Semiconductor wafer carrier and method of manufacturing
First Claim
Patent Images
1. A method of forming a semiconductor device comprising:
- providing a semiconductor wafer comprising a substrate and one or more through-substrate vias extending into a part of the substrate;
providing a carrier comprising one or more ionic dopants, the one or more ionic dopants having a concentration greater than 5×
1014 cm−
1;
attaching the semiconductor wafer to the carrier using a removable medium; and
removing the carrier from the semiconductor wafer.
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Abstract
A system and method for a semiconductor wafer carrier is disclosed. An embodiment comprises a semiconductor wafer carrier wherein conductive dopants are implanted into the carrier in order to amplify the coulombic forces between an electrostatic chuck and the carrier to compensate for reduced forces that result from thinner semiconductor wafers. Another embodiment forms conductive layers and vias within the carrier instead of implanting conductive dopants.
43 Citations
20 Claims
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1. A method of forming a semiconductor device comprising:
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providing a semiconductor wafer comprising a substrate and one or more through-substrate vias extending into a part of the substrate; providing a carrier comprising one or more ionic dopants, the one or more ionic dopants having a concentration greater than 5×
1014 cm−
1;attaching the semiconductor wafer to the carrier using a removable medium; and removing the carrier from the semiconductor wafer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 20)
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9. A method of manufacturing a semiconductor device, the method comprising:
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providing a carrier, the carrier comprising a first substrate and one or more ionic dopants located within the first substrate; attaching the carrier to a first side of a semiconductor wafer, the semiconductor wafer comprising a semiconductor substrate and at least one conductive via extending through the semiconductor substrate, wherein the at least one conductive via is located within the semiconductor substrate during the attaching the carrier to the first side of the semiconductor wafer; and adhering the carrier to an electrostatic chuck using coulombic forces. - View Dependent Claims (10, 11)
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12. A method of manufacturing a semiconductor device, the method comprising:
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providing a carrier wafer with an ionic dopant located within the carrier wafer; forming one or more conductive vias through a semiconductor wafer; attaching the semiconductor wafer to the carrier wafer after the forming the one or more conductive vias; and applying a voltage to an electrode within an electrostatic chuck to hold the carrier wafer to the electrostatic chuck. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19)
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Specification