Semiconductor device
First Claim
1. A semiconductor device comprising:
- an insulating layer including a first region;
a source electrode layer over the insulating layer;
a drain electrode layer over the insulating layer;
an oxide semiconductor layer over the source electrode layer and the drain electrode layer, the oxide semiconductor layer including a second region and a third region; and
a gate insulating layer over the oxide semiconductor layer, the gate insulating layer including a fourth region;
wherein;
the first region is in contact with the second region;
the third region is in contact with the fourth region; and
a concentration of hydrogen in a part of the insulating layer is greater than zero and less than 6×
1020 atoms/cm3.
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Accused Products
Abstract
In a transistor having a top-gate structure in which a gate electrode layer overlaps with an oxide semiconductor layer which forms a channel region with a gate insulating layer interposed therebetween, when a large amount of hydrogen is contained in the insulating layer, hydrogen is diffused into the oxide semiconductor layer because the insulating layer is in contact with the oxide semiconductor layer; thus, electric characteristics of the transistor are degraded. An object is to provide a semiconductor device having favorable electric characteristics. An insulating layer in which the concentration of hydrogen is less than 6×1020 atoms/cm3 is used for the insulating layer being in contact with oxide semiconductor layer which forms the channel region. Using the insulating layer, diffusion of hydrogen can be prevented and a semiconductor device having favorable electric characteristics can be provided.
138 Citations
23 Claims
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1. A semiconductor device comprising:
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an insulating layer including a first region; a source electrode layer over the insulating layer; a drain electrode layer over the insulating layer; an oxide semiconductor layer over the source electrode layer and the drain electrode layer, the oxide semiconductor layer including a second region and a third region; and a gate insulating layer over the oxide semiconductor layer, the gate insulating layer including a fourth region; wherein; the first region is in contact with the second region; the third region is in contact with the fourth region; and a concentration of hydrogen in a part of the insulating layer is greater than zero and less than 6×
1020 atoms/cm3. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A semiconductor device comprising:
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an insulating layer including a first region; an oxide semiconductor layer over the insulating layer, the oxide semiconductor layer including a second region and a third region; a source electrode layer electrically connected to the oxide semiconductor layer; a drain electrode layer electrically connected to the oxide semiconductor layer; and a gate insulating layer over the source electrode layer and the drain electrode layer, the gate insulating layer including a fourth region, wherein; the first region is in contact with the second region; the third region is in contact with the fourth region; and a concentration of hydrogen in a part of the insulating layer is greater than zero and less than 6×
1020 atoms/cm3. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A method for manufacturing a semiconductor device comprising the steps of:
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forming an insulating layer by plasma CVD using SiF4 as a deposition gas; forming a source electrode layer and a drain electrode layer over the insulating layer; forming an oxide semiconductor layer over the insulating layer; and forming a gate insulating layer over the source electrode layer, the drain electrode layer and the oxide semiconductor layer, wherein the source electrode layer is in contact with the oxide semiconductor layer, wherein the drain electrode layer is in contact with the oxide semiconductor layer, wherein the gate insulating layer is over the source electrode layer and the drain electrode layer, and the gate insulating layer is in contact with the oxide semiconductor layer, and wherein a concentration of hydrogen in a part of the insulating layer is greater than zero and less than 6×
1020 atoms/cm3. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23)
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Specification