Method of making an electronic device with a curved backplate
First Claim
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1. A method of making an electronic device, comprising:
- providing a device comprising a substrate comprising a first surface and a second surface, wherein the second surface is generally flat, the device further comprising an array of microelectromechanical devices formed on the first surface of the substrate; and
sealing a back-plate over the array of the device under ambient pressure, wherein the ambient pressure is higher than vacuum, the back-plate having an interior surface and an exterior surface, the interior surface facing the array with a gap therebetween, the exterior surface facing away from the substrate, wherein a portion of at least one of the interior surface or the exterior surface is curved relative to the second surface of the substrate.
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Abstract
A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate includes a curved portion relative to the substrate. The curved portion is substantially throughout the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package.
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Citations
24 Claims
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1. A method of making an electronic device, comprising:
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providing a device comprising a substrate comprising a first surface and a second surface, wherein the second surface is generally flat, the device further comprising an array of microelectromechanical devices formed on the first surface of the substrate; and sealing a back-plate over the array of the device under ambient pressure, wherein the ambient pressure is higher than vacuum, the back-plate having an interior surface and an exterior surface, the interior surface facing the array with a gap therebetween, the exterior surface facing away from the substrate, wherein a portion of at least one of the interior surface or the exterior surface is curved relative to the second surface of the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of making an electronic device, comprising:
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providing a device comprising a substrate and an array of microelectromechanical devices formed on the substrate; and sealing a back-plate over the array of the device under ambient pressure, wherein the ambient pressure is higher than vacuum, the back-plate having an interior surface and an exterior surface, the interior surface facing the array with a gap therebetween, the exterior surface facing away from the substrate, wherein a distance between the interior surface and the substrate varies across the substrate. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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Specification