Laser-assisted micromachining system and method

• US 8,847,114 B1
• Filed: 05/07/2008
• Issued: 09/30/2014
• Est. Priority Date: 05/07/2007
• Status: Active Grant

• Current Assignee: Purdue Research Foundation (Purdue University)
• Original Assignee: Purdue Research Foundation (Purdue University)
• Inventors: Shin, Yung C.
• Primary Examiner(s): Tran, Thien S
• Application Number:
  US12/116,768
• Time in Patent Office: 2,337 Days
• Field of Search: 219/121.6, 219/121.65, 219/121.66, 219/121.68, 219/121.73, 219/121.74, 219/121.78, 219/121.79, 219/121.83, 219/121.84, 219/121.85, 408/19, 409131-132, 409/135, 409/136, 409/139, 409/165, 409/166, 409/168
• US Class Current: 219/121.74
• CPC Class Codes: B23K 26/0093 combined with mechanical machining or metal-working covered by other subclasses than B23K combined welding or cutting procedures or apparatus B23K28/02
• CPC Class Codes: B23K 26/02 Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
• CPC Class Codes: B23K 26/06 Shaping the laser beam, e.g. by masks or multi-focusing
• CPC Class Codes: B23P 25/006 Heating the workpiece by laser during machining

Abstract

A novel apparatus and method for laser-assisted micro-milling. The disclosed laser-assisted micro-milling system and method provides unique micro-milling capabilities for very difficult-to-machine materials, such as ceramics, high temperature alloys and composites. A low power laser beam is focused at a very small spot, thus producing a very high power density, the spot being located just ahead of a mechanical micro-milling cutter to preheat the material prior to machining. This localized heating thermally weakens the workpiece resulting in lower cutting forces, improved surface finish, and longer tool life. The system is capable of micro-milling difficult-to-machine materials that may be conductive or non-conductive with high material removal rates compared to existing systems and methods.

Claims

1. A laser-assisted micro-milling system adapted to perform a machining operation on a workpiece material, the system comprising:

a spindle disposed so that said spindle and said workpiece material define a workspace therebetween;

a micro-milling tool held by said spindle;

a laser generating a laser beam;

means for fixturing said micro-milling tool and said laser in fixed positions relative to each other during the machining operation performed by the system;

a beam expander optically aligned with said laser and expanding said laser beam generated thereby to yield an expanded laser beam;

a focusing element optically aligned with said beam expander and optically aligned with said laser via said beam expander for focusing said expanded laser beam to yield a focused laser beam having a fixed position that is fixed by said fixturing means relative to said micro-milling tool, said focusing element being optically aligned with a target spot on the workpiece material and substantially adjacent to a working end of said micro-milling tool such that the workpiece material is locally preheated by said focused laser beam prior to machining locally preheated workpiece material with a cutting section of said micro-milling tool;

first and second mirrors located at least partially within said workspace and positioned with respect to said spindle so as to optically align said focusing element and said target spot such that said focused laser beam from said focusing element is reflected away from the workpiece material by said first mirror onto said second mirror and reflected by said second mirror toward the workpiece material to said target spot, said second mirror being oriented so that a final stage path of said focused laser beam has an angle of incidence of less than 30 degrees with a perpendicular of a surface of the workpiece material, said angle of incidence being fixed by said fixturing means relative to said micro-milling tool; and

means for moving the workpiece material relative to said micro-milling tool and said focused laser beam as said locally preheated workpiece material is being machined by said cutting section of said micro-milling tool.

2. The system of claim 1, wherein said laser is configured to generate said laser beam with a diameter greater than 1 mm, said beam expander is configured to increase said diameter of said laser beam generated by said laser, said focused laser beam has a diameter at said target spot of less than 500 μ

m on the workpiece material, and said focused laser beam at said target spot has a cross-section on the workpiece material with a substantial width in relation to a length thereof.

3. A laser-assisted mechanical micro-milling system adapted to perform a machining operation on a workpiece material, the system comprising:

a machine frame having a spindle mounted thereon;

a micro-milling tool held by said spindle;

a laser generating a laser beam;

a fixturing plate mounted to said machine frame and fixturing said micro-milling tool and said laser in fixed positions relative to each other during the machining operation performed by the system;

a beam expander optically aligned with said laser and expanding said laser beam generated thereby to yield an expanded laser beam;

a focusing element optically aligned with said beam expander and optically aligned with said laser via said beam expander for focusing said expanded laser beam to yield a focused laser beam having a fixed position that is fixed by said fixturing plate relative to said micro-milling tool, said focusing element being optically aligned with a target spot on the workpiece material and substantially adjacent to a working end of said micro-milling tool such that the workpiece material is locally preheated by said focused laser beam prior to machining locally preheated workpiece material with a cutting section of said micro-milling tool; and

a controlled stage mounted to said frame for moving the workpiece material relative to said micro-milling tool and said focused laser beam as said locally preheated workpiece material is being machined by said cutting section of said micro-milling tool.

4. The system of claim 3, wherein said laser is configured to generate said laser beam with a diameter greater than 1 mm, said beam expander is configured to increase said diameter of said laser beam generated by said laser, said focused laser beam has a diameter at said target spot of less than 500 μ

m on the workpiece material, and said focused laser beam at said target spot has a cross-section on the workpiece material with a substantial width in relation to a length thereof.

7. The system of claim 4, wherein said beam expander is configured to provide two-dimensional beam expansion of said laser beam generated by said laser, wherein said focusing element comprises a spherical lens, and wherein said beam expander and said focusing element are configured to focus said focused laser beam to approximately 20 to 200 microns at said target spot substantially adjacent to said micro-milling tool.

8. The system of claim 7, wherein said cutting section of said micro-milling tool has a diameter in a range of approximately 10 to 200 microns.

9. The system of claim 3, further comprising a universal optics holder configured to receive a variety of said focusing elements.

11. The system of claim 3, wherein said focusing element has a focal length of 30 mm or less.

12. The system of claim 3, wherein said focusing element has a focal length of more than 30 mm and less than 60 mm.

13. The system of claim 3, wherein said focusing element has a focal length of 60 mm or more and less than 100 mm.

14. The system of claim 3, further comprising first and second mirrors positioned with respect to said spindle so as to optically align said focusing element and said target spot such that said focused laser beam from said focusing element is reflected away from the workpiece material by said first mirror onto said second mirror and reflected by said second mirror toward the workpiece material to said target spot.

15. The system of claim 14, wherein said second mirror is configured so that a final stage path of said focused laser beam has an angle of incidence of less than 30 degrees with a perpendicular of a surface of the workpiece material, said angle of incidence being fixed by said fixturing plate relative to said micro-milling tool.

16. The system of claim 3, wherein said beam expander is configured to increase a diameter of said laser beam generated by said laser by an expansion ratio of 1 to less than 3.

17. The system of claim 3, wherein said beam expander is configured to increase a diameter of said laser beam generated by said laser by an expansion ratio of 3 to 10.

18. The system of claim 3, wherein said controlled stage is a controlled stage of a CNC machine, and said controlled stage is movable with a resolution ranging from 0.5 to 20 microns along one or more axes configured to move the workpiece material to said cutting section of said micro-milling tool.

19. The system of claim 18, wherein said CNC machine is configured to adjust a power level of said laser beam generated by said laser with a resolution ranging from 0.1 W to 1.0 W.

20. The system of claim 3, further comprising a high-resolution digital camera optically aligned with said cutting section of said micro-milling tool.

21. The system of claim 3, further comprising a nozzle configured to direct a stream of inert gas at said cutting section of said micro-milling tool.

22. The system of claim 3, further comprising an acoustic imaging sensor configured to respond to vibrations emitted by the workpiece material upon contact by said cutting section of said micro-milling tool.

5. A laser-assisted micro-milling method for perform a machining operation on a workpiece material, the method comprising:

positioning a spindle having a micro-milling tool mounted thereto so that said spindle and said workpiece material define a workspace therebetween;

moving the workpiece material relative to said micro-milling tool;

producing a laser beam;

expanding said laser beam generated by said laser to yield an expanded laser beam; and

focusing said expanded laser beam to yield a focused laser beam on a target spot on the workpiece material so as to locally preheat the workpiece material at said target spot and then machining locally preheated workpiece material with said micro-milling tool;

wherein the focused laser beam is optically aligning with first and second mirrors located at least partially within said workspace and positioned with respect to said spindle such that said focused laser beam is reflected away from the workpiece material by said first mirror onto said second mirror and reflected by said second mirror toward the workpiece material and onto said target spot, said second mirror being oriented so that a final stage path of said focused laser beam has an angle of incidence of less than 30 degrees with a perpendicular of a surface of the workpiece material; and

wherein said micro-milling tool and said focused laser beam are in fixed positions relative to each other and the workpiece material moves relative to said micro-milling tool and said focused laser beam during the machining operation.

6. The method of claim 5, wherein said focused laser beam has a diameter of approximately 20 to 200 microns at said target spot substantially adjacent to said micro-milling tool.

10. The system of claim 5, wherein said universal optics holder is slidable parallel to a path of said laser beam generated by said laser.