Dimensionally tolerant multiband conformal antenna arrays

• US 8,847,823 B2
• Filed: 01/09/2012
• Issued: 09/30/2014
• Est. Priority Date: 01/09/2012
• Status: Active Grant

• Current Assignee: Lockheed Martin Corporation (Martin Marietta Corporation)
• Original Assignee: Lockheed Martin Corporation (Martin Marietta Corporation)
• Inventors: Vos, David L., Baldwin, Carl, Darling, David R., Kaplun, Brian, Dorough, David R.
• Primary Examiner(s): MANCUSO, HUEDUNG XUAN CAO
• Application Number:
  US13/346,305
• Publication Number:
  US 20130176176A1
• Time in Patent Office: 995 Days
• Field of Search: 343/700.MS, 343/702, 343/705, 343/711, 343/713
• US Class Current: 343/700.MS
• CPC Class Codes: B32B 2457/00 Electrical equipment
• CPC Class Codes: B32B 37/12 characterised by using adhesives
• CPC Class Codes: H01Q 1/287 integrated in a wing or a stabiliser
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 21/28 Combinations of substantially independent non-interacting antenna units or systems multiple beam H01Q25/00

Abstract

Some embodiments relate to a multiband antenna array formed on a flexible substrate. Low frequency antenna elements may be formed using nanoink. High frequency elements may be provided on a prefabricated antenna chip. The antenna array may be heated in a low temperature oven to sinter the nanoink into a solid antenna element. In some embodiments, an adhesive insulation layer may be provided which allows the antenna array to be attached to any surface. In other embodiments, the antenna array may be embedded in a composite material.

Claims

1. A multiband antenna array comprising:

a flexible substrate comprising a first flexible surface and a second flexible surface opposed to the first flexible surface; and

a plurality of high frequency antenna chips, each high frequency antenna chip comprising;

an inflexible substrate comprising a first inflexible surface and a second inflexible surface opposed to the first inflexible surface;

at least one high frequency antenna element in contact with the first inflexible surface of the inflexible substrate; and

at least one low frequency antenna element in contact with the first flexible surface of the flexible substrate, wherein the at least one low frequency antenna element comprises sintered nanoink.

2. The multiband antenna array of claim 1, wherein:

the nanoink comprises electrically conductive nanoparticles comprised of a metal selected from the group consisting of silver, copper, gold and platinum.

3. The multiband antenna array of claim 1, further comprising:

at least one integrated circuit electrically coupled to at least one of the plurality of high frequency antenna chips.

4. The multiband antenna array of claim 3, wherein:

a first circuit surface of the at least one integrated circuit is in contact with the second inflexible surface of the inflexible substrate.

5. The multiband antenna array of claim 1, further comprising:

a flexible insulation layer comprising a first insulation surface and a second insulation surface opposed to the first insulation surface.

6. The multiband antenna array of claim 5, wherein:

the first insulation surface of the flexible insulation layer is adhesive.

7. The multiband antenna array of claim 5, wherein:

the second inflexible surface of the inflexible substrate is in contact with the first flexible surface of the flexible substrate.

8. The multiband antenna array of claim 1, wherein:

a first coefficient of thermal expansion of the inflexible substrate is lower than a second coefficient of thermal expansion of the flexible substrate.

9. The multiband antenna array of claim 1, wherein:

the inflexible substrate comprises ceramic or silicon.

10. The multiband antenna array of claim 1, wherein:

each of the high frequency antenna chips is configured to operate in at least one frequency band selected from the group consisting of the L band, S band, C band, X band, K_u band, K band, and K_a band.

11. The multiband antenna array of claim 1, wherein:

each of the high frequency antenna chips is configured to operate at a frequency between 1 GHz and 40 GHz.

12. The multiband antenna array of claim 1, wherein:

the at least one low frequency antenna element is configured to operate in at least one frequency band selected from the group consisting of the high frequency (HF) band, the very high frequency (VHF) band, and the ultra high frequency (UHF) band.

13. The multiband antenna array of claim 1, wherein:

the at least one low frequency antenna element is configured to operate at a frequency between 3 MHz and 1 GHz.

14. The multiband antenna array of claim 1, wherein:

the nanoink comprises a plurality of different types of nanoparticles.

15. The multiband antenna array of claim 1, wherein:

the nanoink comprises a carbon nanotubes and/or buckminsterfullerene.

16. The multiband antenna array of claim 1, further comprising:

at least one interconnection trace configured to connect the plurality of high frequency antenna chips to at least one radio frequency processor.

17. The multiband antenna array of claim 3, wherein each of the plurality of high frequency antenna chips further comprises:

at least one via configured to electrically couple the at least one integrated circuit to the at least one of the plurality of high frequency antenna chips.

18. The multiband antenna array of claim 17, wherein the at least one via comprises sintered nanoink.

19. The multiband antenna array of claim 5, wherein:

the flexible insulation layer comprises a multi-layer flexible film.

20. The multiband antenna array of claim 1, wherein the multiband antenna array is an appliqué

.