Sensor assembly and method of measuring the proximity of a machine component to a sensor
First Claim
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1. A microwave sensor assembly comprising:
- a signal processing device for generating at least one microwave signal that includes a pattern of frequencies, wherein the signal processing device is configured to;
calculate a first amount of a microwave signal power contained in the at least one microwave signal;
calculate a second amount of a loading signal power contained in the loading signal; and
calculate a proximity of an object to the emitter based on a difference between the first amount of the microwave signal power and the second amount of the loading signal power; and
at least one probe coupled to the signal processing device, the at least one probe comprising an emitter configured to generate an electromagnetic field from the at least one microwave signal, wherein the emitter is detuned when an object is positioned within the electromagnetic field such that a loading signal is reflected from the emitter to the signal processing device.
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Abstract
A microwave sensor assembly includes a signal processing device for generating at least one microwave signal that includes a pattern of frequencies and at least one probe coupled to the signal processing device. The probe includes an emitter configured to generate an electromagnetic field from the at least one microwave signal, wherein the emitter is detuned when an object is positioned within the electromagnetic field such that a loading signal is reflected from the emitter to the signal processing device.
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Citations
22 Claims
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1. A microwave sensor assembly comprising:
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a signal processing device for generating at least one microwave signal that includes a pattern of frequencies, wherein the signal processing device is configured to; calculate a first amount of a microwave signal power contained in the at least one microwave signal; calculate a second amount of a loading signal power contained in the loading signal; and calculate a proximity of an object to the emitter based on a difference between the first amount of the microwave signal power and the second amount of the loading signal power; and at least one probe coupled to the signal processing device, the at least one probe comprising an emitter configured to generate an electromagnetic field from the at least one microwave signal, wherein the emitter is detuned when an object is positioned within the electromagnetic field such that a loading signal is reflected from the emitter to the signal processing device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 18, 20)
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8. A power system comprising:
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a machine comprising at least one component; and a microwave sensor assembly positioned proximate to the at least one component, the microwave sensor assembly comprising; a signal processing device for generating at least one microwave signal that includes a pattern of frequencies, wherein the signal processing device is configured to; calculate a first amount of a microwave signal power contained in the at least one microwave signal; calculate a second amount of a loading signal power contained in the loading signal; and calculate a proximity of the at least one component to the emitter based on a difference between the first amount of the microwave signal power and the second amount of the loading signal power; and at least one probe coupled to the signal processing device, the at least one probe comprising an emitter configured to generate an electromagnetic field from the at least one microwave signal, wherein the emitter is detuned when an object is positioned within the electromagnetic field such that a loading signal is reflected from the emitter to the signal processing device. - View Dependent Claims (9, 10, 11, 12, 13, 14, 19, 21)
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15. A method for measuring a proximity of a machine component relative to an emitter, the method comprising:
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transmitting at least one microwave signal that includes a pattern of frequencies to the emitter; generating an electromagnetic field from the at least one microwave signal; generating a loading signal representative of a disruption of the electromagnetic field when the machine component is positioned within the electromagnetic field; calculating a first amount of a microwave signal power contained in the at least one microwave signal; calculating a second amount of a loading signal power contained in the loading signal; and calculating the proximity of the machine component to the emitter based on a difference between the first amount of the microwave signal power and the second amount of the loading signal power; and calculating the proximity of the machine component to the emitter based on the loading signal. - View Dependent Claims (16, 17, 22)
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Specification