Flexible circuit board interconnection and methods
First Claim
1. A method of connecting a plurality of flexible circuit boards together comprising the steps of:
- applying an amount of a solder paste to an upper surface of a second flexible circuit board wherein the upper surface comprises one or more pads configured to receive a component;
holding an upper surface of a first flexible circuit board and a lower surface of the second flexible circuit board together, such that the boards partially overlap one another forming a lap joint;
reflowing the solder paste with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately;
wherein reflowing the solder paste with a heat source results in solder flowing down through a hole in the second flexible circuit board; and
confirming bonding of the first flexible circuit board and the second flexible circuit board together by inspecting the height of solder in the hole.
2 Assignments
0 Petitions
Accused Products
Abstract
Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately. In an embodiment the invention includes a circuit board clamp for holding flexible circuit boards together, the clamp including a u-shaped fastener; a spring tension arm connected to the u-shaped fastener; and an attachment mechanism connected to the spring tension arm. Other embodiments are also included herein.
250 Citations
15 Claims
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1. A method of connecting a plurality of flexible circuit boards together comprising the steps of:
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applying an amount of a solder paste to an upper surface of a second flexible circuit board wherein the upper surface comprises one or more pads configured to receive a component; holding an upper surface of a first flexible circuit board and a lower surface of the second flexible circuit board together, such that the boards partially overlap one another forming a lap joint; reflowing the solder paste with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately; wherein reflowing the solder paste with a heat source results in solder flowing down through a hole in the second flexible circuit board; and confirming bonding of the first flexible circuit board and the second flexible circuit board together by inspecting the height of solder in the hole. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method of connecting a plurality of flexible circuit boards together comprising the steps of:
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applying a solder paste to an upper surface of a second flexible circuit board, the upper surface of the second flexible circuit comprising one or more pads configured to receive a component; holding an upper surface of a first flexible circuit board and a lower surface of the second flexible circuit board together, such that the boards partially overlap one another forming a lap joint; reflowing the solder paste with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately; positioning one or more components on the upper surface of at least one of the first and second flexible circuit boards after the solder paste has been reflowed to bond the first flexible circuit board and the second flexible circuit board.
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Specification