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Flexible circuit board interconnection and methods

  • US 8,851,356 B1
  • Filed: 06/10/2011
  • Issued: 10/07/2014
  • Est. Priority Date: 02/14/2008
  • Status: Active Grant
First Claim
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1. A method of connecting a plurality of flexible circuit boards together comprising the steps of:

  • applying an amount of a solder paste to an upper surface of a second flexible circuit board wherein the upper surface comprises one or more pads configured to receive a component;

    holding an upper surface of a first flexible circuit board and a lower surface of the second flexible circuit board together, such that the boards partially overlap one another forming a lap joint;

    reflowing the solder paste with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately;

    wherein reflowing the solder paste with a heat source results in solder flowing down through a hole in the second flexible circuit board; and

    confirming bonding of the first flexible circuit board and the second flexible circuit board together by inspecting the height of solder in the hole.

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