Photosensitive modified polyimide resin composition and use thereof
First Claim
1. A photosensitive modified polyimide resin composition, which comprises a modified polyimide represented by the following Formula (I):
1 Assignment
0 Petitions
Accused Products
Abstract
Disclosed are: a photosensitive modified polyimide resin composition having photo-fabrication property, which is excellent in the electric properties and adhesion as well as in the heat resistance, flexibility, bending property, low warping, chemical resistance and storage stability; a resin film formed from the composition; and a printed circuit board, flexible printed circuit board (FPC) and the like which comprises the film as an insulating protective film and/or interlayer insulation film. The photosensitive modified polyimide resin composition comprises a modified polyimide of a specific structure having a flexible structure such as polycarbonate; a photosensitizer; a curing agent; and a solvent.
7 Citations
11 Claims
- 1. A photosensitive modified polyimide resin composition, which comprises a modified polyimide represented by the following Formula (I):
Specification