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Integrated processor for 3D mapping

  • US 8,848,039 B2
  • Filed: 05/01/2013
  • Issued: 09/30/2014
  • Est. Priority Date: 07/09/2008
  • Status: Active Grant
First Claim
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1. A device for processing data, comprising:

  • a single semiconductor substrate; and

    integrated circuit components, fabricated on the single semiconductor substrate, comprising;

    a first input port for receiving color image data from a first sensor;

    a second input port for receiving depth-related data from a second sensor, wherein the depth-related data comprise an image of a pattern that is projected onto an object;

    processing circuitry, configured to generate a depth map using at least the depth-related data by measuring shifts in the pattern relative to a reference image, and to synchronize and multiplex the depth map with the color image data in a single multiplexed data stream; and

    a single output port for conveying the multiplexed data stream to a host computer.

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