Semiconductor light-emitting device, manufacturing method for the same and vehicle headlight

• US 8,860,061 B2
• Filed: 01/22/2013
• Issued: 10/14/2014
• Est. Priority Date: 01/23/2012
• Status: Active Grant

• Current Assignee: Stanley Electric Company Limited
• Original Assignee: Stanley Electric Company Limited
• Inventors: Kotani, Hiroshi
• Primary Examiner(s): Thomas, Tom
• Assistant Examiner(s): BODNAR, JOHN A
• Application Number:
  US13/747,247
• Publication Number:
  US 20130188381A1
• Time in Patent Office: 630 Days
• Field of Search: 257/88, 257/98, 257/E33.061
• US Class Current: 257/98
• CPC Class Codes: B60Q 1/04 the devices being headlights
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/58 Optical field-shaping elements

Abstract

A semiconductor light-emitting device, a method for manufacturing the same and a vehicle headlight can include the light-emitting device, which is composed of a light-emitting structure including a transparent plate, at least one semiconductor light-emitting chip and a wavelength converting layer between the transparent plate and the light-emitting chip to emit various colored lights including white light. The light-emitting device can also include a mounting board mounting the light-emitting structure and a frame thereon, a reflective material disposed between the frame and the light-emitting structure and the transparent material located on the reflective material to prevent an occurrence of oil-bleeding phenomenon. Thus, the disclosed subject matter can provide the light-emitting device having a high reliability for the vehicle headlight and the like, which can be maintained at a high quality even when they have been used for a long time under harsh conditions, and methods of manufacturing such devices.

Claims

1. A semiconductor light-emitting device comprising:

a mounting board having a mounting surface;

a sub mount board having a mount surface and a conductor pattern located adjacent the mount surface of the sub mount board, and the sub mount board being located adjacent the mounting surface of the mounting board;

at least one semiconductor light-emitting chip having a top surface, a side surface and a bottom surface, and including chip electrodes adjacent the bottom surface, each of the chip electrodes electrically connected to a respective portion of the conductor pattern of the sub mount board via solder bumps;

a transparent plate having a top surface, a side surface, a bottom surface and an edge portion located between the top surface and the side surface, the transparent plate being located over the top surface of the at least one semiconductor light-emitting chip so that the bottom surface of the transparent plate covers the top surface of the at least one semiconductor light-emitting chip;

a wavelength converting layer having a side surface and including at least one phosphor, the wavelength converting layer disposed between the bottom surface of the transparent plate and the side surface of the at least one semiconductor light-emitting chip so that the side surface of the wavelength converting layer extends from the side surface of the at least one semiconductor light-emitting chip toward the bottom surface of the transparent plate;

a frame located adjacent the mounting surface of the mounting board so as to surround the sub mount board, the at least one semiconductor light-emitting chip, the wavelength converting layer and the transparent plate;

a reflective material having a top surface, a side surface and an end of the top surface, the top surface of the reflective material including at least one of a concave shape and a planer shape, the side surface including an inclined surface, the reflective material disposed at least between the frame and both a part of the side surface of the transparent plate and the side surface of the wavelength converting layer and between the bottom surface of the at least one semiconductor light-emitting chip and the mount surface of the sub mount board while surrounding the solder bumps, the inclined surface of the side surface of the reflective material contacting with the side surface of the wavelength converting layer and extending from the side surface of the at least one semiconductor light-emitting chip toward the bottom surface of the transparent plate, the end of the top surface of the reflective material contacting with the side surface of the transparent plate, and the reflective material having a hardness and configured as a resin including a reflective substance filler; and

a transparent material having a top surface, an end of the top surface, a side surface, a bottom surface and a hardness different from the hardness of the reflective material, the transparent material disposed on the top surface of the reflective material so as to cover the whole top surface of the reflective material while the end of the top surface of the transparent material contacts with the side surface of the transparent plate, and the transparent material being configured as a resin including substantially no reflective substance filler.

3. The semiconductor light-emitting device according to claim 1, wherein the side surface of the transparent plate is composed of a first side surface adjacent the top surface of the transparent plate and a second side surface adjacent the bottom surface of the transparent plate, the end of the top surface of the reflective material contacts with the second side surface of the transparent plate, and the end of the top surface of the transparent material contacts with the first side surface of the transparent plate.

5. The semiconductor light-emitting device according to claim 1, wherein the side surface of the transparent plate includes at least one of a concave portion and a convex portion, the side surface of the transparent material contacts with the at least one of the concave portion and the convex portion, and the top surface of the reflective material contacts with the bottom surface of the transparent material and the side surface of the transparent plate.

7. The semiconductor light-emitting device according to claim 1, wherein the hardness of the reflective material is larger than the hardness of the transparent material.

9. The semiconductor light-emitting device according to claim 1, wherein the at least one semiconductor light-emitting chip and the at least one phosphor are one combination of

the at least one semiconductor light-emitting chip is a blue light-emitting chip and the at least one phosphor of the wavelength converting layer is selected from the group consisting of a yellow phosphor, and two phosphors including a red phosphor layer and a green phosphor layer, and

the at least one semiconductor light-emitting chip is an ultraviolet light-emitting chip and the at least one phosphor of the wavelength converting layer includes at least one of a red phosphor layer, a green phosphor layer and a blue phosphor.

11. A vehicle headlight including the semiconductor light-emitting device according to claim 9, further comprising:

a housing;

at least one parabolic reflector having a central axis, an opening and a focus located on the central axis, and located adjacent the housing, and the focus of the parabolic reflector being located substantially at the semiconductor light-emitting device so that an optical axis of the semiconductor light-emitting device intersects with the central axis of the parabolic reflector; and

an outer lens being located in front of the opening of the parabolic reflector so as to cover the opening of the parabolic reflector.

13. A vehicle headlight including the semiconductor light-emitting device according to claim 9, further comprising:

a housing;

at least one ellipsoidal reflector having a central axis, a first focus and a second focus located substantially on the central axis, and the reflector located adjacent the housing, the first focus of the ellipsoidal reflector being located substantially at the semiconductor light-emitting device so that an optical axis of the semiconductor light-emitting device intersects with the central axis of the ellipsoidal reflector;

a projector lens having an optical axis and at least one focus located toward the ellipsoidal reflector on the optical axis, the optical axis of the projector lens corresponding substantially to the central axis of the ellipsoidal reflector, and the focus of the projector lens being located substantially at the second focus of the ellipsoidal reflector; and

a shade having a top surface located between the projector lens and the ellipsoidal reflector, and the top surface of the shade being located substantially at the second focus of the ellipsoidal reflector.

15. A vehicle headlight including the semiconductor light-emitting device according to claim 9, further comprising:

a projector lens having an optical axis and at least one focus located on the optical axis, the optical axis substantially corresponding to an optical axis of the semiconductor light-emitting device, and the focus of the projector lens being located substantially at the semiconductor light-emitting device.

17. A method for manufacturing the semiconductor light-emitting device according to claim 1, comprising:

providing the mounting board, in which the sub mount board includes the at least one semiconductor light-emitting device mounted thereon, the wavelength converting layer and the transparent plate are located on the mounting board and the frame is also located on the mounting board so as to surround the sub mount board;

disposing an uncured reflective material having the filler between the frame and the side surfaces of the at least one semiconductor light-emitting device, the wavelength converting layer and the transparent plate; and

disposing an uncured transparent material on the top surface of the reflective material layer.

18. A method for manufacturing the semiconductor light-emitting device according to claim 1, comprising:

providing the mounting board, in which the sub mount board includes the at least one semiconductor light-emitting device mounted thereon, the wavelength converting layer and the transparent plate are located on the mounting board and the frame is also located on the mounting board so as to surround the sub mount board;

disposing an uncured reflective material having the filler between the frame and the side surfaces of the at least one semiconductor light-emitting device, the wavelength converting layer and the transparent plate; and

precipitating the filler in the uncured reflective material.

2. A semiconductor light-emitting device comprising:

a sub mount board having a mount surface and a conductor pattern located adjacent the mount surface;

at least one semiconductor light-emitting chip having a top surface, a side surface and a bottom surface, and including chip electrodes adjacent the bottom surface, each of the chip electrodes electrically connected to a respective portion of the conductor pattern of the sub mount board via solder bumps;

a transparent plate having a top surface, a side surface, a bottom surface and an edge portion located between the top surface and the side surface, the transparent plate being located over the top surface of the at least one semiconductor light-emitting chip so that the bottom surface of the transparent plate covers the top surface of the at least one semiconductor light-emitting chip;

a wavelength converting layer having a side surface and including at least one phosphor, the wavelength converting layer disposed between the bottom surface of the transparent plate and the side surface of the at least one semiconductor light-emitting chip so that the side surface of the wavelength converting layer extends from the side surface of the at least one semiconductor light-emitting chip toward the bottom surface of the transparent plate;

a frame located adjacent the mount surface of the sub mount board so as to surround the at least one semiconductor light-emitting chip, the wavelength converting layer and the transparent plate;

a reflective material having a top surface, a side surface and an end of the top surface, the top surface of the reflective material including at least one of a concave shape and a planer shape, the side surface including an inclined surface, the reflective material disposed at least between the frame and both a part of the side surface of the transparent plate and the side surface of the wavelength converting layer and between the bottom surface of the at least one semiconductor light-emitting chip and the mount surface of the sub mount board while surrounding the solder bumps, the inclined surface of the side surface of the reflective material contacting with the side surface of the wavelength converting layer and extending from the side surface of the at least one semiconductor light-emitting chip toward the bottom surface of the transparent plate, the end of the top surface of the reflective material contacting with the side surface of the transparent plate, and the reflective material having a hardness and configured as a resin including a reflective substance filler; and

a transparent material having a top surface, an end of the top surface, a side surface, a bottom surface and a hardness different from the hardness of the reflective material, and disposed on the top surface of the reflective material so as to cover the whole top surface of the reflective material while the end of the top surface of the transparent material contacts with the side surface of the transparent plate, and the transparent material being configured as a resin including substantially no reflective substance filler.

4. The semiconductor light-emitting device according to claim 2, wherein the side surface of the transparent plate is composed of a first side surface adjacent the top surface of the transparent plate and a second side surface adjacent the bottom surface of the transparent plate, the end of the top surface of the reflective material contacts with the second side surface of the transparent plate, and the end of the top surface of the transparent material contacts with the first side surface of the transparent plate.

6. The semiconductor light-emitting device according to claim 2, wherein the side surface of the transparent plate includes at least one of a concave portion and a convex portion, the side surface of the transparent material contacts with the at least one of the concave portion and the convex portion, and the top surface of the reflective material contacts with the bottom surface of the transparent material and the side surface of the transparent plate.

8. The semiconductor light-emitting device according to claim 2, wherein the hardness of the reflective material is larger than the hardness of the transparent material.

10. The semiconductor light-emitting device according to claim 2, wherein the at least one semiconductor light-emitting chip and the at least one phosphor are one combination of

the at least one semiconductor light-emitting chip is a blue light-emitting chip and the at least one phosphor of the wavelength converting layer is selected from the group consisting of a yellow phosphor, and two phosphors including a red phosphor layer and a green phosphor layer, and

the at least one semiconductor light-emitting chip is an ultraviolet light-emitting chip and the at least one phosphor of the wavelength converting layer includes at least one of a red phosphor layer, a green phosphor layer and a blue phosphor.

12. A vehicle headlight including the semiconductor light-emitting device according to claim 10, further comprising:

a housing;

at least one parabolic reflector having a central axis, an opening and a focus located on the central axis, and located adjacent the housing, and the focus of the parabolic reflector being located substantially at the semiconductor light-emitting device so that an optical axis of the semiconductor light-emitting device intersects with the central axis of the parabolic reflector; and

an outer lens being located in front of the opening of the parabolic reflector so as to cover the opening of the parabolic reflector.

14. A vehicle headlight including the semiconductor light-emitting device according to claim 10, further comprising:

a housing;

at least one ellipsoidal reflector having a central axis, a first focus and a second focus located substantially on the central axis, and the reflector located adjacent the housing, the first focus of the ellipsoidal reflector being located substantially at the semiconductor light-emitting device so that an optical axis of the semiconductor light-emitting device intersects with the central axis of the ellipsoidal reflector;

a projector lens having an optical axis and at least one focus located toward the ellipsoidal reflector on the optical axis, the optical axis of the projector lens substantially corresponding to the central axis of the ellipsoidal reflector, and the focus of the projector lens being located substantially at the second focus of the ellipsoidal reflector; and

a shade having a top surface located between the projector lens and the ellipsoidal reflector, and the top surface of the shade being located substantially at the second focus of the ellipsoidal reflector.

16. A vehicle headlight including the semiconductor light-emitting device according to claim 10, further comprising:

a projector lens having an optical axis and at least one focus located on the optical axis, the optical axis substantially corresponding to an optical axis of the semiconductor light-emitting device, and the focus of the projector lens being located substantially at the semiconductor light-emitting device.

19. A method for manufacturing the semiconductor light-emitting device according to claim 2, comprising:

providing the sub mount board, adjacent which the at least one semiconductor light-emitting device, the wavelength converting layer, and the transparent plate are located, and the frame is mounted on the sub mount board so as to surround the at least one semiconductor light-emitting chip;

disposing an uncured reflective material having the filler between the frame and the side surfaces of the at least one semiconductor light-emitting device, the wavelength converting layer and the transparent plate; and

disposing an uncured transparent material on the top surface of the reflective material.

20. A method for manufacturing the semiconductor light-emitting device according to claim 2, comprising:

providing the sub mount board, adjacent which the at least one semiconductor light-emitting device, the wavelength converting layer, and the transparent plate are located, and the frame is mounted on the sub mount board so as to surround the at least one semiconductor light-emitting chip;

disposing an uncured reflective material having the filler between the frame and the side surfaces of the at least one semiconductor light-emitting device, the wavelength converting layer and the transparent plate; and

precipitating the filler in the uncured reflective material.