Electromechanic microsensor

• US 8,850,886 B2
• Filed: 02/03/2010
• Issued: 10/07/2014
• Est. Priority Date: 02/27/2009
• Status: Active Grant

• Current Assignee: Hanking Electronics Hongkong Company Limited
• Original Assignee: Maxim Integrated Products, Inc. (Analog Devices, Inc.)
• Inventors: Kempe, Volker
• Primary Examiner(s): KWOK, HELEN C
• Application Number:
  US13/203,550
• Publication Number:
  US 20110308314A1
• Time in Patent Office: 1,707 Days
• Field of Search: 735/041.2, 735/041.4, 735/041.6, 735/040.4, 735/143.2, 735/10, 735/11
• US Class Current: 73/504.04
• CPC Class Codes: G01C 19/574 the devices having two sensing masses in anti-phase motion

Abstract

The invention relates to an electromechanic microsensor (MEMS) comprising drive elements which are moved linearly in an x-y plane and disposed on a substrate to determine at least two, preferably three, components of the yaw rate vector of a substrate, wherein two groups of drive elements are driven in directions running essentially at right angles to each other. The MEMS according to the invention is characterized in that the drive elements, which are moved at right angles to each other, are connected to one another to synchronize the movements via a coupling device that is rotatably mounted on the substrate.

Claims

1. A micro-electro-mechanical (MEMS) sensor comprising drive elements configured to move linearly along an x-y plane, the drive elements are arranged on a substrate to determine at least two components of a yaw rate vector, wherein a first group of drive elements that is configured to move perpendicularly to each other is connected by a first coupling device that is rotatably arranged on the substrate to synchronize the perpendicular movement, and wherein a second group of drive elements that is configured to move parallel to each other is connected by a second coupling device that synchronizes the parallel movement.

2. The MEMS sensor according to claim 1, wherein the second group of drive elements is stiff in a drive direction.

3. The MEMS sensor according to claim 1, wherein the first coupling device is a strut.

4. The MEMS sensor according claim 3, wherein the strut is configured to rotate around an anchor point.

5. The MEMS sensor according to claim 3, wherein the strut is arch-shaped.

6. The MEMS sensor according to claim 3, wherein the strut is circular.

7. The MEMS sensor according to claim 3, wherein the strut comprises:

a first end that is connected to a first drive element driven in x-direction; and

a second end that is connected to a second drive element driven in y-direction.

8. The MEMS sensor according to one of the claim 7, further comprising a spring device located between the strut and at least first or second drive element.

9. The MEMS sensor according to claim 8, wherein the spring device is stiff in a drive direction and elastic when perpendicular to the drive direction.

10. The MEMS sensor according to claim 1, wherein the drive elements comprise pairs of subsections that are configured to be driven in a drive direction.

11. The MEMS sensor according to claim 1, wherein a drive element is driven in an x-direction and anchored on the substrate in such a way that the drive element can be fully or partially deflected in a y-direction to detect a Coriolis force caused by a rotational movement of the substrate around a z-axis.

12. The MEMS sensor according to claim 1, wherein a drive element is driven in the y-direction and is arranged with an anchor on the substrate in such a way that the drive element can be fully or partially swiveled around the x-axis for recording a Coriolis force that occurs as a result of a rotational movement of the substrate around the x-axis.

13. The MEMS sensor according to claim 1, wherein a drive element is driven in the x-direction and anchored on the substrate in such a way that the drive element can be fully or partially swiveled around the y-axis to detect a Coriolis force caused by a rotational movement of the substrate around the y-axis.

14. The MEMS sensor according to claim 1, further comprising drive electrodes that are assigned to the drive elements.

15. The MEMS sensor according to claim 1, wherein the drive elements have substantially rectangular layout.

16. The MEMS sensor according to claim 1, wherein the drive elements comprise partial elements that are driven out-of-phase.

17. The MEMS sensor according to claim 16, further comprising a beam that is affixed on the substrate, at least two partial elements are tiltably arranged on the beam.