Single package imaging and inertial navigation sensors, and methods of manufacturing the same

• US 8,847,137 B2
• Filed: 02/29/2012
• Issued: 09/30/2014
• Est. Priority Date: 02/29/2012
• Status: Active Grant

• Current Assignee: Malikie Innovations Limited (Key Patent Innovations Limited)
• Original Assignee: Blackberry Limited
• Inventors: Kennedy, Marc Adam
• Primary Examiner(s): Ko, Tony
• Application Number:
  US13/407,798
• Publication Number:
  US 20130221195A1
• Time in Patent Office: 944 Days
• Field of Search: 250/208.1, 257/415, 257/698, 438/15, 438/125
• US Class Current: 250/208.1
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 27/14618 Containers

Abstract

Apparatus and methods of manufacturing an image sensor and inertial navigation sensors encapsulated within a single package. The single package may encapsulate one integrated circuit die comprising the imaging sensor and the inertial navigation sensors. Alternatively, the single package may encapsulate a plurality of integrated circuit dice comprising the imaging sensor and the inertial navigation sensors.

Claims

1. A mobile device comprising:

a sensor apparatus for use in the mobile device, the sensor apparatus comprising;

an image sensor;

at least one navigation sensor, the at least one navigation sensor comprising at least a magnetometer; and

an integrated circuit package, wherein the integrated circuit package encapsulates the image sensor and the at least one navigation sensor; and

a memory, the memory storing a translation table, wherein the translation table comprises a mapping of output value axes between the image sensor, the at least one navigation sensor and the mobile device.

2. The mobile device of claim 1, wherein the image sensor is fabricated on a first integrated circuit die.

3. The mobile device of claim 2, wherein the first integrated circuit die is attached to the integrated circuit package.

4. The mobile device of claim 2, wherein the at least one navigation sensor is fabricated on the first integrated circuit die.

5. The mobile device of claim 2, wherein the at least one navigation sensor is fabricated on at least one additional integrated circuit die that is separate from the first integrated circuit die.

6. The mobile device of claim 5, wherein the at least one additional integrated circuit die is stacked with the first integrated circuit die.

7. The mobile device of claim 1, wherein the at least one navigation sensor comprises two or more navigation sensors.

8. The mobile device of claim 1, wherein the at least one navigation sensor comprises at least one additional sensor selected from the group consisting of:

a gyroscope, an accelerometer, and an altimeter.

9. A method of manufacturing a sensor apparatus for use in a mobile device, the method comprising:

fabricating an image sensor;

fabricating at least one navigation sensor, the at least one navigation sensor comprising at least a magnetometer;

encapsulating the image sensor and the at least one navigation sensor in an integrated circuit package; and

computing a translation table wherein the translation table comprises a mapping of output value axes between the image sensor the at least one navigation sensor and the mobile device.

10. The method of claim 9, wherein the image sensor is fabricated on a first integrated circuit die.

11. The method of claim 10, further comprising attaching the first integrated circuit die to the integrated circuit package.

12. The method of claim 10, wherein the at least one navigation sensor is fabricated on the first integrated circuit die.

13. The method of claim 10, wherein the at least one navigation sensor is fabricated on at least one additional integrated circuit die that is separate from the first integrated circuit die.

14. The method of claim 13, wherein the at least one additional integrated circuit die is stacked with the first integrated circuit die.

15. The method of claim 9, wherein the at least one navigation sensor comprises two or more navigation sensors.

16. The method of claim 9, wherein the at least one navigation sensor comprises at least one additional sensor selected from the group consisting of:

a gyroscope, an accelerometer, and an altimeter.

17. Use of a sensor apparatus in a mobile device to provide output data to an augmented reality application executed by a processor of the mobile device, the sensor apparatus comprising:

an image sensor;

at least one navigation sensor; and

an integrated circuit package, wherein the integrated circuit package encapsulates the image sensor and the at least one navigation sensor,

wherein the mobile device comprises a memory storing a translation table, wherein the translation table comprises a mapping of output value axes between the image sensor, the at least one navigation sensor and the mobile device.

18. The use of claim 17, wherein the image sensor and the at least one navigation sensor provide the output data.

19. The use of claim 17, wherein the at least one navigation sensor comprises at least one additional sensor selected from the group consisting of:

a gyroscope, an accelerometer, a magnetometer and an altimeter.