Communication module

• US 8,849,362 B1
• Filed: 03/06/2014
• Issued: 09/30/2014
• Est. Priority Date: 10/30/2013
• Status: Active Grant

• Current Assignee: Taiyo Yuden Company Limited (Taiyo Yuden Co)
• Original Assignee: Taiyo Yuden Company Limited (Taiyo Yuden Co)
• Inventors: Saji, Tetsuo, Nakamura, Hiroshi, Ichikawa, Yohei
• Primary Examiner(s): Wendell, Andrew
• Assistant Examiner(s): Soltanzadeh, Maryam
• Application Number:
  US14/199,824
• Time in Patent Office: 208 Days
• Field of Search: 455/575.1, 257/659, 257/660
• US Class Current: 455/575.1
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H04B 1/3888 Arrangements for carrying or protecting transceivers
• CPC Class Codes: H04B 15/04 the interference being caused by substantially sinusoidal oscillations, e.g. in a receiver or in a tape-recorder
• CPC Class Codes: H05K 1/0218 by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence
• CPC Class Codes: H05K 2201/0715 provided by an outer layer of PCB
• CPC Class Codes: H05K 2201/10371 Shields or metal cases
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence

Abstract

A communication module includes a circuit substrate having a first high-frequency processing section related to mobile phone communication, a system section having a baseband processing section and application processing section, and a power circuit section, a sealing member covering the electronic components mounted on the circuit substrate, a conductive shield layer formed on a surface of the sealing member, and a shield wall formed in the sealing member so as to demarcate one or both mounting areas of the system section and power circuit section and the mounting area of the first high-frequency processing section. The circuit substrate includes a core layer that is a conductive layer thicker than the other conductive layers and that functions as a ground. Electronic components are arranged in through-holes formed in the core layer.

Claims

1. A communication module, comprising:

a circuit substrate having

(a) a first high-frequency processing section that processes high-frequency signals related to mobile phone communication,

(b) a system section having a baseband processing area that processes baseband signals related to mobile phone communication and an application processing area that processes various types of mobile phone application operations, and

(c) a power circuit section;

a sealing member formed on an entire surface of a main surface of the circuit substrate, the sealing member covering electronic components mounted on said main surface;

a shield layer that is conductive and formed on a surface of the sealing member; and

a first shield wall that fills a groove formed from the surface of the sealing member toward the main surface of the circuit substrate, the groove demarcating a mounting area of either one or both of the system section and the power circuit section and a mounting area of the first high-frequency processing section, the first shield wall being connected to the shield layer,

wherein the circuit substrate is made of conductive layers and insulating layers laminated together, and has a core layer that is a conductive layer, the core layer being thicker than other conductive layers and functioning as a ground, and

wherein one or more electronic components constituting a part of at least one of the first high-frequency processing section, system section, and power circuit section are each arranged in a through-hole or a recessed portion formed in the core layer of the circuit substrate.

2. The communication module according to claim 1, wherein a primary processing part of the baseband processing area and a primary processing part of the application processing area are integrated into one integrated circuit.

3. The communication module according to claim 1,

wherein the power circuit section includes a first power circuit area that powers the first high-frequency processing section, and a second power circuit area that powers the system section, and

wherein a second shield wall is provided that fills a groove formed from the surface of the sealing member toward the main surface of the circuit substrate, the groove demarcating a mounting area of the first power circuit area and a mounting area of the second power circuit area, the second shield wall being connected to the shield layer.

4. The communication module according to claim 2,

wherein the power circuit section includes a first power circuit area that powers the first high-frequency processing section, and a second power circuit area that powers the system section, and

wherein a second shield wall is provided that fills a groove formed from the surface of the sealing member toward the main surface of the circuit substrate, the groove demarcating a mounting area of the first power circuit area and a mounting area of the second power circuit area, the second shield wall being connected to the shield layer.

5. The communication module according to claim 1, further comprising:

a second high-frequency processing section that is included with the circuit substrate and that processes high-frequency signals related to non-mobile phone communication; and

a third shield wall that is connected with the shield layer and that fills a groove formed from the surface of the sealing member toward the main surface of the circuit substrate, the groove demarcating one or both mounting areas of the system section and power circuit section and a mounting area of the second high-frequency processing section.

6. The communication module according to claim 2, further comprising:

a second high-frequency processing section that is included with the circuit substrate and that processes high-frequency signals related to non-mobile phone communication; and

a third shield wall that is connected with the shield layer and that fills a groove formed from the surface of the sealing member toward the main surface of the circuit substrate, the groove demarcating one or both mounting areas of the system section and power circuit section and a mounting area of the second high-frequency processing section.

7. The communication module according to claim 3, further comprising:

a second high-frequency processing section that is included with the circuit substrate and that processes high-frequency signals related to non-mobile phone communication; and

a third shield wall that is connected with the shield layer and that fills a groove formed from the surface of the sealing member toward the main surface of the circuit substrate, the groove demarcating one or both mounting areas of the system section and power circuit section and a mounting area of the second high-frequency processing section.

8. The communication module according to claim 4, further comprising:

a second high-frequency processing section that is included with the circuit substrate and that processes high-frequency signals related to non-mobile phone communication; and

a third shield wall that is connected with the shield layer and that fills a groove formed from the surface of the sealing member toward the main surface of the circuit substrate, the groove demarcating one or both mounting areas of the system section and power circuit section and a mounting area of the second high-frequency processing section.

9. The communication module according to claim 5, wherein the mounting area of the system section is arranged between the mounting area of the first high-frequency processing section and the mounting area of the second high-frequency processing section.

10. The communication module according to claim 6, wherein the mounting area of the system section is arranged between the mounting area of the first high-frequency processing section and the mounting area of the second high-frequency processing section.

11. The communication module according to claim 7, wherein the mounting area of the system section is arranged between the mounting area of the first high-frequency processing section and the mounting area of the second high-frequency processing section.

12. The communication module according to claim 8, wherein the mounting area of the system section is arranged between the mounting area of the first high-frequency processing section and the mounting area of the second high-frequency processing section.

13. A communication module, comprising:

a circuit substrate having

(a) a first high-frequency processing section that processes high-frequency signals related to mobile communication,

(b) a system section having an application processing area that processes various types of application operations, and

(c) a power circuit section;

a sealing member formed on an entire surface of a main surface of the circuit substrate, the sealing member covering electronic components mounted on said main surface;

a shield layer that is conductive and formed on a surface of the sealing member; and

a first shield wall that fills a groove formed from the surface of the sealing member toward the main surface of the circuit substrate, the groove demarcating a mounting area of either one or both of the system section and the power circuit section and a mounting area of the first high-frequency processing section, the first shield wall being connected to the shield layer,

wherein the circuit substrate is made of conductive layers and insulating layers laminated together, and has a core layer that is thicker than other layers, and

wherein one or more electronic components constituting a part of at least one of the first high-frequency processing section, system section, and power circuit section are each arranged in a through-hole or a recessed portion formed in the core layer of the circuit substrate.

14. The communication module according to claim 13,

wherein the power circuit section includes a first power circuit area that powers the first high-frequency processing section, and a second power circuit area that powers the system section, and

wherein a second shield wall is provided that fills a groove formed from the surface of the sealing member toward the main surface of the circuit substrate, the groove demarcating a mounting area of the first power circuit area and a mounting area of the second power circuit area, the second shield wall being connected to the shield layer.

15. The communication module according to claim 13, further comprising:

a second high-frequency processing section that is included with the circuit substrate and that processes high-frequency signals; and

a third shield wall that is connected with the shield layer and that fills a groove formed from the surface of the sealing member toward the main surface of the circuit substrate, the groove demarcating one or both mounting areas of the system section and power circuit section and a mounting area of the second high-frequency processing section.