Structure and method for a fishbone differential capacitor
First Claim
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1. An integrated circuit, comprising:
- a substrate having a surface that is defined by a first axis and a second axis perpendicular to the first axis; and
a capacitor structure disposed on the substrate, wherein the capacitor structure includes;
a first conductive component,a second conductive component and a third conductive component symmetrically configured on opposite sides of the first conductive component, wherein the first, second, and third conductive components are separated from each other by a respective dielectric material,a first conductive shielding feature electrically connected to the first conductive component, anda second conductive shielding feature electrically connected to the second conductive component.
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Abstract
The present disclosure provides an integrated circuit. The integrated circuit includes a substrate having a surface that is defined by a first axis and a second axis perpendicular to the first axis; and a capacitor structure disposed on the substrate. The capacitor structure includes a first conductive component; a second conductive component and a third conductive component symmetrically configured on opposite sides of the first conductive component. The first, second and third conductive components are separated from each other by respective dielectric material.
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Citations
17 Claims
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1. An integrated circuit, comprising:
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a substrate having a surface that is defined by a first axis and a second axis perpendicular to the first axis; and a capacitor structure disposed on the substrate, wherein the capacitor structure includes; a first conductive component, a second conductive component and a third conductive component symmetrically configured on opposite sides of the first conductive component, wherein the first, second, and third conductive components are separated from each other by a respective dielectric material, a first conductive shielding feature electrically connected to the first conductive component, and a second conductive shielding feature electrically connected to the second conductive component. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A semiconductor structure, comprising:
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a substrate having a surface that is defined by a first axis and a second axis perpendicular to the first axis, wherein the substrate includes a first region, a second region, and a third region, wherein the first region is interposed between the second and third regions; and a differential capacitor disposed on the substrate, wherein the differential capacitor includes; a first conductive component having a first stem feature that is disposed in the first region, a second conductive component disposed in the second region; a third conductive component disposed in the third region, wherein the second and third conductive components are symmetrically designed and symmetrically configured on opposite sides of the first conductive component; a first conductive shielding feature electrically connected to the first conductive component; and a second conductive shielding feature disposed in the third region and electrically connected to the third conductive component. - View Dependent Claims (13, 14, 15, 16, 17)
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Specification