Micro-electromechanical system devices

• US 8,853,803 B2
• Filed: 08/10/2012
• Issued: 10/07/2014
• Est. Priority Date: 02/14/2011
• Status: Active Grant

• Current Assignee: ROHM Co., Ltd.
• Original Assignee: Kionix Incorporated (ROHM Co., Ltd.)
• Inventors: Adams, Scott G., Minnick, Andrew J., Blackmer, Charles W., Devoe, Mollie K.
• Primary Examiner(s): Nguyen, Thinh T
• Application Number:
  US13/571,844
• Publication Number:
  US 20130026584A1
• Time in Patent Office: 788 Days
• Field of Search: 257/108, 257/415, 257/E29.324, 438/48, 438/50, 438/54
• US Class Current: 257/415
• CPC Class Codes: B81B 2201/0235 Accelerometers
• CPC Class Codes: B81B 2207/07 Interconnects
• CPC Class Codes: B81B 3/0008 Structures for avoiding electrostatic attraction, e.g. avoiding charge accumulation
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: H01H 59/0009 making use of micromechanics
• CPC Class Codes: H01L 29/747 Bidirectional devices, e.g. triacs
• CPC Class Codes: H01L 29/87 Thyristor diodes, e.g. Shockley diodes, break-over diodes

Abstract

A micro-electromechanical system (MEMS) device can include a substrate and a first beam suspended relative to a substrate surface. The first beam can include a first portion and a second portion that are separated by an isolation joint made of an insulative material. The first and second portions can each include a first semiconductor and a first dielectric layer. The MEMS device can also include a second beam suspended relative to the substrate surface. The second beam can include a second semiconductor and a second dielectric layer to promote curvature of the second beam. The MEMS device can also include a third beam suspended relative to the substrate surface. The third beam consists essentially of a first material. The second beam is configured to move relative to the third beam in response to an acceleration along an axis perpendicular to the surface of the substrate.

Claims

1. A micro-electromechanical system (MEMS) device, comprising:

a substrate;

a first beam suspended relative to a surface of the substrate, the first beam comprising a first portion and a second portion that are separated by an isolation joint, the isolation joint comprising an insulative material, wherein the first and second portions each comprise a first semiconductor and a first dielectric layer;

a second beam suspended relative to the surface of the substrate, the second beam comprising a second semiconductor and a second dielectric layer to promote curvature of the second beam; and

a third beam suspended relative to the surface of the substrate, the third beam consisting essentially of a first material;

wherein the second beam is configured to move relative to the third beam in response to an acceleration along an axis perpendicular to the surface of the substrate.

2. The MEMS device of claim 1, wherein the first material comprises a third semiconductor.

3. The MEMS device of claim 2, wherein the first, second, and third semiconductors are silicon.

4. The MEMS device of claim 1, wherein each of the first, second, and third beams has a profile defining a side wall, and wherein the side wall of each of the first, second, and third beams has substantially no dielectric layer disposed thereon.

5. The MEMS device of claim 1, further comprising an electrically conductive trace that is mechanically coupled to the first beam and electrically coupled to the first semiconductor of the second portion but not the first semiconductor of the first portion.

6. The MEMS device of claim 5, wherein the electrically conductive trace comprises a metal.

7. The MEMS device of claim 1, wherein the movement of the second beam relative to the third beam is used in a capacitance-based displacement transducer.

8. A computer-program product comprising a computer-readable storage medium containing instructions that, if executed on a computing device, define a micro-electromechanical device comprising:

a substrate;

a first beam suspended relative to a surface of the substrate, the first beam comprising a first portion and a second portion that are separated by an isolation joint, the isolation joint comprising an insulative material, wherein the first and second portions each comprise a first semiconductor and a first dielectric layer;

a second beam suspended relative to the surface of the substrate, the second beam comprising a second semiconductor and a second dielectric layer to promote curvature of the second beam; and

a third beam suspended relative to the surface of the substrate, the third beam consisting essentially of a first material;

wherein the second beam is configured to move relative to the third beam in response to an acceleration along an axis perpendicular to the surface of the substrate.

9. The computer-program product of claim 8, wherein the first material comprises a third semiconductor.

10. The computer-program product of claim 9, wherein the first, second, and third semiconductors are silicon.

11. The computer-program product of claim 8, wherein each of the first, second, and third beams has a profile defining a side wall, and wherein the side wall of each of the first, second, and third beams has substantially no dielectric layer disposed thereon.

12. The computer-program product of claim 8, wherein the micro-electromechanical device further comprises an electrically conductive trace that is mechanically coupled to the first beam and electrically coupled to the first semiconductor of the second portion but not the first semiconductor of the first portion.

13. The computer-program product of claim 12, wherein the electrically conductive trace comprises a metal.

14. The computer-program product of claim 8, wherein the movement of the second beam relative to the third beam is used in a capacitance-based displacement transducer.

15. A hand-held device comprising:

a micro-electromechanical system (MEMS) device comprising;

a substrate;

a first beam suspended relative to a surface of the substrate, the first beam comprising a first portion and a second portion that are separated by an isolation joint, the isolation joint comprising an insulative material, wherein the first and second portions each comprise a first semiconductor and a first dielectric layer;

a second beam suspended relative to the surface of the substrate, the second beam comprising a second semiconductor and a second dielectric layer to promote curvature of the second beam; and

a third beam suspended relative to the surface of the substrate, the third beam consisting essentially of a first material;

wherein the second beam is configured to move relative to the third beam in response to an acceleration along an axis perpendicular to the surface of the substrate.

16. The hand-held device of claim 15, wherein the first material comprises a third semiconductor.

17. The hand-held device of claim 16, wherein the first, second, and third semiconductors are silicon.

18. The hand-held device of claim 15, wherein the movement of the second beam relative to the third beam is used in a capacitance-based displacement transducer.