Method and apparatus to scribe a line in a thin film material using a burst of laser pulses with beneficial pulse shape
First Claim
1. A laser-based processing method, comprising:
- providing a series of laser pulses characterized by a first pulse and at least 9 following pulses, where each laser pulse in the series is characterized by a spike/plateau chair laser pulse shape, and each pulse in the series is further characterized by a laser spot with a laser spot area; and
removing a thin film of material, deposited on a substrate, along a pattern down to the substrate by;
placing the laser spot of the first pulse through the substrate at a spot position on said thin film of material; and
placing the laser spots of each of the following pulses in the series of pulses through the substrate at spot positions along said pattern on said thin film of material such that each spot position is adjacent to the spot position of the laser spot of the previous pulse, and there is an overlap of spot positions such that an area of each spot overlaps in some amount an area of each previous spot, wherein said laser pulse shape is configured such that no micro-cracks are formed in edges of the pattern in the thin film material.
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Abstract
A series of laser pulses in a pulse train, each pulse with a beneficial temporal power shape instead of the conventional laser temporal power shape, scribes a line in a thin film of material on a substrate. The beneficial temporal pulse shape has a spike/plateau chair shape or a square pulse shape. Scribing a line in the thin film is achieved by placing the series of laser pulse spots on the line to be scribed such that there is an overlapping area between adjacent laser pulse spots along the line. The use of a series of laser pulses with beneficial pulse shape to scribe a line in the thin film results in a better quality and cleaner scribing process compared to that achieved with the conventional pulse shape.
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Citations
24 Claims
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1. A laser-based processing method, comprising:
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providing a series of laser pulses characterized by a first pulse and at least 9 following pulses, where each laser pulse in the series is characterized by a spike/plateau chair laser pulse shape, and each pulse in the series is further characterized by a laser spot with a laser spot area; and removing a thin film of material, deposited on a substrate, along a pattern down to the substrate by; placing the laser spot of the first pulse through the substrate at a spot position on said thin film of material; and placing the laser spots of each of the following pulses in the series of pulses through the substrate at spot positions along said pattern on said thin film of material such that each spot position is adjacent to the spot position of the laser spot of the previous pulse, and there is an overlap of spot positions such that an area of each spot overlaps in some amount an area of each previous spot, wherein said laser pulse shape is configured such that no micro-cracks are formed in edges of the pattern in the thin film material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A laser-based processing method comprising:
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providing a series of laser pulses characterized by a first pulse and at least 9 following pulses, where each laser pulse in the series is characterized by a spike/plateau chair laser pulse shape, and each pulse in the series is further characterized by a laser spot with a laser spot area; and removing a thin film of material, deposited on a substrate, along a pattern down to the substrate by; placing the laser spot of the first pulse through the substrate at a spot position on said thin film of material; and placing the laser spots of each of the following pulses in the series of pulses through the substrate at spot positions along said pattern on said thin film such that each spot position is adjacent to the spot position of the laser spot of the previous pulse, and there is an overlap of spot positions such that an area of each spot overlaps in some amount an area of each previous spot, wherein said laser pulse shape is configured such that no micro-cracks are formed in the substrate and no micro-cracks are formed on the edges of the pattern in the thin film of material. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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Specification