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Apparatus and method for increasing the quantity of discrete electronic components in an integrated circuit package

  • US 8,860,195 B2
  • Filed: 08/03/2009
  • Issued: 10/14/2014
  • Est. Priority Date: 12/15/2005
  • Status: Active Grant
First Claim
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1. An electronic package comprising:

  • a package substrate including a top surface;

    an integrated circuit die attached to the top surface of the package substrate, the integrated circuit die including a device substrate having a first and second surface, the first surface facing the top surface of the package substrate and having a passivation layer formed thereon;

    a metal layer formed directly on the second surface of the device substrate;

    a first structure formed on the metal layer;

    a first electronic component attached to the first structurea second structure formed on the metal layer;

    a second electronic component attached to the second structure and coupled to the top surface of the package substrate by a wirebond; and

    a third structure formed on the metal layer, the third structure electrically coupled to at least one of the first and second electronic components.

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