Surfaces having particles and related methods
First Claim
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1. A method of embedding particles in a substrate, comprising:
- applying to at least a portion of a substrate a fluid and a population of particles comprising metallic nanowires, such that the substrate is softened to at least a degree that a plurality of individual particles is at least partially embedded in the softened portion of the substrate; and
hardening the softened portion of the substrate so as to securely embed the plurality of particles in the substrate,wherein the plurality of particles securely embedded in the substrate forms a conductive pathway by touching or proximity of the particles to one another.
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Abstract
Particles are embedded in a substrate by applying to at least a portion of the substrate a fluid and a population of particles, such that the substrate is softened to at least a degree that particles are at least partially embedded in the softened portion of the substrate. The softened portion of the substrate is hardened so as to securely embed the particles in the substrate.
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Citations
16 Claims
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1. A method of embedding particles in a substrate, comprising:
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applying to at least a portion of a substrate a fluid and a population of particles comprising metallic nanowires, such that the substrate is softened to at least a degree that a plurality of individual particles is at least partially embedded in the softened portion of the substrate; and hardening the softened portion of the substrate so as to securely embed the plurality of particles in the substrate, wherein the plurality of particles securely embedded in the substrate forms a conductive pathway by touching or proximity of the particles to one another. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of embedding particles in a substrate, comprising:
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providing a substrate; providing a population of particles selected from at least one of nanowires, nanorods, and nanotubes; and using a fluid, softening the substrate such that one or more of the population of particles is at least partially embedded in the substrate, wherein at least one individual particle of the population of particles is fully embedded below a surface of the substrate, wherein multiple ones of the population of particles are embedded in the substrate to form a conductive pathway by touching or proximity of the particles to one another. - View Dependent Claims (12, 13, 14, 15, 16)
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Specification