Surfaces having particles and related methods

• US 8,852,689 B2
• Filed: 05/29/2008
• Issued: 10/07/2014
• Est. Priority Date: 05/29/2007
• Status: Active Grant

• Current Assignee: TPK Holding Co., Ltd.
• Original Assignee: Innova Dynamics, Inc. (TPK Holding Co., Ltd.)
• Inventors: Srinivas, Arjun Daniel, Peng, Calvin, Mittal, Alexander Chow, Agarwal, Priyanka
• Primary Examiner(s): WEDDLE, ALEXANDER MARION
• Application Number:
  US12/601,869
• Publication Number:
  US 20100230344A1
• Time in Patent Office: 2,322 Days
• Field of Search: 210/285, 252/182.11, 427/180, 427/314, 427/374.1, 427/420, 427/336, 427/340, 427/322, 977/742, 977/842
• US Class Current: 427/307
• CPC Class Codes: A01N 2300/00 Combinations or mixtures of active ingredients covered by classes A01N27/00 - A01N65/48 with other active or formulation relevant ingredients, e.g. specific carrier materials or surfactants, covered by classes A01N25/00 - A01N65/48
• CPC Class Codes: A01N 25/08 containing solids as carriers or diluents
• CPC Class Codes: A01N 25/10 Macromolecular compounds
• CPC Class Codes: A01N 25/34 Shaped forms, e.g. sheets, not provided for in any other sub-group of this main group
• CPC Class Codes: A01N 59/16 Heavy metals; Compounds thereof
• CPC Class Codes: B05D 2401/32 applied as powders
• CPC Class Codes: B05D 2601/28 Metals
• CPC Class Codes: B05D 3/002 Pretreatement
• CPC Class Codes: B05D 3/10 by other chemical means
• CPC Class Codes: B05D 7/02 to macromolecular substances, e.g. rubber treatment or coating of shaped articles made of macromolecular substances C08J7/00
• CPC Class Codes: B29C 2059/023 Microembossing
• CPC Class Codes: B29C 2059/028 Incorporating particles by impact in the surface, e.g. using fluid jets or explosive forces to implant particles
• CPC Class Codes: B29C 59/022 characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
• CPC Class Codes: C08J 7/02 with solvents, e.g. swelling agents
• CPC Class Codes: C08J 7/0427 with only one layer of a composition containing a polymer binder with more layers C08J7/042
• CPC Class Codes: C08J 7/044 Forming conductive coatings; Forming coatings having anti-static properties
• CPC Class Codes: C08J 7/046 Forming abrasion-resistant coatings; Forming surface-hardening coatings
• CPC Class Codes: G01N 33/48 Biological material, e.g. blood, urine G01N33/02, G01N33/26, G01N33/44, G01N33/46 take precedence; Haemocytometers counting blood corpuscules distributed over a surface by scanning the surface G06M11/02
• CPC Class Codes: H01B 1/22 the conductive material comprising metals or alloys

Abstract

Particles are embedded in a substrate by applying to at least a portion of the substrate a fluid and a population of particles, such that the substrate is softened to at least a degree that particles are at least partially embedded in the softened portion of the substrate. The softened portion of the substrate is hardened so as to securely embed the particles in the substrate.

Claims

1. A method of embedding particles in a substrate, comprising:

applying to at least a portion of a substrate a fluid and a population of particles comprising metallic nanowires, such that the substrate is softened to at least a degree that a plurality of individual particles is at least partially embedded in the softened portion of the substrate; and

hardening the softened portion of the substrate so as to securely embed the plurality of particles in the substrate,

wherein the plurality of particles securely embedded in the substrate forms a conductive pathway by touching or proximity of the particles to one another.

2. The method of claim 1, wherein applying the fluid and the population of particles comprises softening the substrate using the fluid.

3. The method of claim 1, wherein the fluid comprises a solvent that softens the substrate, and wherein applying the fluid and the population of particles comprises disposing the population of particles in the fluid, and applying the fluid and the population of particles over the substrate.

4. The method of claim 1, wherein the fluid further comprises a salt, a surfactant, a stabilizer to inhibit inter-particle agglomeration, or any combination thereof.

5. The method of claim 1, wherein the population of particles is disposed in the fluid at a concentration up to 4 wt %.

6. The method of claim 1, wherein applying the fluid and the population of particles further comprises application of a magnetic field or an electric field to control a degree of embedding of at least one particle.

7. The method of claim 1, wherein the population of particles comprises silver.

8. The method of claim 1, wherein the substrate comprises a polymer.

9. The method of claim 1, wherein at least one of the plurality of particles is fully embedded below a surface of the substrate.

10. The method of claim 1, wherein the plurality of particles securely embedded within the substrate forms a conductive pathway by touching of the particles to one another.

11. A method of embedding particles in a substrate, comprising:

providing a substrate;

providing a population of particles selected from at least one of nanowires, nanorods, and nanotubes; and

using a fluid, softening the substrate such that one or more of the population of particles is at least partially embedded in the substrate,

wherein at least one individual particle of the population of particles is fully embedded below a surface of the substrate,

wherein multiple ones of the population of particles are embedded in the substrate to form a conductive pathway by touching or proximity of the particles to one another.

12. The method of claim 11, wherein the population of particles is disposed in the fluid.

13. The method of claim 11, wherein softening the substrate comprises applying the fluid to the substrate.

14. The method of claim 11, wherein the substrate comprises a polymer, and the fluid comprises a solvent for the polymer.

15. The method of claim 11, wherein the population of particles comprises metallic nanowires.

16. The method of claim 11, further comprising removing at least a portion of the fluid to harden the substrate.