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System using multi-layer wire structure for high efficiency wireless communication

  • US 8,860,545 B2
  • Filed: 09/15/2011
  • Issued: 10/14/2014
  • Est. Priority Date: 03/09/2009
  • Status: Active Grant
First Claim
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1. A system of wire structures, the system comprising:

  • a) a first wire structure comprising;

    i) a plurality of first conductors, each first conductor having a first conductor length, a first conductor height, a first conductor depth, and a first skin depth;

    ii) a first plurality of insulators, each insulator positioned between each of the plurality of first conductors; and

    iii) wherein the plurality of first conductors and first insulators are arranged to form the first wire structure having a first wire structure length, a first wire structure width and a first wire structure depth;

    b) a second wire structure comprising;

    i) a plurality of second conductors, each second conductor having a second conductor length, a second conductor height, a second conductor depth, and a second skin depth;

    ii) a second plurality of insulators, each insulator positioned between each of the plurality of second conductors; and

    iii) wherein the plurality of second conductors and second insulators are arranged to form the second wire structure having a second wire structure length, a second wire structure width and a second wire structure depth; and

    c) wherein a first electrical signal is propagatable through the first wire structure and the first skin depth, and a second electrical signal is inducible through the second wire structure, the second electrical signal being propagatable through the second skin depth.

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