Light emitting device packages, systems and methods

• US 8,860,043 B2
• Filed: 02/02/2011
• Issued: 10/14/2014
• Est. Priority Date: 06/05/2009
• Status: Active Grant

• Current Assignee: Creeled Incorporated
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Emerson, David T., Hussell, Christopher P., Joo, Sung Chul
• Primary Examiner(s): POTTER, ROY KARL
• Application Number:
  US13/019,812
• Publication Number:
  US 20110186873A1
• Time in Patent Office: 1,350 Days
• Field of Search: 257/99, 257/791, 257/666, 295/921
• US Class Current: 257/88
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12032 Schottky diode
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 33/48 characterised by the semiconductor body packages
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements

Abstract

Packages, systems and methods for light emitting devices are disclosed. An LED package in one aspect can be of various sizes and configurations and can include one or more LEDs of a size smaller than those typically provided. The LED package or packages can for example be used for backlighting or other lighting fixtures. Optimized materials and techniques can be used for the LED packages to provide energy efficiency and long lifetime.

Claims

1. A light emitting device package, the package comprising:

a package body comprising a package area; and

at least one light emitting diode (LED) disposed within the package body, wherein the at least one LED comprises a length of less than approximately 550 micrometers (μ

m);

wherein the at least one LED occupies an area approximately equal to 2 percent (%) or less of the package area.

2. The package of claim 1, wherein the package body comprises a package thickness of approximately 0.86 millimeters (mm).

3. The package of claim 1, wherein the package body comprises a cavity provided therein, and wherein the cavity comprises a cavity depth of approximately 0.36 millimeters (mm).

4. The package of claim 1, wherein the package comprises an electrically isolated heat transfer material.

5. The package of claim 4, wherein the heat transfer material comprises a thickness of approximately 0.5 millimeters (mm).

6. The package of claim 1, wherein the package comprises a cavity provided between one or more walls of the package body, and wherein the cavity comprises a cavity floor, and the at least one LED occupies an area less than or equal to approximately 6.5% of an area of the cavity floor.

7. The package of claim 1, wherein the package body comprises a package length of approximately 6 millimeters (mm) and a package width of approximately 3 millimeters (mm).

8. The package of claim 1, wherein the package body comprises a package length of approximately 7 millimeters (mm) and a package width of approximately 2 millimeters (mm).

9. The package of claim 1, wherein the at least one LED comprises a width of less than approximately 700 micrometers (μ

m).

10. The package of claim 1, wherein the at least one LED comprises a length of approximately 520 micrometers (μ

m) and a width of approximately 700 micrometers (μ

m).

11. The package of claim 1, wherein the at least one LED comprises a length of approximately 500 micrometers (μ

m) and a width of approximately 500 micrometers (μ

m).

12. The package of claim 1, wherein the at least one LED comprises a length of approximately 430 micrometers (μ

m) and a width of approximately 580 micrometers (μ

m).

13. The package of claim 1, wherein the package body comprises an upper surface disposed outside of a reflector cavity, the upper surface comprising a length of approximately 0.15 millimeters (mm).

14. The package of claim 1, wherein the at least one LED is mounted in the package body using flux-eutectic, non-eutectic, or thermal compression die attach.

15. The package of claim 1, wherein the package body comprises plastic.

16. The package of claim 1, wherein the package comprises two LEDs.

17. The package of claim 16, wherein the two LEDs are electrically connected in series.

18. The package of claim 16, wherein the two LEDs are electrically connected in parallel.

19. The package of claim 1, wherein the package body comprises a cavity, and wherein the cavity comprises a cavity angle of approximately 135°

or more.

20. The package of claim 1, wherein the package body comprises a cavity, and wherein the cavity comprises a cavity angle of approximately 128°

or more.

21. The package of claim 1, wherein the package body comprises a cavity, and wherein the cavity comprises a cavity angle of approximately 118°

or more.

22. The package of claim 1, wherein the package is ENERGY STAR®

compliant.

23. A light emitting device package, the package comprising:

a package body comprising a cavity disposed between an upper surface of the package body and a cavity floor, the cavity floor comprising an area; and

at least one light emitting diode (LED) disposed within the package body;

wherein the at least one LED occupies an area less than or equal to approximately 6.5 percent (%) of the area of the cavity floor; and

wherein the cavity comprises a cavity angle of approximately 118°

or more.

24. The package of claim 23, wherein the package body comprises a package thickness of approximately 0.86 millimeters (mm).

25. The package of claim 23, wherein the cavity depth of approximately 0.36 millimeters (mm).

26. The package of claim 23, wherein the package comprises an electrically isolated heat transfer material.

27. The package of claim 23, wherein the heat transfer material comprises a thickness of approximately 0.5 millimeters (mm).

28. The package of claim 23, wherein the package body comprises a package length of approximately 6 mm and a package width of approximately 3 millimeters (mm).

29. The package of claim 23, wherein the package body comprises a package length of approximately 7 millimeters (mm) and a package width of approximately 2 millimeters (mm).

30. The package of claim 23, wherein the at least one LED comprises a length of less than approximately 550 micrometers (μ

m).

31. The package of claim 23, wherein the at least one LED comprises a width of less than approximately 700 micrometers (μ

m).

32. The package of claim 23, wherein the at least one LED comprises a length of approximately 520 micrometers (μ

m) and a width of approximately 700 micrometers (μ

m).

33. The package of claim 23, wherein the at least one LED comprises a length of approximately 500 micrometers (μ

m) and a width of approximately 500 micrometers (μ

m).

34. The package of claim 23, wherein the at least one LED comprises a length of approximately 430 micrometers (μ

m) and a width of approximately 580 micrometers (μ

m).

35. The package of claim 23, wherein the package body comprises an upper surface disposed outside of a reflector cavity, the upper surface comprising a length of approximately 0.15 millimeters (mm).

36. The package of claim 23, wherein the at least one LED is mounted in the package body using flux-eutectic, non-eutectic, or thermal compression die attach.

37. The package of claim 23, wherein the package body comprises plastic.

38. The package of claim 23, wherein the package comprises two LEDs.

39. The package of claim 38, wherein the two LEDs are electrically connected in series.

40. The package of claim 38, wherein the two LEDs are electrically connected in parallel.

41. The package of claim 23, wherein the cavity comprises a cavity angle of approximately 135°

or more.

42. The package of claim 23, wherein the cavity comprises a cavity angle of approximately 128°

or more.

43. The package of claim 23, wherein the package is ENERGY STAR®

compliant.

44. A light emitting device package, the package comprising:

a package body comprising a cavity;

a heat transfer material electrically isolated from at least one electrical element;

at least one light emitting diode (LED) disposed over the heat transfer material; and

wherein the cavity comprises a cavity depth of less than approximately 0.36 millimeters (mm) and a cavity angle of approximately 135°

or more.

45. The light emitting device package of claim 44, wherein the package comprises a package thickness of less than approximately 0.9 millimeters (mm).

46. The light emitting device package of claim 44, wherein the package is disposed in a panel display system.

47. The light emitting device package of claim 44, wherein the package is disposed in backlighting panel display systems.

48. The light emitting device package of claim 44, wherein the package body comprises plastic.

49. The light emitting device package of claim 44, wherein the package length comprises at least approximately 6 millimeters (mm) and the package width comprises at least approximately 3 millimeters (mm).

50. The light emitting device package of claim 44, wherein the package length comprises at least approximately 7 millimeters (mm) and the package width comprises at least approximately 2 millimeters (mm).

51. A light emitting device package, the package comprising:

a package body comprising a package length and a package width, where the package length is different from the package width;

at least one light emitting diode (LED) disposed in the package body; and

wherein the package body comprises a package thickness of less than approximately 0.89 millimeters (mm).

52. The light emitting device package of claim 51, wherein the package thickness comprises approximately 0.86 millimeters (mm).

53. The light emitting device package of claim 51, wherein the package is ENERGY STAR®

compliant.

54. A display panel system comprising:

a panel;

at least one light emitting diode (LED) package for providing light to the panel, the at least one LED package comprising;

a body comprising a package length and a package width, where the package length is different from the package width;

at least one light emitting diode (LED) disposed in the body; and

wherein the package body comprises a package thickness of less than approximately 0.89 millimeters (mm).

55. The display system of claim 54, wherein the LED package directly backlights the panel.

56. The display panel system of claim 54, wherein the LED package is configured to illuminate the side edge of the panel.

57. The display panel system of claim 54, wherein the system is ENERGY STAR®

compliant.

77. The method of claim 57, wherein the cavity comprises a cavity angle of approximately 135°

or more.

58. A display panel system comprising:

a panel; and

at least one light emitting diode (LED) package for providing light to the panel, the at least one LED package comprising;

a package body comprising a package area; and

at least one light emitting diode (LED) disposed within the package body;

wherein the at least one LED occupies an area approximately equal to 2 percent (%) or less of the package area; and

wherein the system is ENERGY STAR®

compliant.

59. A method of fabricating a light emitting device package, the method comprising:

providing a package body comprising a package area;

providing at least one light emitting diode (LED); and

disposing the at least one LED within the package body where the at least one LED occupies an area approximately equal to 2 percent (%) or less of the package area;

wherein the at least one LED comprises a length of less than approximately 550 micrometers (μ

m).

60. The method of claim 59, wherein the package body comprises a package thickness of approximately 0.86 millimeters (mm).

61. The method of claim 59, wherein the package body comprises a cavity having a depth of approximately 0.36 millimeters (mm).

62. The method of claim 59, wherein the package comprises an electrically isolated heat transfer material.

63. The method of claim 59, wherein the heat transfer material comprises a thickness of approximately 0.5 millimeters (mm).

64. The method of claim 59, wherein the package comprises a cavity floor, and the at least one LED occupies an area less than or equal to approximately 6.5% of an area of the cavity floor.

65. The method of claim 59, wherein the package body comprises a package length of approximately 6 millimeters (mm) and a package width of approximately 3 millimeters (mm).

66. The method of claim 59, wherein the package body comprises a package length of approximately 7 millimeters (mm) and a package width of approximately 2 millimeters (mm).

67. The method of claim 59, wherein the at least one LED comprises a width of less than approximately 700 micrometers (μ

m).

68. The method of claim 59, wherein the at least one LED comprises a length of approximately 520 micrometers (μ

m) and a width of approximately 700 micrometers (μ

m).

69. The method of claim 59, wherein the at least one LED comprises a length of approximately 500 micrometers (μ

m) and a width of approximately 500 micrometers (μ

m).

70. The method of claim 59, wherein the at least one LED comprises a length of approximately 430 micrometers (μ

m) and a width of approximately 580 micrometers (μ

m).

71. The method of claim 59, wherein the package body comprises an upper surface disposed outside of a reflector cavity, the upper surface comprising a length of approximately 0.15 millimeters (mm).

72. The method of claim 59, wherein the at least one LED is mounted in the package body using flux-eutectic, non-eutectic, or thermal compression die attach.

73. The method of claim 59, wherein the package body comprises plastic.

74. The method of claim 59, wherein the package comprises two LEDs.

75. The method of claim 74, wherein the two LEDs are electrically connected in series.

76. The method of claim 74, wherein the two LEDs are electrically connected in parallel.

78. The method of claim 59, wherein the cavity comprises a cavity angle of approximately 128°

or more.

79. The method of claim 59, wherein the cavity comprises a cavity angle of approximately 118°

or more.

80. The method of claim 59, wherein the light emitting device package is ENERGY STAR®

compliant.