Apparatus and method for thermal dissipation in a light
First Claim
1. A device for producing light, comprising:
- a housing configured to receive a light producing assembly that includes at least one electronics package which generates heat; and
a plurality of vents configured in the housing to permit an air flow through the housing to conduct the generated heat out of the housing, wherein the light producing assembly comprises;
a plurality of printed circuit boards (PCBs) spaced at an interval and connected by a plurality of pins, the plurality of pins being configured to conduct at least a portion of the generated heat from the at least one electronics package mounted on at least one of the PCBs into the interval so that the air flow passes through the interval and out of the housing, wherein the plurality of PCBs comprise;
a first printed circuit board (PCB) that includes a first PCB first surface and the at least one electronics package disposed on the first PCB first surface;
a second PCB; and
the plurality of pins arranged with the first PCB to the second PCB, the plurality of pins forming an array within the interval, wherein at least a portion of the plurality of pins connect to the first PCB proximate the at least one electronics package such that at least a portion of heat generated by the at least one electronics package, and wherein the first PCB further comprises;
a first PCB second surface;
a first core;
a first metal layer configured to define a first trace disposed on the first core first surface; and
a second metal layer configured to define a second trace disposed on the first core second surface, wherein the first core is interposed between the first metal layer and the second metal layer, and wherein the first trace is in electrical communication with the second trace, and wherein one electronics package is in electrical communication with the first trace.
1 Assignment
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Accused Products
Abstract
A device for producing light may include one or more printed circuit boards (PCBs), an electronics package may be disposed about a first surface of one or more of the PCBs and a housing. A plurality of the PCBs may be set apart and connected by pins to dissipate heat from one PCB to another, and/or to convey electrical connectivity. Pins may be configured to pass through or into one or both the PCBs including the cores to conduct heat generated by the electronics package away for dispersion. In some embodiments, the pins may pass into the backplane. The PCBs may include LEDs, lights, computer devices, memories, telecommunications devices, or combinations of these. The device may also include a housing to contain the plurality of PCBs such that air flow may enter the housing and pass by the pins for cooling of the PCBs and electronics thereof.
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Citations
17 Claims
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1. A device for producing light, comprising:
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a housing configured to receive a light producing assembly that includes at least one electronics package which generates heat; and a plurality of vents configured in the housing to permit an air flow through the housing to conduct the generated heat out of the housing, wherein the light producing assembly comprises; a plurality of printed circuit boards (PCBs) spaced at an interval and connected by a plurality of pins, the plurality of pins being configured to conduct at least a portion of the generated heat from the at least one electronics package mounted on at least one of the PCBs into the interval so that the air flow passes through the interval and out of the housing, wherein the plurality of PCBs comprise; a first printed circuit board (PCB) that includes a first PCB first surface and the at least one electronics package disposed on the first PCB first surface; a second PCB; and the plurality of pins arranged with the first PCB to the second PCB, the plurality of pins forming an array within the interval, wherein at least a portion of the plurality of pins connect to the first PCB proximate the at least one electronics package such that at least a portion of heat generated by the at least one electronics package, and wherein the first PCB further comprises; a first PCB second surface; a first core; a first metal layer configured to define a first trace disposed on the first core first surface; and a second metal layer configured to define a second trace disposed on the first core second surface, wherein the first core is interposed between the first metal layer and the second metal layer, and wherein the first trace is in electrical communication with the second trace, and wherein one electronics package is in electrical communication with the first trace. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. An apparatus, comprising:
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a housing having a circumference larger at a first end greater than a second end and configured to receive a light assembly having two printed circuit boards (PCBs) held apart at an interval by a plurality of pins In convey heat generated by at least one PCB into the interval; and a plurality of fins configured to create a plurality of vents in the housing, the plurality of vents configured to be proximate the interval for permitting air flow into the housing and past the plurality of pins for conveying generated heat out of the housing. - View Dependent Claims (15, 16, 17)
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Specification