Method and apparatus for providing metric relating two or more process parameters to yield

• US 8,856,698 B1
• Filed: 03/15/2013
• Issued: 10/07/2014
• Est. Priority Date: 03/15/2013
• Status: Expired due to Fees

• Current Assignee: GlobalFoundries, Inc.
• Original Assignee: GlobalFoundries, Inc.
• Inventors: Latypov, Azat
• Primary Examiner(s): LEVIN, NAUM B
• Application Number:
  US13/833,104
• Publication Number:
  US 20140282307A1
• Time in Patent Office: 571 Days
• Field of Search: 716 53- 54, 716/56
• US Class Current: 716/56
• CPC Class Codes: G06F 2119/18 Manufacturability analysis or optimisation for manufacturability
• CPC Class Codes: G06F 30/39 Circuit design at the physical level physical level design for reconfigurable circuits G06F30/347
• CPC Class Codes: Y02P 90/02 Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Abstract

A process and apparatus are provided for generating and evaluating one or more metrics for analyzing the design and manufacture of semiconductor devices. Embodiments include scanning a drawn semiconductor design layout to determine a difficult-to-manufacture pattern within the drawn semiconductor design layout based on a match with a pre-characterized difficult-to-manufacture pattern determining a corrected pattern based on a pre-determined correlation between the corrected pattern and the pre-characterized difficult-to-manufacture pattern, and replacing the difficult-to-manufacture pattern with the corrected pattern within the drawn semiconductor design layout.

Claims

1. A method comprising:

determining two or more parameters associated with designing a semiconductor device;

determining two or more layers associated with designing the semiconductor device;

determining a process window associated with acceptable limits of the two or more parameters;

correlating distributions of the two or more parameters between the two or more layers; and

applying, by a processor, a probability density function and the correlated distribution of the two or more parameters to the process window to generate a yield metric that relates the two or more parameters to yield.

2. The method according to claim 1, further comprising:

optimizing the two or more parameters to generate two or more optimal parameters; and

applying the probability density function based on the two or more optimal parameters.

3. The method according to claim 1, comprising:

applying the probability density function according to uncorrelated normal distributions for the two or more parameters.

4. The method according to claim 1, comprising:

applying the probability density function according to at least one of correlated distributions and spatially varying distributions for the two or more parameters.

5. The method according to claim 1, further comprising:

evaluating the yield metric with respect to at least one of an optical proximity correction (OPC) model and a source mask optimization (SMO) model.

6. The method according to claim 5, further comprising:

maximizing a value associated with the yield metric with respect to the at least one of the OPC model and the SMO model.

7. The method according to claim 1, wherein the two or more parameters are exposure focus and exposure dosage.

8. The method according to claim 1, wherein the probability density function is a Gaussian probability density function.

9. An apparatus comprising:

at least one processor; and

at least one memory including computer program code for one or more programs, the at least one memory and the computer program code configured to, with the at least one processor, cause the apparatus to perform at least the following,

determine two or more parameters associated with designing a semiconductor device;

determine two or more layers associated with designing the semiconductor device;

determine a process window associated with acceptable limits of the two or more parameters;

correlate distributions of the two or more parameters between the two or more layers; and

apply a probability density function and the correlated distribution of the two or more parameters to the process window to generate a yield metric that relates the two or more parameters to yield.

10. The apparatus according to claim 9, wherein the apparatus is further caused to:

optimize the two or more parameters to generate two or more optimal parameters; and

apply the probability density function based on the two or more optimal parameters.

11. The apparatus according to claim 9, wherein the apparatus is further caused to:

apply the probability density function according to uncorrelated normal distributions for the two or more parameters.

12. The apparatus according to claim 9, wherein the apparatus is further caused to:

apply the probability density function according to at least one of correlated distributions and spatially varying distributions for the two or more parameters.

13. The apparatus according to claim 9, wherein the apparatus is further caused to:

evaluate the yield metric with respect to at least one of an optical proximity correction (OPC) model and a source mask optimization (SMO) model.

14. The apparatus according to claim 13, wherein the apparatus is further caused to:

maximize a value associated with the yield metric with respect to the at least one of the OPC model and the SMO model.

15. The apparatus according to claim 9, wherein the two or more parameters are exposure focus and exposure dosage.

16. The apparatus according to claim 9, wherein the probability density function is a Gaussian probability density function.

17. A method comprising:

determining two or more layers associated with designing a semiconductor device;

determining two or more parameters, including exposure dosage and exposure focus, associated with designing a semiconductor device, wherein one or more of the parameters are associated with one or more of the layers;

determining one or more process windows associated with acceptable limits of the two or more parameters;

correlating distributions of the two or more parameters between at least two of the two or more layers; and

applying, by a processor, a Gaussian probability density function and the correlated distribution of the two or more parameters according to the one or more process windows to generate a yield metric that relates the two or more parameters to yield.

18. The method according to claim 17, further comprising:

evaluating the yield metric with respect to at least one of an optical proximity correction (OPC) model and a source mask optimization (SMO) model; and

maximizing a value associated with the yield metric with respect to the at least one of the OPC model and the SMO model to maximize a cost function.