THz-wave generation /detection modules and devices including the same

• US 8,853,633 B2
• Filed: 12/02/2011
• Issued: 10/07/2014
• Est. Priority Date: 12/16/2010
• Status: Expired due to Fees

• Current Assignee: Electronics and Telecommunications Research Institute
• Original Assignee: Electronics and Telecommunications Research Institute
• Inventors: Han, Sang-Pil, Park, Kyung Hyun, Ko, Hyunsung, Kim, Namje, Lee, Chul-Wook, Lee, Dong-Hun, Leem, Young Ahn
• Primary Examiner(s): Sung, Christine
• Application Number:
  US13/309,583
• Publication Number:
  US 20120153161A1
• Time in Patent Office: 1,040 Days
• Field of Search: 250/353, 250/341.1
• US Class Current: 250/353
• CPC Class Codes: G01J 3/42 Absorption spectrometry; Double beam spectrometry; Flicker spectrometry; Reflection spectrometry beam switching arrangements G01J3/08

Abstract

Provided are a THz-wave generation/detection module and a device including the same, which increase heating efficiency and are miniaturized. The module includes a photomixer chip, a lens, a PCB, and a package. The photomixer chip includes an active layer, an antenna, and a plurality of electrode pads. The lens is disposed on the photomixer chip. The PCB includes a plurality of solder balls connected to the electrode pads, under the photomixer chip. The package surrounds a bottom and side of the PCB, and dissipates heating of the active layer, which is transferred from the electrode pad of the photomixer chip to the PCB, to outside.

Claims

1. A THz-wave generation/detection module comprising:

a photomixer chip comprising an active layer, an antenna, and a plurality of electrode pads;

a lens disposed on the photomixer chip;

a Printed Circuit Board (PCB) comprising a plurality of solder balls connected to the electrode pads, under the photomixer chip; and

a package surrounding a bottom and side of the PCB, and dissipating heating of the active layer, which is transferred from the electrode pads of the photomixer chip to the PCB, to outside,

wherein the PCB further comprises;

a substrate body having a first center hole at a center thereof, and having a first outer hole at an edge of the first center hole;

a plurality of via electrodes vertically connected to the solder balls, in the substrate body; and

a plurality of ground plates horizontally connected to the via electrodes.

2. The THz-wave generation/detection module of claim 1, wherein the ground plates are connected to a bottom and side of the substrate body in the package.

3. The THz-wave generation/detection module of claim 2, further comprising a conductive adhesive bonding and fixing the PCB and the package.

4. The THz-wave generation/detection module of claim 3, wherein the package comprises:

a lower package covering and contacting the second surface and the side of the PCB; and

an upper package fixing the lens onto the lower package.

5. The THz-wave generation/detection module of claim 4, wherein the lower package comprises:

a package body having a second center hole formed at a center thereof, and having a second outer hole formed at an edge of the second center hole; and

a trench formed adjacently to the second outer hole in a fan shape.

6. The THz-wave generation/detection module of claim 5, further comprising:

a bias electrode insulated from the via electrodes and the ground plates; and

a power service line connected to the ground plates, and inserted into the first and second outer holes.

7. The THz-wave generation/detection module of claim 4, wherein the upper package comprises:

a support package supporting the lens; and

a cover package covering a side of the lens, on the support package.

8. The THz-wave generation/detection module of claim 7, wherein the upper package further comprises a first junction part connecting the support package and the cover package.

9. The THz-wave generation/detection module of claim 7, wherein the package further comprises a second junction part connecting the support package and the lower package.

10. The THz-wave generation/detection module of claim 1, wherein the substrate body comprises aluminum nitride.

11. The THz-wave generation/detection module of claim 1, further comprising at least one of:

a grating layer formed at an upper surface of the photomixer chip or a bottom of the lens; and

a black matrix layer formed at an upper surface of the lens.

12. A THz-wave generation/detection device comprising:

an optical fiber transferring a pulse or continuous wave laser beam having a plurality of wavelengths;

an optical fiber assembly module fixing an end of the optical fiber; and

a THz-wave generation/detection module,

wherein the THz-wave generation/detection module comprises;

a photomixer chip comprising an active layer generating a THz wave from the pulse or continuous wave laser beam in the optical fiber fixed in the optical fiber assembly module, an antenna, and a plurality of electrode pads;

a lens disposed on the photomixer chip;

a Printed Circuit Board (PCB) comprising a plurality of solder balls connected to the electrode pads, under the photomixer chip facing the lens;

a package surrounding a bottom and side of the PCB, and dissipating heating of the active layer, which is transferred from the electrode pads of the photomixer chip to the PCB, to outside;

a ferrule aligning the optical fiber in the optical fiber fixing module; and

an aspherical lens focusing the pulse or continuous wave laser beam, which is emitted from the optical fiber aligned in the ferrule, to the active layer,

wherein the optical fiber assembly module comprises;

first to third housings fixing the ferrule and the aspherical lens;

a boot connected to the first housing; and

a connection ring fixing the third housing to the lower package.

13. The THz-wave generation/detection device of claim 12, wherein an end of the optical fiber aligned in the ferrule has an inclined angle of about eight degrees.

14. The THz-wave generation/detection device of claim 12, wherein the aspherical lens has an inclined angle of about five degrees.