alignment marks, respectively, and each of the alignment marks has an electroless plated film formed on each of the alignment marks.

Claims

1. A printed wiring board, comprising:

an outermost interlayer resin insulation layer;

an outermost conductive layer formed on the outermost interlayer resin insulation layer and including a plurality of alignment marks;

a connection wiring structure connecting the alignment marks;

a solder-resist layer formed on the outermost interlayer resin insulation layer and the outermost conductive layer; and

a lower interlayer resin insulation layer formed underneath the outermost interlayer resin insulation layer,

wherein the solder-resist layer has a plurality of openings exposing the alignment marks, respectively, and each of the alignment marks has an electroless plated film formed on each of the alignment marks, the connection wiring structure is positioned between the outermost interlayer resin insulation layer and the lower interlayer resin insulation layer, and the connection wiring structure is connected to the alignment marks through a plurality of via conductors formed in the outermost interlayer resin insulation layer.

2. The printed wiring board according to claim 1, wherein the alignment marks are positioned in four corners of the outermost interlayer resin insulation layer.

3. The printed wiring board according to claim 1, wherein the alignment marks are formed directly on the via conductors, respectively.

4. The printed wiring board according to claim 1, further comprising a second connection wiring structure connecting the via conductors and the alignment marks on the outermost interlayer resin insulation layer.

5. The printed wiring board according to claim 1, wherein the electroless plated film comprises a nickel layer and a gold layer.

6. The printed wiring board according to claim 1, wherein the electroless plated film is formed of a nickel layer and a gold layer.

7. The printed wiring board according to claim 1, wherein the connection wiring structure forms one of a power source conductor and a ground conductor.

8. The printed wiring board according to claim 1, wherein the plurality of alignment marks has at least one of a cross shape, a ring shape, a rectangle shape and a circle shape.

9. The printed wiring board according to claim 1, wherein the electroless plated film comprises a nickel layer and a gold layer, and the connection wiring structure forms one of a power source conductor and a ground conductor.

10. The printed wiring board according to claim 3, wherein the alignment marks are positioned in four corners of the outermost interlayer resin insulation layer.

11. The printed wiring board according to claim 3, wherein the connection wiring structure forms one of a power source conductor and a ground conductor.

12. The printed wiring board according to claim 3, wherein the electroless plated film comprises a nickel layer and a gold layer.

13. A method for manufacturing a printed wiring board, comprising:

forming a connection wiring structure on a lower interlayer resin insulation layer;

forming an outermost interlayer resin insulation layer on the lower interlayer resin insulation layer and the connection wiring structure;

forming a plurality of via conductors in the outermost interlayer resin insulation layer such that the plurality of via conductors is connected to the connection wiring structure;

forming on the outermost interlayer resin insulation layer an outermost conductive layer including a plurality of alignment marks such that the plurality of alignment marks is connected to the connection wiring structure through the plurality of via conductors, respectively;

forming a solder-resist layer on the outermost interlayer resin insulation layer and the outermost conductive layer;

forming a plurality of openings in the solder-resist layer such that the openings expose the alignment marks, respectively; and

forming an electroless plated film in the opening of the solder-resist layer such that each of the alignment marks has the electroless plated film formed on each of the alignment marks.

14. The method for manufacturing a printed wiring board according to claim 13, wherein the forming of the outermost conductive layer includes forming the alignment marks in four corners of the outermost interlayer resin insulation layer.

15. The method for manufacturing a printed wiring board according to claim 13, wherein the forming of the alignment marks comprises forming the alignment marks directly on the via conductors, respectively.

16. The method for manufacturing a printed wiring board according to claim 13, wherein the electroless plated film comprises a nickel layer and a gold layer.

17. The method for manufacturing a printed wiring board according to claim 13, wherein the forming of the connection wiring structure comprises forming one of a power source conductor comprising the connection wiring structure and a ground conductor comprising the connection wiring structure.

18. The method for manufacturing a printed wiring board according to claim 13, wherein the plurality of alignment marks has at least one of a cross shape, a ring shape, a rectangle shape and a circle shape.

19. The method for manufacturing a printed wiring board according to claim 13, wherein the forming of the outermost conductive layer includes forming a second connection wiring structure connecting the via conductors and the alignment marks on the outermost interlayer resin insulation layer.

20. The method for manufacturing a printed wiring board according to claim 16, wherein the forming of the connection wiring structure comprises forming one of a power source conductor comprising the connection wiring structure and a ground conductor comprising the connection wiring structure.