Multiple contact test probe

• US 8,860,446 B2
• Filed: 05/24/2012
• Issued: 10/14/2014
• Est. Priority Date: 05/24/2012
• Status: Active Grant

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Miyazaki, Hiroshi
• Primary Examiner(s): Baldridge, Benjamin M
• Application Number:
  US13/479,579
• Publication Number:
  US 20130314114A1
• Time in Patent Office: 873 Days
• Field of Search: 324/754.03
• US Class Current: 324/754.03
• CPC Class Codes: G01R 1/06716 Elastic
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor

Abstract

A probe apparatus may include a plurality of probe pins attached to a probe head portion. Each of the probe pins may be independently movable relative to the probe head portion.

Claims

1. A probe device for testing a land on an electronic device during a testing process, said probe device comprising:

a probe head portion;

a probe pin assembly attached to said probe head portion having a first probe pin and a second probe pin,

the first probe pin having a contact surface adapted to contact said land;

the second probe pin having a contact surface adapted to contact said land;

wherein, said probe head portion is movable in a first direction to bring said first probe pin and second probe pin into contact with said land and in an opposite second direction in order to move said first probe pin and said second probe pin away from said land; and

wherein said first probe pin is movable relative to said second probe pin.

2. The probe device of claim 1 and further wherein:

said first probe pin is movable in said first direction and said second direction independently of said probe head portion and said second probe pin.

3. The probe device of claim 2 and further wherein:

said first probe pin is biased in said first direction relative to said probe head portion.

4. The probe device of claim 3 and further wherein:

said first probe pin is biased in said first direction relative to said probe head portion by a spring portion comprising a bent wire.

5. The probe device of claim 3 and further wherein:

said first probe pin is biased in said first direction relative to said probe head portion by a spring portion comprising a compression spring.

6. The probe device of claim 1 and further wherein:

said first probe pin and said second probe pin are formed from a unitary portion of wire.

7. The probe device of claim 6 and further wherein:

said unitary portion of wire comprises a first spring portion adapted to bias said first probe pin in said first direction relative to said probe head portion and a second spring portion adapted to bias said second probe pin in said first direction relative to said probe head portion.

8. A probe apparatus for testing a plurality of lands on an electronic device during a testing process, said probe apparatus comprising:

a plurality of probe devices attached to a probe head, each of said probe devices adapted to contact one of said plurality of lands; and

wherein, each of said probe devices comprises;

a probe head portion;

a probe pin assembly attached to said probe head portion, having a first probe pin having a contact surface adapted to contact said land; and

a second probe pin having a contact surface adapted to contact said land;

wherein, said probe head is movable in a first direction to bring said first probe pin and second probe pin into contact with said land and in an opposite second direction in order to move said first probe pin and said second probe pin away from said land; and

wherein said first probe pin is movable relative to said second probe pin.

9. The probe apparatus of claim 8 and further wherein:

said first probe pin is movable in said first direction and said second direction independently of said probe head portion and said second probe pin.

10. The probe apparatus of claim 9 and further wherein:

said first probe pin is biased in said first direction relative to said probe head portion.

11. The probe apparatus of claim 10 and further wherein:

said first probe pin is biased in said first direction relative to said probe head portion by a spring portion comprising a bent wire.

12. The probe apparatus of claim 10 and further wherein:

said first probe pin is biased in said first direction relative to said probe head portion by a spring portion comprising a compression spring.

13. The probe apparatus of claim 8 and further wherein:

said first probe pin and said second probe pin are formed from a unitary portion of wire.

14. The probe device of claim 13 and further wherein:

said unitary portion of wire comprises a first spring portion adapted to bias said first probe pin in said first direction relative to said probe head portion and a second spring portion adapted to bias said second probe pin in said first direction relative to said probe head portion.

15. A method of testing a land on an electronic device during a testing process, said method comprising:

providing a probe pin assembly having;

a first probe pin having a contact surface adapted to contact said land;

a second probe pin having a contact surface adapted to contact said land;

initiating movement of said first probe pin and said second probe pin in a first direction toward said land;

contacting a contaminant located within said land with said contact surface of said first probe pin, thereby halting movement of said first probe pin;

continuing movement of said second probe pin in said first direction after movement of said first probe pin has halted.

16. The method of claim 15 and further wherein:

said continuing movement of said second probe pin proceeds until said contact surface of said second probe pin contacts said land.

17. The method of claim 15 and further wherein:

said first probe pin and said second probe pin are attached to a probe head portion; and

said first probe pin is biased in said first direction relative to said probe head portion.

18. The probe device of claim 17 and further wherein:

said first probe pin is biased in said first direction relative to said probe head portion by a spring portion comprising a bent wire.

19. The probe device of claim 17 and further wherein:

said first probe pin is biased in said first direction relative to said probe head portion by a spring portion comprising a compression spring.

20. The probe device of claim 15 and further wherein:

said first probe pin and said second probe pin are formed from a unitary portion of wire.